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W966K6HBGX7I

动态随机存取存储器 32M pSRAM x16, ADP, 133MHz, Ind temp

器件类别:半导体    存储器 IC    动态随机存取存储器   

厂商名称:Winbond(华邦电子)

厂商官网:http://www.winbond.com.tw

器件标准:

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器件参数
参数名称
属性值
厂商名称
Winbond(华邦电子)
产品种类
动态随机存取存储器
类型
PSRAM (Psuedo SRAM)
数据总线宽度
16 bit
组织
2 M x 16
封装 / 箱体
VFBGA-54
存储容量
32 Mbit
最大时钟频率
133 MHz
电源电压-最大
1.95 V
电源电压-最小
1.7 V
电源电流—最大值
40 mA
最小工作温度
- 40 C
最大工作温度
+ 85 C
系列
W966K6HB
封装
Tray
安装风格
SMD/SMT
工厂包装数量
480
文档预览
W966K6HB
32Mb Async./Page,Syn./Burst CellularRAM
TABLE OF CONTENTS
1. GENERAL DESCRIPTION ........................................................................................................ 4
2. FEATURES ................................................................................................................................ 4
3. ORDERING INFORMATION ..................................................................................................... 4
4. PIN CONFIGURATION .............................................................................................................. 5
4.1 Ball Assignment................................................................................................................................. 5
5. PIN DESCRIPTION.................................................................................................................... 6
5.1 Signal Description ............................................................................................................................. 6
6. BLOCK DIAGRAM .................................................................................................................... 7
6.1 Block Diagram ................................................................................................................................... 7
6.2 CellularRAM - Interface Configuration Options .................................................................................. 8
7. INSTRUCTION SET................................................................................................................... 9
7.1 Bus Operation ................................................................................................................................... 9
8. FUNCTIONAL DESCRIPTION ................................................................................................ 10
8.1 Power Up Initialization ..................................................................................................................... 10
8.1.1 Power-Up Initialization Timing ...................................................................................................................... 10
8.2 Bus Operating Modes ...................................................................................................................... 10
8.2.1 Asynchronous Modes ................................................................................................................................... 10
8.2.1.1 READ Operation(ADV# LOW) .................................................................................................................................11
8.2.1.2 WRITE Operation (ADV# LOW) ...............................................................................................................................11
8.2.2 Page Mode READ Operation ....................................................................................................................... 12
8.2.2.1 Page Mode READ Operation (ADV# LOW) .............................................................................................................12
8.2.3 BURST Mode Operation .............................................................................................................................. 12
8.2.3.1 Burst Mode READ (4-word burst) ............................................................................................................................13
8.2.3.2 Burst Mode WRITE (4-word burst) ...........................................................................................................................14
8.2.3.3 Refresh Collision During Variable-Latency READ Operation ...................................................................................15
8.2.4 Mixed-Mode Operation ................................................................................................................................. 16
8.2.4.1 WAIT Operation .......................................................................................................................................................16
8.2.4.2 Wired-OR WAIT Configuration .................................................................................................................................16
8.2.5 LB#/ UB# Operation ..................................................................................................................................... 17
8.3 Low Power Operation ...................................................................................................................... 17
8.3.1 Standby Mode Operation ............................................................................................................................. 17
8.3.2 Temperature Compensated Refresh ............................................................................................................ 17
8.3.3 Partial Array Refresh .................................................................................................................................... 17
8.3.4 Deep Power-Down Operation ...................................................................................................................... 17
8.4 Registers ......................................................................................................................................... 18
8.4.1 Access Using CRE ....................................................................................................................................... 18
8.4.1.1 Configuration Register WRITE, Asynchronous Mode Followed by READ ARRAY Operation .................................18
8.4.1.2 Configuration Register WRITE
CE# control .......................................................................................................19
8.4.1.3 Configuration Register WRITE, Synchronous Mode Followed by READ ARRAY Operation ...................................20
8.4.1.4 Register READ, Asynchronous Mode Followed by READ ARRAY Operation .........................................................21
8.4.1.5 Register READ, Synchronous Mode Followed by READ ARRAY Operation ...........................................................22
8.4.2 Software Access ........................................................................................................................................... 23
