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WCTQ1007320AF

RES NET,THIN FILM,732 OHMS,200WV,1% +/-TOL,-50,50PPM TC,0303 CASE

器件类别:无源元件    电阻器   

厂商名称:Vishay(威世)

厂商官网:http://www.vishay.com

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
Objectid
1178105498
包装说明
SMT, 0303
Reach Compliance Code
unknown
ECCN代码
EAR99
构造
Chip
制造商序列号
CTQ
网络类型
Center Tap
端子数量
6
最高工作温度
125 °C
最低工作温度
-55 °C
封装高度
0.254 mm
封装长度
0.762 mm
封装形式
SMT
封装宽度
0.762 mm
包装方法
Tray
额定功率耗散 (P)
0.06 W
参考标准
MIL-STD-883
电阻
732 Ω
电阻器类型
ARRAY/NETWORK RESISTOR
系列
CTQ
尺寸代码
0303
温度系数
50 ppm/°C
容差
1%
工作电压
200 V
文档预览
CTQ
Vishay Electro-Films
Thin Film Center-Tapped Resistors
CHIP
RESISTORS
FEATURES
Product may
not be to scale
Wire bondable
Center tap feature
Chip size: 0.030 inches square
Resistance range total: 10
Ω
to 1 MΩ
Resistor material: Tantalum nitride, self-passivating
Moisture resistant
Quartz substrate
Low shunt capacitance < 0.1 pF
I
V
The CTQ series resistor chips offer a wide resistance range with
lower shunt capacitance than can be offered with the silicon
based resistors but only at a lower power level.
The CTQ offers the designer flexibility in use as either a
single value resistor or as two resistor with a center tap
feature. The CTQs six bonding pads allows the user
increased layout flexibility.
The CTQs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The CTQs are 100 % electrically tested and
visually inspected to MIL-STD-883.
R
A
R
B
V
I
V
APPLICATIONS
The CTQ center-tapped resistor chips are used mainly in feedback circuits of amplifiers where ratio matching, low shunt
capacitance and tracking between two resistors is critical.
For low values, the resistance of the six bonding pad configuration can vary, depending on the method of measurement used.
Vishay EFI measures low-value resistors by the four-wire kelvin technique.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
0.5 %
0.1 %
PROCESS CODE
CLASS H*
CLASS K*
132
130
131
102
100
101
*MIL-PRF-38534 inspection criteria
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
10
Ω
25
Ω
100
Ω
360 kΩ 620 kΩ 1 MΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
TCR Tracking Between Halves (R
A
,
R
B
)
Center Tap Ratio,
R
A
/R
B
: Tolerance
Noise, MIL-STD-202, Method 308, 100
Ω
- 250 kΩ
< 100
Ω
or > 251 kΩ
Moisture Resistance, MIL-STD-202, Method 106
Stability, 1000 h, + 125 °C, 30 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202, Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
*5 ppm/°C for
R
< 100. 20 ppm/°C for
R
< 20
www.vishay.com
82
For technical questions, contact: efi@vishay.com
Document Number: 61030
Revision: 13-Mar-08
± 2 ppm/°C*
1 ± 1 % standard
- 35 dB typ.
- 20 db typ.
± 0.5 % max.
ΔR/R
± 0.25 % max.
ΔR/R
- 55 °C to + 125 °C
± 0.1 % max.
ΔR/R
± 0.2 % max.
ΔR/R
400 V
10
12
min.
200 V
60 mW
± 0.25 % max.
ΔR/R
%
CTQ
Thin Film Center-Tapped Resistors
Vishay Electro-Films
DIMENSIONS
in inches
0.030
CHIP
RESISTORS
STANDARD CONFIGURATION
Six locations. All pads 0.005 x 0.005 inches
0.026
0.030
TYPICAL RANGE
10
Ω
- 26.9
Ω
TYPICAL RANGE
27
Ω
- 99
Ω
TYPICAL RANGE
100
Ω
- 1 MΩ
SCHEMATIC
R
T
=
R
A
+
R
B
R
A
R
B
MECHANICAL SPECIFICATIONS
in inches
PARAMETER
Chip Size
Chip Thickness
Chip Substrate Material
Resistor Material
Bonding Pad Size
Number of Pads
Pad Material
Backing
Options:
Alphanumeric part marking, up to six characters
Gold bonding pads, 15k Å minimum
Center-tap ratio tolerances to 0.05 %
1 to 10
Ω
values available
Contact Applications Engineer
0.030 x 0.030 ± 0.002 (0.762 x 0.762 ± 0.05 mm)
0.010 ± 0.003 (0.254 ± 0.05 mm)
Quartz
Tantalum nitride, self-passivating
0.005 x 0.005 (0.127 x 0.127 mm)
6
10 kÅ minimum aluminum
None, lapped quartz
ORDERING INFORMATION
Example: 100 % visual, 10 kΩ, ± 1 %, ± 100 ppm/°C TCR, aluminum pads, class H visual inspection
W
INSPECTION/
PACKAGING
W = 100 % visually inspected
parts in matrix trays per
MIL-STD-883
X = Sample, visually inspected
parts loaded in matrix
trays (4 % AQL)
CTQ
PRODUCT
FAMILY
101
PROCESS
CODE
See Process Code
table
1000
RESISTANCE
VALUE
Use first 4 digits
significant digits of the
resistance (R
T
)
1
MULTIPLIER
CODE
D
= 0.0001
C
= 0.001
B
= 0.01
A
= 0.1
0
=1
1
= 10
2
= 100
3
= 1000
4
= 10 000
F
TOLERANCE
CODE
B
= 0.1 %
C
= 0.2 %
D
= 0.5 %
F
= 1.0 %
G
= 2.0 %
H
= 2.5 %
J
= 5.0 %
K
= 10 %
Document Number: 61030
Revision: 13-Mar-08
For technical questions, contact: efi@vishay.com
www.vishay.com
83
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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