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WF512K32F-60G4TC5

512K X 32 FLASH 5V PROM MODULE, 90 ns, CPGA66

器件类别:存储   

厂商名称:ETC

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器件参数
参数名称
属性值
功能数量
1
端子数量
66
最小工作温度
-55 Cel
最大工作温度
125 Cel
额定供电电压
5 V
最小供电/工作电压
4.5 V
最大供电/工作电压
5.5 V
加工封装描述
1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
状态
Transferred
ype
NOR TYPE
sub_category
Flash Memories
ccess_time_max
90 ns
data_polling
YES
jesd_30_code
S-CPGA-P66
jesd_609_code
e0
存储密度
1.68E7 bi
内存IC类型
FLASH MODULE
备用存储器宽度
16
moisture_sensitivity_level
NOT SPECIFIED
umber_of_sectors_size
32
位数
524288 words
位数
512K
操作模式
ASYNCHRONOUS
组织
512KX32
包装材料
CERAMIC, METAL-SEALED COFIRED
ckage_code
PGA
ckage_equivalence_code
PGA66,11X11
包装形状
SQUARE
包装尺寸
GRID ARRAY
串行并行
PARALLEL
eak_reflow_temperature__cel_
NOT SPECIFIED
wer_supplies__v_
5
gramming_voltage__v_
5
qualification_status
COMMERCIAL
screening_level
38535Q/M;38534H;883B
seated_height_max
4.6 mm
sector_size__words_
16K
standby_current_max
0.0065 Am
最大供电电压
0.2400 Am
表面贴装
NO
工艺
CMOS
温度等级
MILITARY
端子涂层
TIN LEAD
端子形式
PIN/PEG
端子间距
2.54 mm
端子位置
PERPENDICULAR
ime_peak_reflow_temperature_max__s_
NOT SPECIFIED
ggle_bi
NO
length
27.3 mm
width
27.3 mm
dditional_feature
USER CONFIGURABLE AS 2M X 8
文档预览
WF512K32-XXX5
HI-RELIABILITY PRODUCT
512Kx32 5V FLASH MODULE, SMD 5962-94612
FEATURES
s
Access Times of 60, 70, 90, 120, 150ns
s
Packaging
• 66 pin, PGA Type, 1.075" square, Hermetic
Ceramic HIP (Package 400
(1)
)
• 68 lead, 40mm, Low Capacitance Hermetic CQFP
(Package 501)
• 68 lead, 40mm, Low Profile 3.5mm (0.140"), CQFP
(Package 502)
• 68 lead, 22.4mm (0.880") Low Profile CQFP (G2U), 3.5mm
(0.140") high, (Package 510)
• 68 lead, 23.9mm (0.940") Low Profile CQFP (G1U), 3.5mm
(0.140") high, (Package 519)
s
100,000 Erase/Program Cycles Minimum
s
Sector Architecture
• 8 equal size sectors of 64KBytes each
• Any combination of sectors can be concurrently erased.
Also supports full chip erase
s
Organized as 512Kx32
s
Commercial, Industrial and Military Temperature Ranges
s
5 Volt Programming. 5V
±
10% Supply.
s
Low Power CMOS, 6.5mA Standby
s
Embedded Erase and Program Algorithms
s
TTL Compatible Inputs and CMOS Outputs
s
Built-in Decoupling Caps for Low Noise Operation
s
Page Program Operation and Internal Program Control Time
s
Weight
WF512K32-XG2UX5 - 8 grams typical
WF512K32-XH1X5 - 13 grams typical
WF512K32-XG4X5 - 20 grams typical
WF512K32-XG4TX5 - 20 grams typical
WF512K32-XG1UX5 - 5 grams typical
1. Call factory for PGA type (HIP) package options.
Note: See Flash Programming Application Note 4M5 for algorithms.
