型号
- 型号
- 关键词
Synchronous DRAM, 4MX64, 7ns, CMOS, PBGA153, 17 X 23 MM, BGA-153
厂商名称：Microsemi
厂商官网：https://www.microsemi.com
下载文档| 型号 | WED3DL644V10BI | WED3DL644V8BI | WED3DL644V8BC | WED3DL644V7BI | WED3DL644V10BC | WED3DL644V7BC |
|---|---|---|---|---|---|---|
| 描述 | Synchronous DRAM, 4MX64, 7ns, CMOS, PBGA153, 17 X 23 MM, BGA-153 | Synchronous DRAM, 4MX64, 6ns, CMOS, PBGA153, 17 X 23 MM, BGA-153 | Synchronous DRAM, 4MX64, 6ns, CMOS, PBGA153, 17 X 23 MM, BGA-153 | Synchronous DRAM, 4MX64, 5.4ns, CMOS, PBGA153, 17 X 23 MM, BGA-153 | Synchronous DRAM, 4MX64, 7ns, CMOS, PBGA153, 17 X 23 MM, BGA-153 | Synchronous DRAM, 4MX64, 5.4ns, CMOS, PBGA153, 17 X 23 MM, BGA-153 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, |
| 针数 | 153 | 153 | 153 | 153 | 153 | 153 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
| 最长访问时间 | 7 ns | 6 ns | 6 ns | 5.4 ns | 7 ns | 5.4 ns |
| 其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| JESD-30 代码 | R-PBGA-B153 | R-PBGA-B153 | R-PBGA-B153 | R-PBGA-B153 | R-PBGA-B153 | R-PBGA-B153 |
| 长度 | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm | 23 mm |
| 内存密度 | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bi | 268435456 bi |
| 内存集成电路类型 | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
| 内存宽度 | 64 | 64 | 64 | 64 | 64 | 64 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 153 | 153 | 153 | 153 | 153 | 153 |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C |
| 组织 | 4MX64 | 4MX64 | 4MX64 | 4MX64 | 4MX64 | 4MX64 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.9 mm | 1.9 mm | 1.9 mm | 1.9 mm | 1.9 mm | 1.9 mm |
| 自我刷新 | YES | YES | YES | YES | YES | YES |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm | 17 mm |
| 厂商名称 | Microsemi | - | - | Microsemi | Microsemi | Microsemi |