THIN FILM SURFACE MOUNT RESISTORS
WATF SERIES
DAT
MECHANICAL DATA
W
T
L
Full Wrap Around
W
SERIES
WATF - 1
WATF - 2
WATF - 3
WATF - 4
WATF - 5
WATF - 6
WATF - 7
WATF - 8
WATF - 9
SUBSTRATE
SUBSTRATE
RESISTOR
BOND PADS
AND WRAPAROUND
TERMINATIONS
TERMINATIONS
T
L
W
0.040" x 0.020" x 0.010"
0.035" x 0.035" x 0.010"
0.075" x 0.050" x 0.010"
0.050" x 0.050" x 0.010"
0.126" x 0.063" x 0.010"
0.100" x 0.050" x 0.010"
0.020" x 0.020" x 0.010"
0.055" x 0.025" x 0.010"
0.153" x 0.050" x 0.010"
99.6% ALUMINA, ALUMINUM NITRIDE
TANT
ANTALUM
NICHROME OR TANTALUM NITRIDE
TOLERANCE
(±0.003")
(±0.003")
(±0.003")
(±0.003")
(±0.003")
(±0.003")
(±0.003")
(±0.003")
(±0.003")
STANDARD.
GOLD WITH NICKEL BARRIER STANDARD.
TERMINATION
OPTIONAL WITH SOLDER; OR HALF-WRAP TERMINATION
RATING
POWER RATING
@ 70°C
125mW
250mW
250mW
250mW
500mW
250mW
125mW
250mW
500mW
T
ELECTRICAL DATA
DAT
L
Half-Wrap
SERIES
WATF
WATF
WATF
WATF
WATF
WATF
WATF
WATF
WATF
ABSOLUTE
T.C.R.
-1
-2
-3
-4
-5
-6
-7
-8
-9
TOLERANCE
OHMIC VALUE
18KΩ
2
Ω −
18K
Ω
150KΩ
2
Ω −
150K
Ω
400KΩ
2
Ω −
400K
Ω
400KΩ
2
Ω −
400K
Ω
700KΩ
2
Ω −
700K
Ω
625KΩ
2
Ω −
625K
Ω
51KΩ
2
Ω −
51K
Ω
100KΩ
2
Ω −
100K
Ω
1MΩ
2
Ω −
1M
Ω
0.1%, 0.5%, 1%, 2%, 5%, 10%
STANDARD
±100ppm/° STANDARD (TaN)
±25ppm/°C STANDARD (NiCr); ±100ppm/
°
C STANDARD (TaN)
OPTIONAL TO ±25ppm/°C
DAT
SERIES DATA
CURRENT NOISE
DIELECTRIC BREAKDOWN
INSULATION RESISTANCE
INSULATION RESISTANCE
OPERATING VOLT
OPERATING VOLTAGE
SHORT TERM OVERLOAD
HIGH TEMP EXPOSURE
THERMAL SHOCK
RESISTANCE
MOISTURE RESISTANCE
STABILITY
STABILITY
OPERATING
OPERATING TEMP RANGE
FREQUENCY
STRAY DISTRIBUTED
CAPACIT
ACITANCE
CAPACITANCE
101Ω
250KΩ
101
Ω
TO 250K
Ω
: -40dB
100Ω
250KΩ
≤
100
Ω
,
≥
250K
Ω
: -30dB
400 V MIN.
10
12
Ω
MIN.
100 V MAX.
RATED
25°
±0.
0.2
5X RATED POWER, 25° C, 5 SEC., ±0.25% MAX.
∆
R/R: ±0.1% MSI TYPICAL
±0.25%
0.03
03%
150°C, 100 HRS., ±0.25% MAX.
∆
R/R: ±0.03% MSI TYPICAL
107F, ±0.25%
MIL-STD 202, METHOD 107F, ±0.25% MAX.
∆
R/R: ±0.1% MSI TYPICAL
±0.
0.5
0.1
MIL-STD 202, METHOD 106, ±0.5% MAX.
∆
R/R: ±0.1% MSI TYPICAL
70°C,
POWER, ±0.5%
1000 HRS., 70°C, 100% POWER, ±0.5% MAX.
∆
R/R: ±0.1% MSI TYPICAL
-55
-55°C TO +150°C
DC THROUGH 20 GHz
(TaN)
0.06pF (NiCr); 0.08pF (TaN)
DESIGNATION
PART NUMBER DESIGNATION
WATF
SERIES
1, 2
3, 4
5, 6
7, 8
9
X
SUBSTRATE
SUBSTRATE
A = Alumina
N = Aluminum
Nitride
X
RESISTIVE
FILM
N = Nichrome
T = Tantalum
Nitride
XXXXX
OHMIC VALUE
5-Digit Number:
1st 4 Digits Are
Significant With
"R" As Decimal
Point When
Required.
5th Digit
Represents
Number of Zeros.
X
TOLERANCE
B
D
F
G
J
K
= 0.1%*
= 0.5%*
= 1%
= 2%
= 5%
= 10%
A
B
HWU
T
TR
U
HWT
X
OPTION
= ±50ppm/°C
= ±25ppm/°C
= Half-Wrap
Untinned
= With SN62
Solder ***
= Tape and
Reel ****
= Untinned**
= Half-Wrap
Tinned.
(Solder option
applies to all
Conductor
Surfaces)
MINI-SYSTEMS, INC.
THIN FILM DIVISION
45 FRANK MOSSBERG DRIVE, ATTLEBORO, MA 02703
508-226-2111 FAX: 508-226-2211
DCN TF 111-E-0403
Consult Sales for power capabilities
on Aluminum Nitride.
* Value Dependent
** For Conductive Epoxy Mount.
*** For Solder Mount.
**** Consult Sales for Availability.
EXAMPLE: WATF 1AN-50R00F-T = 0.040" x 0.020" x 0.010", Alumina Substrate,
Resistor, 50Ω
Tol.,
Solder.
Wrap
Nichrome Resistor, 50
Ω
, ±1% Tol., ±25ppm/°C, w/ Solder. Full Wrap Around.
35
Microchip MCU