FIG. 1
1
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
A
18
I/O
0
I/O
1
I/O
2
11
PIN CONFIGURATION FOR WF512K32N-XH1X5
TOP VIEW
12
WE
2
CS
2
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1
NC
I/O
3
22
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE
A
17
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
7
A
12
NC
A
13
A
8
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
WE
4
I/O
27
A
4
A
5
A
6
WE
3
CS
3
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
I/O
20
8
8
8
8
PIN DESCRIPTION
56
I/O
0-31
A
0-18
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
W E
1
CS
1
OE
A
0
-
18
512K x 8
512K x 8
W E
2
CS
2
W E
3
CS
3
W E
4
CS
4
512K x 8
512K x 8
66
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
April 2001 Rev. 4
1
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
WF512K32-XXX5
FIG. 2
PIN CONFIGURATION FOR WF512K32F-XG4X5 (Low Capacitance)
AND WF512K32-XG4TX5
TOP VIEW
NC
A
0
A
1
A
2
A
3
A
4
A
5
CS
1
GND
CS
3
WE
A
6
A
7
A
8
A
9
A
10
V
CC
PIN DESCRIPTION
I/O
0-31
A
0-18
Data Inputs/Outputs
Address Inputs
Write Enable
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
GND
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
8
8
8
WE
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
I/O
16
I/O
17
I/O
18
I/O
19
I/O
20
I/O
21
I/O
22
I/O
23
GND
I/O
24
I/O
25
I/O
26
I/O
27
I/O
28
I/O
29
I/O
30
I/O
31
CS
1-4
OE
V
CC
GND
NC
BLOCK DIAGRAM
CS
1
WE
OE
A
0-18
512K x 8
512K x 8
CS
2
CS
3
CS
4
512K x 8
512K x 8
8
V
CC
A
11
A
12
A
13
A
14
A
15
A
16
CS
2
OE
CS
4
A
17
A
18
NC
NC
NC
NC
NC
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
FIG. 3
PIN CONFIGURATION FOR WF512K32-XG2UX5 AND WF512K32-XG1UX5
TOP VIEW
NC
A
0
A
1
A
2
A
3
A
4
A
5
CS
3
GND
CS
4
WE
1
A
6
A
7
A
8
A
9
A
10
V
CC
PIN DESCRIPTION
I/O
0-31
Data Inputs/Outputs
A
0-18
I/O
16
I/O
17
I/O
18
I/O
19
I/O
20
I/O
21
I/O
22
I/O
23
GND
I/O
24
I/O
25
I/O
26
I/O
27
I/O
28
I/O
29
I/O
30
I/O
31
OE
A
0-18
512K x 8
512K x 8
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
GND
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
A
16
CS
1
OE
CS
2
A
17
WE
2
WE
3
WE
4
A
18
NC
NC
V
CC
A
11
A
12
A
13
A
14
A
15
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
WE
1-4
CS
1-4
OE
V
CC
GND
BLOCK DIAGRAM
WE
1
CS
1
WE
2
CS
2
WE
3
CS
3
WE
4
CS
4
512K x 8
512K x 8
8
8
8
8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
2
WF512K32-XXX5
ABSOLUTE MAXIMUM RATINGS (1)
Parameter
Operating Temperature
Supply Voltage Range (V
CC
)
Signal voltage range (any pin except A
9
) (2)
Storage Temperature Range
Lead Temperature (soldering, 10 seconds)
Data Retention (Mil Temp)
Endurance - write/erase cycles (Mil Temp)
A
9
Voltage for sector protect (V
ID
) (3)
-55 to +125
-2.0 to +7.0
-2.0 to +7.0
-65 to +150
+300
20 years
100,000 cycles min.
-2.0 to +14.0
V
Unit
°C
V
V
°C
°C
Parameter
OE capacitance
WE
1-4
capacitance
HIP (PGA)
CQFP G4T
CQFP G2U/G1U
CS
1-4
capacitance
Data I/O capacitance
Address input capacitance
NOTES:
1. Stresses above the absolute maximum rating may cause permanent damage
to the device. Extended operation at the maximum levels may degrade
performance and affect reliability.
2. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions,
inputs may overshoot V
SS
to -2.0 V for periods of up to 20ns. Maximum DC
voltage on output and I/O pins is V
CC
+ 0.5V. During voltage transitions,
outputs may overshoot to Vcc + 2.0 V for periods of up to 20ns.
3. Minimum DC input voltage on A
9
pin is -0.5V. During voltage transitions, A
9
may overshoot Vss to -2V for periods of up to 20ns. Maximum DC input
voltage on A
9
is +13.5V which may overshoot to 14.0 V for periods
up to 20ns.