8.4.2.1 Load Configuration Register ....................................................................................................................................23
8.4.2.2 Read Configuration Register ....................................................................................................................................24
8.4.3 Bus Configuration Register .......................................................................................................................... 24
8.4.3.1 Bus Configuration Register Definition ......................................................................................................................25
8.4.3.2 Burst Length (BCR[2:0]) Default = Continuous Burst ...............................................................................................26
8.4.3.3 Burst Wrap (BCR[3]) Default = No Wrap..................................................................................................................26
8.4.3.4 Sequence and Burst Length.....................................................................................................................................27
8.4.3.5 Drive Strength (BCR[5:4]) Default = Outputs Use Half-Drive Strength.....................................................................28
8.4.3.6 Table of Drive Strength ............................................................................................................................................28
Publication Release Date: Nov. 07, 2014
Revision: A01-002
-1-
W966K6HB
8.4.3.7 WAIT Signal in Synchronous Burst Mode ............................................................................................................28
8.4.3.8 WAIT Config. (BCR[8]) .............................................................................................................................................28
8.4.3.9 WAIT Polarity (BCR[10]) ..........................................................................................................................................28
8.4.3.10 WAIT Configuration During Burst Operation ..........................................................................................................29
8.4.3.11 WAIT Function by Configuration (WC)
Lat=2, WP=0 .......................................................................................29
8.4.3.12 Latency Counter (BCR[13:11]) ...............................................................................................................................30
8.4.3.13 Initial Access Latency (BCR[14]) ............................................................................................................................30
8.4.3.14 Allowed Latency Counter Settings in Variable Latency Mode ................................................................................30
8.4.3.15 Latency Counter (Variable Initial Latency, No Refresh Collision) ...........................................................................31
8.4.3.16 Latency Counter (Variable Initial Latency, With Refresh Collision) ........................................................................31
8.4.3.17 Allowed Latency Counter Settings in Fixed Latency Mode ....................................................................................32
8.4.3.18 Latency Counter (Fixed Latency) ...........................................................................................................................32
8.4.3.19 Burst Write Always Produces Fixed Latency..........................................................................................................33
8.4.3.20 Burst Interrupt ........................................................................................................................................................33
8.4.3.21 End-of-Row Condition ............................................................................................................................................33
8.4.3.22 Burst Termination or Burst Interrupt At the End of Row .........................................................................................33
8.4.3.23 Operating Mode (BCR[15]) ....................................................................................................................................33
8.4.4 Refresh Configuration Register .................................................................................................................... 34
8.4.4.1 Refresh Configuration Register Mapping .................................................................................................................34
8.4.4.2 Partial Array Refresh (RCR[2:0] Default = Full Array Refresh ..................................................................................34
8.4.4.3 Address Patterns for PAR (RCR[4] = 1) ...................................................................................................................35
8.4.4.4 Deep Power-Down (RCR[4]) ....................................................................................................................................35
8.4.4.5 Page Mode Operation (RCR[7]) ...............................................................................................................................35
8.4.5 Device Identification Register ....................................................................................................................... 35
8.4.5.1 Device Identification Register Mapping ....................................................................................................................35
9. ELECTRICAL CHARACTERISTIC.......................................................................................... 36
9.1 Absolute Maximum DC, AC Ratings ................................................................................................ 36
9.2 Electrical Characteristics and Operating Conditions ........................................................................ 37
9.3 Deep Power-Down Specifications.................................................................................................... 38
9.4 Partial Array Self Refresh Standby Current ..................................................................................... 38
9.5 Capacitance .................................................................................................................................... 38
9.6 AC Input-Output Reference Waveform ............................................................................................ 38
9.7 AC Output Load Circuit.................................................................................................................... 38
10. TIMING REQUIRMENTS ....................................................................................................... 39
