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W981216BH-8H

Synchronous DRAM, 8MX16, 6ns, CMOS, PDSO54, 0.400 INCH, 0.80 MM PITCH, TSOP2-54

器件类别:存储    存储   

厂商名称:Winbond(华邦电子)

厂商官网:http://www.winbond.com.tw

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器件参数
参数名称
属性值
厂商名称
Winbond(华邦电子)
零件包装代码
TSOP2
包装说明
TSOP2, TSOP54,.46,32
针数
54
Reach Compliance Code
compliant
ECCN代码
EAR99
访问模式
FOUR BANK PAGE BURST
最长访问时间
6 ns
其他特性
AUTO/SELF REFRESH
最大时钟频率 (fCLK)
125 MHz
I/O 类型
COMMON
交错的突发长度
1,2,4,8
JESD-30 代码
R-PDSO-G54
JESD-609代码
e3
长度
22.22 mm
内存密度
134217728 bit
内存集成电路类型
SYNCHRONOUS DRAM
内存宽度
16
功能数量
1
端口数量
1
端子数量
54
字数
8388608 words
字数代码
8000000
工作模式
SYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
8MX16
输出特性
3-STATE
封装主体材料
PLASTIC/EPOXY
封装代码
TSOP2
封装等效代码
TSOP54,.46,32
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE, THIN PROFILE
电源
3.3 V
认证状态
Not Qualified
刷新周期
4096
座面最大高度
1.2 mm
自我刷新
YES
连续突发长度
1,2,4,8,FP
最大待机电流
0.001 A
最大压摆率
0.15 mA
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
3 V
标称供电电压 (Vsup)
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
MATTE TIN
端子形式
GULL WING
端子节距
0.8 mm
端子位置
DUAL
宽度
10.16 mm
文档预览
W981216BH
2M
×
4 BANKS
×
16 BIT SDRAM
GENERAL DESCRIPTION
W981216BH is a high-speed synchronous dynamic random access memory (SDRAM), organized as
2M words
×
4 banks
×
16 bits. Using pipelined architecture and 0.175
µ
m process technology,
W981216BH delivers a data bandwidth of up to 143M words per second (-7). To fully comply with the
personal computer industrial standard, W981216BH is sorted into three speed grades: -7, -75 and -
8H. The -7 is compliant to the 143 MHz/CL3 or PC133/CL2 specification, the -75 is compliant to the
PC133/CL3 specification, the -8H is compliant to the PC100/CL2 specification
Accesses to the SDRAM are burst oriented. Consecutive memory location in one page can be
accessed at a burst length of 1, 2, 4, 8 or full page when a bank and row is selected by an ACTIVE
command. Column addresses are automatically generated by the SDRAM internal counter in burst
operation. Random column read is also possible by providing its address at each clock cycle. The
multiple bank nature enables interleaving among internal banks to hide the precharging time.
By having a programmable Mode Register, the system can change burst length, latency cycle,
interleave or sequential burst to maximize its performance. W981216BH is ideal for main memory in
high performance applications.
FEATURES
3.3V
±
0.3V Power Supply
Up to 143 MHz Clock Frequency
2,097,152 Words
×
4 banks
×
16 bits organization
Auto Refresh and Self Refresh
CAS Latency: 2 and 3
Burst Length: 1, 2, 4, 8, and full page
Burst Read, Single Writes Mode
Byte Data Controlled by DQM
Power-Down Mode
Auto-precharge and Controlled Precharge
4K Refresh cycles / 64 mS
Interface: LVTTL
Packaged in TSOP II 54 pin, 400 mil - 0.80
KEY PARAMETERS
SYM.
DESCRIPTION
MIN.
/MAX.
-7
(PC133, CL2)
-75
(PC133, CL3)
-8H
