High Power Chip Resistors
Model No.
Size Code
INCH
Size Code
mm
WCR32
1206
3216
WCR50
2010
5025
WCR64
2512
6432
■
Features
・Wide
terminal made higher reliability of solder joint, compared to conventional chip resistor.
・Wide
terminal made possible high power handling. (Rated power, WCR50 : 1W, WCR32 : 0.5W)
・High
joint strengh against heat shock.
・Resistance
ranging
½1MΩ.
■
Applications
・Automotive
electronics such as E.C.U. ,etc.
・Circuits
requiring high resistance to vibration.
■
Model Designation
WCR32
①Model
No.
①Model No.
WCR32
WCR50
WCR64
102
②Resistance
②Resistance
3 digit or 4digit
J
③Tolerance
③Tolerance
Symbol Tolerance(%)
F
± 1.0
J
± 5.0
0Ω type is no marking
Symbol
B
V
E
V
④Packaging
④Packaging
Packaging
Bulk
Paper taping (WCR32)
Embossed taping
(WCR50,WCR64)
(Resistance)
０Ω
4.7Ω
1kΩ
1.02kΩ
→
→
→
→
(Marking)
0
4R7
102
1021
■
Rating
Model No.
Rated Wattage
(W)
0.5
Tolerance
(%)
J: ±5%
F: ±1%
J: ±5%
WCR50
1.0
F: ±1%
J: ±5%
WCR64
2.0
F: ±1%
Resistance
(Ω)
1
½
1M
1
½
91
100
½
9.1k
10k
½
1M
1
½
1M
1
½
91
100
½
9.1k
10k
½
1M
1
½
1M
1
½
91
100
½
9.1k
10k
½
1M
T.C.R.
(ppm/
℃
)
±200
±200
±100
±200
±200
±200
±100
±200
±200
±200
±100
±200
Max. Working
Voltage (V)
200
Max. Overload
Voltage (V)
400
WCR32
200
400
200
400
Operating Tempeature Range : -55
℃½＋
155
℃
０Ω
Type
Model No.
WCR32, WCR50, WCR64
Rated Current
(A)
2.0
Resistance
Max. 50mΩ
HOKURIKU
Specifications are subject to change without notice
.
1
High Power Chip Resistors
■
Dimensions
L
c
W
t
d
Model No.
WCR32
WCR50
WCR64
L
3.20±0.15
5.00±0.20
6.30±0.20
W
1.60±0.15
2.50±0.20
3.20±0.20
c
0.30±0.20
0.50±0.20
0.50±0.20
d
0.50±0.20
0.60±0.20
0.90±0.20
Unit : mm
t
0.55
＋
0.15/-0.05
0.56±0.15
0.56±0.15
0Ω Type
■
Structure
③ ④ ⑤
②
⑥
Symbol
①
②
③
④
⑤
⑥
①
Material List
Ceramic Substrate
Conductor
Resistor
Over coat
Marking
Side Electrode
②
③
④
⑤
①
Symbol
Material List
①
Ceramic Substrate
②
Conductor
③
Over coat
④
Marking
⑤
Side Electrode
Power rating (%)
■
Surface Temperature
For resistors operated in ambient temperature above70
℃,
power rating must be derated in accordance with the
100
80
60
40
20
0
-55℃
0℃
70℃
155℃
derating curve.
Ambient Temperature(℃)
■
Surface Temperature
Surface temperature rise is shown in this figure.
150
WCR64
WCR50
WCR32
Condition : Measured by soldering on glass
cloth base material epoxy resin (t=1.6mm).
Surface temperature (℃)
100
50
0
50
100
200
300
Power rating (%)
■
Packaging
Refer "Dimension, Packaging, etc."
HOKURIKU
Specifications are subject to change without notice
2
FPGA/CPLD
