SURFACE MOUNT MICROWAVE CHIP RESISTORS
PAGE TITLE
Wrap Around (WAMT)
Solderable gold with nickel barrier
OR Nickel barrier pre-soldered
Half Wrap (HWMT)
Mini-Systems, Inc.
Surface Mount Microwave Chip Resistor
series is designed to fit a wide variety of applications operating in the Microwave Bands.
All sizes are offered in wrap around and half wrap configurations and offer the
high stability, flat frequency response
and
low noise
of Mini-Systems,
Inc. Thin Film materials.
Specialized LASER trim
techniques specifically designed for this series guarantee operation up to
40 GHz.
Microwave Chip
Resistors can be attached to associated circuitry through ribbon or wire bonding, conductive epoxy, or soldering to terminations.
Solderable gold with nickel barrier
OR Nickel barrier pre-soldered
Isolated pad is wire bondable
GENERAL CHARACTERISTICS
Resistance Range
Resistance Tolerance
Termination
1
Operating Temperature
Storage Temperature
Operating Voltage
VSWR
2
DC to 10GHz
1.2:1
(NU) Soldereable Au w/ Ni barrier, (NT) Nickel with Solder
-55°C to +150°C
-65°C to +150°C
10 to 20GHz
1.3:1
100V Max.
20-40GHz
1.5:1
±0.5% to ±10%
2Ω to 5kΩ
1
2
SUBSTRATE CHARACTERISTICS
SUBSTRATE
99.6% Alumina
Beryllium Oxide
Aluminum Nitride
Soldered or Solderable Gold require a Nickel Barrier
Achieving operating characteristics is dependent on attachment methods in order to minimize parasitics
Available
Thickness
Dielectric
Constant
@ 1MHz
6.7
9.9
9.0
Thermal
Conductivity
W/m• K
140 - 177
Standard TCR
±25 ppm/°C
±150 ppm/°C
300
28
Current Noise
101Ω to 5kΩ
-35dB
-35dB
-35dB
≤ 100Ω
-30dB
-30dB
-30dB
0.010" - 0.025"
0.005" - 0.025"
0.010" - 0.025"
RESISTOR CHARACTERISTICS
RESISTOR FILM
Tatalum Nitride
NiChrome
Ta
2
O
5
(Self Passivating)
Passivation
SiO
2
TCR Optional to:
±5 ppm/°C
NT
±25 ppm/°C
PART NUMBER DESIGNATION
STYLE
WAMT
HWMT
WAMT
TYPE
SEE
TABLE
4
SUBSTRATE
A = Alumina
B = BeO
N = AlN
A
N
EXAMPLE: WAMT- 4 - AN - 10000F - NT
WAMT-4 Series, Alumina Substrate, NiChrome Resistor Film, 1kΩ, ±1% Tol., Nickel w/ Sn62 Solder
RESISTOR FILM
OHMIC VALUE
T = Tantalum Nitride
5-Digit Number:
N = NiChrome
1st 4 digits are significant
with "R" as decimal point
when required. 5th digit
represents number of zeros.
10000
TOLERANCE
D = ±0.5%
F = ±1%
G = ±2%
J = ±5%
K = ±10%
F
MINI SYSTEMS INC.