(PC100)
t
CK
t
AC
t
RP
t
RCD
I
CC1
I
CC4
I
CC6
Clock Cycle Time
Access Time from CLK
Precharge to Active Command
Active to Read/Write Command
Operation Current (Single bank)
Burst Operation Current
Self-Refresh Current
Min.
Max.
Min.
Min.
Max.
Max.
Max.
7 nS
5.4 nS
15 nS
15 nS
80 mA
100 mA
2 mA
7.5 nS
5.4 nS
20 nS
20 nS
75 mA
95 mA
2 mA
8 nS
6 nS
20 nS
20 nS
70 mA
90 mA
2 mA
-1-
Publication Release Date: October 2000
Revision A1
W981216BH
PIN CONFIGURATION
V
CC
DQ0
V
CC
Q
DQ1
DQ2
V
SS
Q
DQ3
DQ4
V
CC
Q
DQ5
DQ6
V
SS
Q
DQ7
V
CC
LDQM
WE
CAS
RAS
CS
BS0
BS1
A10/AP
A0
A1
A2
A3
V
CC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
V
SS
DQ15
V
SS
Q
DQ14
DQ13
V
CC
Q
DQ12
DQ11
V
SS
Q
DQ10
DQ9
V
CC
Q
DQ8
V
SS
NC
UDQM
CLK
CKE
NC
A11
A9
A8
A7
A6
A5
A4
V
SS
-2-
W981216BH
PIN DESCRIPTION
PIN NUMBER
PIN NAME
FUNCTION
DESCRIPTION
23
26, 22,
29
35
20, 21
2, 4, 5, 7, 8,
10, 11, 13, 42,
44, 45, 47, 48,
50, 51, 53
19
A0
A11
Address
Multiplexed pins for row and column address.
Row address: A0
A11. Column address: A0
A8.
BS0, BS1
DQ0
DQ15
Bank Select
Data Input/
Output
Select bank to activate during row address latch time,
or bank to read/write during address latch time.
Multiplexed pins for data output and input.
CS
Chip Select
Disable or enable the command decoder. When
command decoder is disabled, new command is
ignored and previous operation continues.
Command input. When sampled at the rising edge of
the clock, RAS , CAS and WE
operation to be executed.
Referred to RAS
Referred to RAS
The output buffer is placed at Hi-Z (with latency of 2)
when DQM is sampled high in read cycle. In write
cycle, sampling DQM high will block the write
operation with zero latency.
System clock used to sample inputs on the rising edge
of clock.
CKE controls the clock activation and deactivation.
When CKE is low, Power Down mode, Suspend mode
or Self Refresh mode is entered.
Power for input buffers and logic circuit inside DRAM.
Ground for input buffers and logic circuit inside DRAM.
Separated power from V
CC
, used for output buffers to
improve noise.
Separated ground from V
SS
, used for output buffers to
improve noise.
No connection
define the
18
RAS
Row Address
Strobe
17
16
39, 15
CAS
WE
Column Address
Strobe
Write Enable
Input/Output
Mask
UDQM/
LDQM
38
37
CLK
CKE
Clock Inputs
Clock Enable
1, 14, 27
28, 41, 54
3, 9, 43, 49
6, 12, 46, 52
36, 40
V
CC
V
SS
V
CC
Q
V
SS
Q
NC
Power (+3.3V)
Ground
Power (+3.3V)
for I/O Buffer
Ground for I/O
Buffer
No Connection
-3-
Publication Release Date: October 2000
Revision A1
W981216BH
BLOCK DIAGRAM
CLK
CLOCK
BUFFER
CKE
CS
CONTROL
SIGNAL
GENERATOR
RAS
CAS
COMMAND
DECODER
COLUMN DECODER
COLUMN DECODER
R
O
W
WE
R
O
W
D
E
C
O
D
E
R
A10
CELL ARRAY
BANK #0
A0
ADDRESS
BUFFER
A9
A11
BS0
BS1
MODE
REGISTER
D
E
C
O
D
E
R
CELL ARRAY
BANK #1
SENSE AMPLIFIER
SENSE AMPLIFIER
DMn
DQ0
DATA CONTROL
CIRCUIT
REFRESH
COUNTER
COLUMN
COUNTER
DQ
BUFFER
DQ15
UDQM
LDQM
COLUMN DECODER
R
O
W
D
E
C
O
D
E
R
R
O
W
COLUMN DECODER
