CLA, CLB
Vishay Electro-Films
Thin Film Eight Resistor Array
FEATURES
Product may not
be to scale
•
Wire bondable
•
Eight equal value resistors on a 0.060 x 0.090 inch chip
•
Resistance range: 20
Ω
to 1 MΩ
•
Excellent TCR tracking
•
Resistor material: Tantalum nitride, self-passivating
•
Oxidized silicon substrate for good power dissipation
•
Custom values available
•
Moisture resistant
The CLA and CLB resistor arrays are the hybrid equivalent
to the eight resistor common connection and isolated
networks available in sips or dips. The resistors are spaced
on 0.010 inches centers resulting in minimal space
requirements.
These chips are manufactured using Vishay Electro-Films
(EFI) sophisticated Thin Film equipment and manufacturing
technology. The CLA and CLBs are 100 % electrically tested
and visually inspected to MIL-STD-883.
APPLICATIONS
The CLA and CLB thin film resistor arrays are designed for hybrid packages requiring up to eight resistors of the same resistance
value and tolerance, as well as excellent TCR tracking. For such hybrids, they afford great savings in cost and space.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
CHIP
RESISTOR
ARRAYS
Tightest Standard Tolerance Available
0.5 %
0.1 %
PROCESS CODE
CLASS H*
CLASS K*
054
049
045
026
017
008
*MIL-PRF-38534 inspection criteria
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
20
Ω
300
Ω
300 kΩ
500 kΩ 1 MΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
TCR Tracking Spread
Noise, MIL-STD-202, Method 308
100
Ω
- 250 kΩ
< 100
Ω
or > 251 kΩ
Moisture Resistance, MIL-STD-202, Method 106
Stability, 1000 h, + 125 °C, 25 mW
Absolute
Ratio
Operating Temperature Range
Thermal Shock, MIL-STD-202
Method 107, Test Condition F
High Temperature Exposure, ± 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
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112
For technical questions, contact: efi@vishay.com
± 5 ppm/°C
- 35 dB typ.
- 20 dB typ.
± 0.5 % max.
ΔR/R
± 0.25 % max.
ΔR/R
± 0.05 % max.
ΔR/R
- 55 °C to + 125 °C
± 0.1 % max.
ΔR/R
± 0.2 % max.
ΔR/R
200 V
10
12
min.
100 V
50 mW per resistor
± 0.1 % max.
ΔR/R
Document Number: 61009
Revision: 17-Mar-08
CLA, CLB
Thin Film Eight Resistor Array
Vishay Electro-Films
DIMENSIONS
in inches
CLA
CLB
0.090
0.007
0.004
0.090
0.004
0.060
0.054
0.060
0.004
0.007
0.0775
0.054
0.004
MECHANICAL SPECIFICATIONS
in inches
PARAMETER
Chip Size
Chip Thickness
Chip Substrate Material
Resistor Material
Bonding Pads
Number of Top Pads
Pad Material
Backing
Options:
Gold backing for eutectic die attach
For custom configurations, consult Applications Engineer
0.060 x 0.090 ± 0.002 (1.50 x 2.26 ± 0.05 mm)
0.010 ± 0.002 (0.254 ± 0.05 mm)
Oxidized silicon, 10 kÅ minimum SiO
2
CHIP
RESISTOR
ARRAYS
Tantalum nitride, self-passivating
0.004 x 0.007 (0.10 x 0.178 mm)
CLA - 16
CLB - 9
10 kÅ minimum aluminum
None, lapped semiconductor silicon
ORDERING INFORMATION
Example: 100 % visualled, 10 kΩ, ± 1 %, ± 100 ppm/°C TCR, CLA format, aluminum pads, class H visual inspection
P/N:
W
INSPECTION
/PACKAGING
W
= 100 % visually inspected
parts per MIL-STD-883 in matrix
trays
X
= Sample, visually
inspected loaded in matrix
trays (4 % AQL)
CLA
PRODUCT
FAMILY
008
PROCESS
CODE
See Process Code
table
1000
RESISTANCE
VALUE
Use first 4
significant digits of
the resistance
1
MULTIPLIER
CODE
D
= 0.0001
C
= 0.001
B
= 0.01
A
= 0.1
0
=1
1
= 10
2
= 100
3
= 1000
4
= 10000
F
TOLERANCE
CODE
B
= 0.1 %
C
= 0.2 %
D
= 0.5 %
F
= 1.0 %
G
= 2.0 %
H
= 2.5 %
J
= 5.0 %
K
= 10 %
Document Number: 61009
Revision: 17-Mar-08
For technical questions, contact: efi@vishay.com
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113
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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1
嵌入式系统
