CTT
Vishay Electro-Films
Thin Film, Center-Tapped Resistors
CHIP
RESISTORS
FEATURES
•
Wire bondable
Product may not
be to scale
•
Center tap feature
•
Chip size: 0.030 inches square
•
Resistance range
R
T
: 10
Ω
to 36 kΩ
•
Alumina substrate, low shunt capacitance: < 0.2 pF
•
Resistor material: Tantalum nitride
•
Moisture resistant
The CTT series resistor chips offer a combination of low
shunt capacitance and excellent stability. The CTT offers the
designer flexibility in use as either a single value resistor or
as two resistor with a center tap feature.
The CTTs six bonding pads allows the user increased layout
flexibility. The CTTs tantalum nitride resistor material offers
excellent resistance to high moisture environments.
The CTTs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The CTTs are 100 % electrically tested and
visually inspected to MIL-STD-883.
I
I
I
R
A
R
B
APPLICATIONS
The CTT center-tapped resistor chips are used mainly in
feedback circuits of amplifiers where ratio matching,
tracking, low shunt capacitance and better frequency
response are necessary.
Vishay EFI measures low-value resistors by the four-wire
kelvin technique.
V
V
V
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
0.5 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 200 ppm/°C
PROCESS CODE
CLASS H*
202
200
201
204
*MIL-PRF-38534 inspection criteria
CLASS K*
207
205
206
209
10
Ω
25
Ω
50
Ω
4.3 kΩ
10 kΩ
35 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
TCR Tracking Between Halves (R
A
/R
B)
Center Tap Ratio,
R
A
/R
B
: Tolerance
Noise, MIL-STD-202, Method 308
Moisture Resistance, MIL-STD-202, Method 106
Stability, 1000 h, + 125 °C, 62 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202, Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at + 150 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
*10 ppm/°C for
R
< 100
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66
For technical questions, contact: efi@vishay.com
Document Number: 61016
Revision: 12-Mar-08
± 2 ppm/°C*
1±1%
- 35 dB typ.
± 0.5 % max.
ΔR/R
± 0.25 % max.
ΔR/R
- 55 °C to + 125 °C
± 0.1 % max.
ΔR/R
± 0.2 % max.
ΔR/R
10
12
min.
100 V max.
125 mW
± 0.25 % max.
ΔR/R
%
CTT
Thin Film, Center-Tapped Resistors
Vishay Electro-Films
DIMENSIONS
in inches
CHIP
RESISTORS
0.030
0.030
STANDARD CONFIGURATION
*Six locations. All pads 0.005 x 0.005
0.005
SCHEMATIC
R
T
=
R
A
+
R
B
R
A
R
B
MECHANICAL SPECIFICATIONS
in inches
PARAMETER
Chip Size
Chip Thickness
Chip Substrate Material
Resistor Material
Bonding Pad Size
Number of Pads
Pad Material
Backing
Options:
Alphanumeric part marking, up to six characters
Aluminum bonding pads, 10 kÅ minimum
Consult Applications Engineer
0.030 x 0.030 ± 0.002 (0.762 x 0.762 ± 0.050 mm)
0.010 ± 0.002 (0.254 ± 0.05 mm)
99.6 % alumina
Tantalum nitride
0.005 x 0.005 (0.127 x 0.127 mm)
6
25 kÅ minimum gold
None
ORDERING INFORMATION
Example: 100 % visual, 10 kΩ, ± 1 %, ± 100 ppm/°C TCR, gold pads, class H visual inspection
W
INSPECTION/
PACKAGING
W = 100 % visually inspected
parts in matrix trays per
MIL-STD-883
X = Sample, visually inspected
parts loaded in matrix
trays (4 % AQL)
CTT
PRODUCT
FAMILY
201
PROCESS
CODE
See Process Code
table
1000
RESISTANCE
VALUE
Use first 4 digits
significant digits of the
resistance (R
T
)
1
MULTIPLIER
CODE
B
= 0.01
A
= 0.1
0
=1
1
= 10
2
= 100
3
= 1000
4
= 10 000
F
TOLERANCE
CODE
D
= 0.5 %
F
= 1.0 %
G
= 2.0 %
H
= 2.5 %
J
= 5.0 %
K
= 10 %
M
= 20 %
L
= 25 %
Document Number: 61016
Revision: 12-Mar-08
For technical questions, contact: efi@vishay.com
www.vishay.com
67
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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1
NXP MCU