10.1 Read, Write Timing Requirements ................................................................................................. 39
10.1.1 Asynchronous READ Cycle Timing Requirements .................................................................................... 39
10.1.2 Burst READ Cycle Timing Requirements ................................................................................................... 40
10.1.3 Asynchronous WRITE Cycle Timing Requirements ................................................................................... 41
10.1.4 Burst WRITE Cycle Timing Requirements ................................................................................................. 42
10.2 TIMING DIAGRAMS ...................................................................................................................... 43
10.2.1 Initialization Period ..................................................................................................................................... 43
10.2.2 DPD Entry and Exit Timing Parameters ..................................................................................................... 43
10.2.3 Initialization and DPD Timing Parameters ................................................................................................. 43
10.2.4 Asynchronous READ .................................................................................................................................. 44
10.2.5 Asynchronous READ Using ADV# ............................................................................................................. 45
10.2.6 Page Mode READ ...................................................................................................................................... 46
10.2.7 Single-Access Burst READ Operation-Variable Latency ........................................................................... 47
10.2.8 4-Word Burst READ Operation-Variable Latency ...................................................................................... 48
10.2.9 Single-Access Burst READ Operation-Fixed Latency................................................................................ 49
10.2.10 4-Word Burst READ Operation-Fixed Latency......................................................................................... 50
10.2.11 READ Burst Suspend ............................................................................................................................... 51
10.2.12 Burst READ at End-of-Row (Wrap Off) .................................................................................................... 52
10.2.13 Burst READ Row Boundary Crossing ...................................................................................................... 53
10.2.14 CE#-Controlled Asynchronous WRITE .................................................................................................... 54
Publication Release Date: Nov. 07, 2014
Revision: A01-002
-2-
W966K6HB
10.2.15 LB# / UB# Controlled Asynchronous WRITE ........................................................................................... 55
10.2.16 WE# - Controlled Asynchronous WRITE ................................................................................................. 56
10.2.17 Asynchronous WRITE Using ADV# ......................................................................................................... 57
10.2.18 Burst WRITE Operation-Variable Latency Mode ..................................................................................... 58
10.2.19 Burst WRITE Operation-Fixed Latency Mode .......................................................................................... 59
10.2.20 Burst WRITE at End of Row (Wrap off) .................................................................................................... 60
10.2.21 Burst WRITE Row Boundary Crossing .................................................................................................... 61
10.2.22 Burst WRITE Followed by Burst READ .................................................................................................... 62
10.2.23 Burst READ Interrupted by Burst READ or WRITE ................................................................................. 63
10.2.24 Burst WRITE Interrupted by Burst WRITE or READ–Variable Latency Mode ....................................... 64
10.2.25 Burst WRITE Interrupted by Burst WRITE or READ-Fixed Latency Mode .............................................. 65
10.2.26 Asynchronous WRITE Followed by Burst READ ..................................................................................... 66
10.2.27 Asynchronous WRITE (ADV# LOW) Followed by Burst READ ............................................................... 67
10.2.28 Burst READ Followed By Asynchronous WRITE (WE# - Controlled) ...................................................... 68
10.2.29 Burst READ Followed By Asynchronous WRITE Using ADV# ................................................................ 69
10.2.30 Asynchronous WRITE Followed by Asynchronous READ - ADV# LOW ................................................. 70
10.2.31 Asynchronous WRITE Followed by Asynchronous READ ....................................................................... 71
11. PACKAGE DESCRIPTION.................................................................................................... 72
11.1 Package Dimension....................................................................................................................... 72
12. REVISION HISTORY ............................................................................................................. 73
Publication Release Date: Nov. 07, 2014
Revision: A01-002
-3-
W966K6HB
1. GENERAL DESCRIPTION
Winbond CellularRAM™ products are high-speed, CMOS pseudo-static random access memories developed for
low-power, portable applications. The device has a DRAM core organized. These devices include an industry-
standard burst mode Flash interface that dramatically increases read/write bandwidth compared with other low-
power SRAM or Pseudo SRAM offerings.
To operate seamlessly on a burst Flash bus, CellularRAM products incorporate a transparent self refresh
mechanism. The hidden refresh requires no additional support from the system memory controller and has no
significant impact on device READ/WRITE performance.
Two user-accessible control registers define device operation. The Bus Configuration Register (BCR) defines how
the CellularRAM device interacts with the system memory bus and is nearly identical to its counterpart on burst
mode Flash devices. The Refresh Configuration Register (RCR) is used to control how refresh is performed on the
DRAM array. These registers are automatically loaded with default settings during power-up and can be updated
anytime during normal operation.