15
MADE IN AMERICA
SINCE 1968
ISO 9001 CERTIFIED
20 DAVID ROAD
NORTH ATTLEBORO, MA 02760
EMAIL: msithin@Mini-SystemsInc.com
WEB:
www.Mini-SystemsInc.com
PHONE: 508-695-0203 FAX:508-695-6076
8041 Rev. A
THIN FILM DIVISION
D
C
B
A
F
NU
NT
NT3
TR
=
=
=
=
=
=
=
=
=
OPTION
±5ppm/°C
±10ppm/°C
±25ppm/°C
±50ppm/°C
±100ppm/°C
Soldereable Au w/ Ni barrier
Nickel w/ Sn62 Solder
Nickel w/ SAC305 Solder
Tape & Reel
SURFACE MOUNT MICROWAVE CHIP RESISTORS
PAGE TITLE
DIMENSIONS
CASE
SIZE
TYPE
21
7
1
L
(±0.002”)
[±0.051mm]
0201
0202
0202
0302
0402
0404
0502
0505
0603
0805
1005
1010
1206
122
32
2
4
8
3
121
5
6
0.020"
0.040"
[1.016]
[0.889]
[1.270]
[1.270]
[1.397]
[1.905]
[2.540]
[2.540]
[3.200]
0.020"
0.030”
[0.762]
[0.508]
[0.508]
0.020"
[0.508]
W
(±0.002”)
[±0.051mm]
0.010"
0.016"
0.020"
0.020"
0.035"
0.025"
0.050"
0.025"
0.050"
0.050"
0.100"
0.063"
[1.600]
[2.540]
[1.270]
[1.270]
[0.635]
[1.270]
[0.635]
[0.889]
[0.508]
[0.254]
[0.406]
[0.508]
[0.508]
T
3
(±0.002”)
[±0.051mm]
Resistance
Range
3Ω - 400Ω
2Ω - 360Ω
2Ω - 400Ω
2Ω - 500Ω
2Ω - 1kΩ
2Ω - 1kΩ
2Ω - 2kΩ
2Ω - 2kΩ
2Ω - 2kΩ
2Ω - 3kΩ
10Ω - 5kΩ
2Ω - 5kΩ
5Ω - 5kΩ
Max.
Operating
Frequency
1
GHz
20
20
20
20
20
13
13
13
13
13
13
13
POWER RATING
2
Alumina
50mW
AlN
200mW
500mW
1W
1W
BeO
400mW
2W
2W
1W
0.006"
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
0.010"
[0.254]
[0.254]
[0.254]
[0.254]
[0.254]
[0.254]
[0.254]
[0.254]
[0.254]
[0.152]
[0.254]
[0.254]
[0.254]
0.020”
0.010”
125mW
250mW
250mW
250mW
250mW
500mW
250mW
500mW
500mW
750mW
750mW
115
0.035"
0.050"
0.055"
0.075"
0.100"
0.050"
13
250mW
1W
1W
1W
2W
1W
2W
2W
3W
3W
2W
2W
2W
4W
2W
4W
4W
6W
6W
0.100"
Achieving operating characteristics in this frequency range is dependent on attachment methods in order to minimize parasitics
Power rating at 70°C derated linearly to 0% at 150°C
3
Thickness does not include solder
1
2
0.126"
PERFORMANCE SPECIFICATIONS
PROPERTY
SHORT TERM OVERLOAD
HIGH TEMP EXPOSURE
THERMAL SHOCK
MOISTURE RESISTANCE
STABILITY
2.5xWVDC(6.25xRATED POWER)MIL-PRF-55342, +25°C, 5 SEC
MIL-STD 202 METHOD 108, 2000 HRS, +70°C, RATED POWER
MIL-STD 202, METHOD 107
MIL-STD 202, METHOD 106
+150°C, 100HRS
TEST CONDITION
±0.25 MAX ∆R/R
±0.20 MAX ∆R/R
±0.25 MAX ∆R/R
±0.40 MAX ∆R/R
±0.50 MAX ∆R/R
REQUIRED
LIMITS
±0.10 MAX ∆R/R
±0.03 MAX ∆R/R
±0.10 MAX ∆R/R
±0.10 MAX ∆R/R
±0.10 MAX ∆R/R
MSI TYPICAL
LIMITS
All WAMT, HWMT Series parts are produced on the same manufacturing line using the same materials and processes as
parts manufactured to MIL-PRF-55342
ISO 9001 CERTIFIED
20 DAVID ROAD
NORTH ATTLEBORO, MA 02760
EMAIL: msithin@Mini-SystemsInc.com
WEB:
www.Mini-SystemsInc.com
PHONE: 508-695-0203 FAX:508-695-6076
MINI SYSTEMS INC.
MADE IN AMERICA
SINCE 1968
THIN FILM DIVISION
8041 Rev. A
16