CELL ARRAY
BANK #2
D
C
O
D
E
R
CELL ARRAY
BANK #3
SENSE AMPLIFIER
SENSE AMPLIFIER
Note: The cell array configuration is 4096 * 512 * 16.
-4-
W981216BH
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
RATING
UNIT
Input/Output Voltage
Power Supply Voltage
Operating Temperature
Storage Temperature
Soldering Temperature (10s)
Power Dissipation
Short Circuit Output Current
of the device.
V
IN,
V
OUT
V
CC
, V
CCQ
T
OPR
T
STG
T
SOLDER
P
D
I
OUT
-0.3
V
CC
+0.3
-0.3
4.6
0
70
-55
150
260
1
50
V
V
°
C
°
C
°
C
W
mA
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability
RECOMMENDED DC OPERATING CONDITIONS
(T
A
= 0 to 70
°
C)
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Power Supply Voltage
Power Supply Voltage (for I/O
Buffer)
Input High Voltage
Input Low Voltage
Note: V
IH
(max) = V
CC
/ V
CC
Q+1.2V for pulse width < 5 nS
V
IL
(min) = V
SS
/ V
SS
Q-1.2V for pulse width < 5 nS
V
CC
V
CCQ
V
IH
V
IL
3.0
3.0
2.0
-0.3
3.3
3.3
-
-
3.6
3.6
V
CC
+0.3
0.8
V
V
V
V
CAPACITANCE
(V
CC
= 3.3V, f = 1 MHz, T
A
= 25
°
C)
PARAMETER
SYMBOL
MIN.
MAX.
UNIT
Input Capacitance
(A0 to A11, BS0, BS1, CS , RAS , CAS , WE , DQM,
CKE)
Input Capacitance (CLK)
Input/Output capacitance
Note: These parameters are periodically sampled and not 100% tested.
C
I
-
3.8
pf
C
CLK
C
IO
-
-
3.5
6.5
pf
pf
-5-
Publication Release Date: October 2000
Revision A1
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参数对比
与W981216BH-8H相近的元器件有:W981216BH-75。描述及对比如下:
型号 W981216BH-8H W981216BH-75
描述 Synchronous DRAM, 8MX16, 6ns, CMOS, PDSO54, 0.400 INCH, 0.80 MM PITCH, TSOP2-54 Synchronous DRAM, 8MX16, 5.4ns, CMOS, PDSO54, 0.400 INCH, 0.80 MM PITCH, TSOP2-54
厂商名称 Winbond(华邦电子) Winbond(华邦电子)
零件包装代码 TSOP2 TSOP2
包装说明 TSOP2, TSOP54,.46,32 TSOP2, TSOP54,.46,32
针数 54 54
Reach Compliance Code compliant compliant
ECCN代码 EAR99 EAR99
访问模式 FOUR BANK PAGE BURST FOUR BANK PAGE BURST
最长访问时间 6 ns 5.4 ns
其他特性 AUTO/SELF REFRESH AUTO/SELF REFRESH
最大时钟频率 (fCLK) 125 MHz 133 MHz
I/O 类型 COMMON COMMON
交错的突发长度 1,2,4,8 1,2,4,8
JESD-30 代码 R-PDSO-G54 R-PDSO-G54
长度 22.22 mm 22.22 mm
内存密度 134217728 bit 134217728 bit
内存集成电路类型 SYNCHRONOUS DRAM SYNCHRONOUS DRAM
内存宽度 16 16
功能数量 1 1
端口数量 1 1
端子数量 54 54
字数 8388608 words 8388608 words
字数代码 8000000 8000000
工作模式 SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C
组织 8MX16 8MX16
输出特性 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP2 TSOP2
封装等效代码 TSOP54,.46,32 TSOP54,.46,32
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
电源 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified
刷新周期 4096 4096
座面最大高度 1.2 mm 1.2 mm
自我刷新 YES YES
连续突发长度 1,2,4,8,FP 1,2,4,8,FP
最大待机电流 0.001 A 0.001 A
最大压摆率 0.15 mA 0.16 mA
最大供电电压 (Vsup) 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL
端子形式 GULL WING GULL WING
端子节距 0.8 mm 0.8 mm
端子位置 DUAL DUAL
宽度 10.16 mm 10.16 mm
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器件捷径:
00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W
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