型号
- 型号
- 关键词
Synchronous DRAM, 4MX32, 5.4ns, CMOS, PBGA90, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-90
厂商名称：Winbond(华邦电子)
厂商官网：http://www.winbond.com.tw
器件标准：
| 型号 | W9812G2DB-75 | W981232DB-75 | W9812G2DB75E | W981232DB75E |
|---|---|---|---|---|
| 描述 | Synchronous DRAM, 4MX32, 5.4ns, CMOS, PBGA90, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-90 | Synchronous DRAM, 4MX32, 5.4ns, CMOS, PBGA90, 0.80 MM PITCH, TFBGA-90 | Synchronous DRAM, 4MX32, 5.4ns, CMOS, PBGA90, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-90 | Synchronous DRAM, 4MX32, 5.4ns, CMOS, PBGA90, 0.80 MM PITCH, TFBGA-90 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) |
| 零件包装代码 | BGA | BGA | BGA | BGA |
| 包装说明 | TFBGA, | TFBGA, | TFBGA, | TFBGA, |
| 针数 | 90 | 90 | 90 | 90 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
| 最长访问时间 | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| JESD-30 代码 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 | R-PBGA-B90 |
| 长度 | 13 mm | 13 mm | 13 mm | 13 mm |
| 内存密度 | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit |
| 内存集成电路类型 | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
| 内存宽度 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 90 | 90 | 90 | 90 |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C |
| 组织 | 4MX32 | 4MX32 | 4MX32 | 4MX32 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFBGA | TFBGA | TFBGA | TFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 自我刷新 | YES | YES | YES | YES |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | OTHER | OTHER |
| 端子形式 | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | 8 mm | 8 mm | 8 mm | 8 mm |