Special attention has been focused on standby current consumption during self refresh. CellularRAM products
include three mechanisms to minimize standby current. Partial array refresh (PAR) enables the system to limit
refresh to only that part of the DRAM array that contains essential data. Temperature compensated refresh (TCR)
uses an on-chip sensor to adjust the refresh rate to match the device temperature—the refresh rate decreases at
lower temperatures to minimize current consumption during standby. Deep power-down (DPD) enables the system
to halt the refresh operation altogether when no vital information is stored in the device. The system configurable
refresh mechanisms are accessed through the RCR.
This CellularRAM device is compliant with the industry-standard CellularRAM 1.5 generation feature set established
by the CellularRAM Workgroup. It includes support for both variable and fixed latency, with 3 output-device drive-
strength settings, additional wrap options, and a device ID register (DIDR).
2. FEATURES
• Supports asynchronous, page, and burst operations
• V
CC
, V
CCQ
Voltages:
1.7V–1.95V V
CC
1.7V–1.95V V
CCQ
• Random access time: 70ns
• Burst mode READ and WRITE access:
4, 8, 16, or 32 words, or continuous burst
Burst wrap or sequential
Max clock rate: 133 MHz (tCLK = 7.5ns)
• Page mode READ access:
Sixteen-word page size
Interpage READ access: 70ns
Intrapage READ access: 20ns
• Low-power features
On-chip temperature compensated refresh (TCR)
Partial array refresh (PAR)
Deep power-down (DPD) mode
• Package: 54 Ball VFBGA (6mm x8mm)
• Active current (
ICC1
) < 25mA at 85°C
• Standby current : 200µA (max) at 85°C
• Deep power-down:
Typical 10µA
•Operating temperature range:
-40°C ≤ T
CASE
≤ 85°C
3. ORDERING INFORMATION
Part Number
W966K6HBGX7I
VDD/VDDQ
1.8/1.8
I/O Width
x16
Type
54VFBGA
Others
CRAM Non-Mux,133MHz, -40°C~85°C
Publication Release Date: Nov. 07, 2014
Revision: A01-002
-4-
W966K6HB
4. PIN CONFIGURATION
4.1 Ball Assignment
1
A
B
C
D
E
F
G
H
J
2
3
4
5
6
LB#
OE#
A0
A1
A2
CRE
DQ8
UB#
A3
A4
CE#
DQ0
DQ9
DQ10
A5
A6
DQ1
DQ2
VSSQ
DQ11
A17
A7
DQ3
VCC
VCCQ
DQ12
NC
A16
DQ4
VSS
DQ14
DQ13
A14
A15
DQ5
DQ6
DQ15
A19
A12
A13
WE#
DQ7
A18
A8
A9
A10
A11
A20
WAIT
CLK
ADV#
NC
NC
NC
(Top View) Pin Configuration
Publication Release Date: Nov. 07, 2014
Revision: A01-002
-5-
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参数对比
与W966K6HBGX7I相近的元器件有:W966K6HBGX7I TR。描述及对比如下:
型号 W966K6HBGX7I W966K6HBGX7I TR
描述 动态随机存取存储器 32M pSRAM x16, ADP, 133MHz, Ind temp 动态随机存取存储器 32M pSRAM x16, ADP, 133MHz, Ind temp T&R
厂商名称 Winbond(华邦电子) Winbond(华邦电子)
产品种类 动态随机存取存储器 动态随机存取存储器
类型 PSRAM (Psuedo SRAM) PSRAM (Psuedo SRAM)
数据总线宽度 16 bit 16 bit
组织 2 M x 16 2 M x 16
封装 / 箱体 VFBGA-54 VFBGA-54
存储容量 32 Mbit 32 Mbit
最大时钟频率 133 MHz 133 MHz
电源电压-最大 1.95 V 1.95 V
电源电压-最小 1.7 V 1.7 V
电源电流—最大值 40 mA 40 mA
最小工作温度 - 40 C - 40 C
最大工作温度 + 85 C + 85 C
系列 W966K6HB W966K6HB
封装 Tray Reel
安装风格 SMD/SMT SMD/SMT
工厂包装数量 480 5000
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