CAPACITANCE
(T
A
= +25°C)
Symbol
C
OE
C
WE
Conditions
V
IN
= 0 V, f = 1.0 MHz
V
IN
= 0 V, f = 1.0 MHz
20
50
15
C
CS
C
I/O
C
AD
V
IN
= 0 V, f = 1.0 MHz
V
I/O
= 0 V, f = 1.0 MHz
V
IN
= 0 V, f = 1.0 MHz
20
20
50
pF
pF
pF
Max
50
Unit
pF
pF
This parameter is guaranteed by design but not tested.
LOW CAPACITANCE CQFP
(T
A
= +25°C)
Parameter
OE capacitance
CQFP G4 capacitance
CS
1-4
capacitance
Data I/O capacitance
Address input
capacitance
Symbol
C
OE
C
WE
C
CS
C
I/O
C
AD
Conditions
V
IN
= 0 V, f = 1.0 MHz
V
IN
= 0 V, f = 1.0 MHz
V
IN
= 0 V, f = 1.0 MHz
V
I/O
= 0 V, f = 1.0 MHz
V
IN
= 0 V, f = 1.0 MHz
Max
32
32
15
15
32
Unit
pF
pF
pF
pF
pF
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Input High Voltage
Input Low Voltage
Operating Temp. (Mil.)
Operating Temp. (Ind.)
A
9
Voltage for Sector Protect
Symbol
V
CC
V
IH
V
IL
T
A
T
A
V
ID
Min
4.5
2.0
-0.5
-55
-40
11.5
Max
5.5
V
CC
+ 0.5
+0.8
+125
+85
12.5
Unit
V
V
V
°C
°C
V
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS - CMOS COMPATIBLE
(V
CC
= 5.0V, V
SS
= 0V, T
A
= -55°C to +125°C)
Parameter
Input Leakage Current
Output Leakage Current
V
CC
Active Current for Read (1)
V
CC
Active Current for Program or Erase (2)
V
CC
Standby Current
V
CC
Static Current
Output Low Voltage
Output High Voltage
Low V
CC
Lock-Out Voltage
Symbol
I
LI
I
LOx32
I
CC1
I
CC2
I
CC4
I
CC3
V
OL
V
OH1
V
LKO
Conditions
V
CC
= 5.5, V
IN
= GND or V
CC
V
CC
= 5.5, V
IN
= GND or V
CC
CS = V
IL
, OE = V
IH
, f = 5MHz
CS = V
IL
, OE = V
IH
V
CC
= 5.5, CS = V
IH
, f = 5MHz
V
CC
= 5.5, CS = V
IH
I
OL
= 8.0 mA, V
CC
= 4.5
I
OH
= 2.5 mA, V
CC
= 4.5
0.85
X
Min
Max
10
10
190
240
6.5
0.6
0.45
V
CC
4.2
Unit
µA
µA
mA
mA
mA
mA
V
V
V
3.2
DC test conditions: V
IL
= 0.3V, V
IH
= V
CC
- 0.3V
NOTES:
1. The I
CC
current listed includes both the DC operating current and the frequency dependent component (at 5 MHz). The frequency component typically
is less than 2 mA/MHz, with OE at V
IH
.
2. I
CC
active while Embedded Algorithm (program or erase) is in progress.
3
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
WF512K32-XXX5
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS,CS CONTROLLED
(V
CC
= 5.0V, V
SS
= 0V, T
A
= -55°C to +125°C)
Parameter
Write Cycle Time
Write Enable Setup Time
Chip Select Pulse Width
Address Setup Time
Data Setup Time
Data Hold Time
Address Hold Time
Chip Select Pulse Width High
Sector Erase Time (2)
Read Recovery Time
Chip Programming Time
Chip Erase Time (3)
NOTES:
1. Typical value for t
WHWH1
is 7µs.
2. Typical value for t
WHWH2
is 1sec.
3. Typical value for Chip Erase Time is 8sec.
Symbol
Min
t
AVAV
t
WLEL
t
ELEH
t
AVEL
t
DVEH
t
EHDX
t
ELAX
t
EHEL
t
WHWH2
t
GHEL
0
11
64
t
WC
t
WS
t
CP
t
AS
t
DS
t
DH
t
AH
t
CPH
60
0
40
0
40
0
40
20
300
15
0
11
64
-60
Max
Min
70
0
45
0
45
0
45
20
300
15
0
11
64
-70
Max
Min
90
0
45
0
45
0
45
20
300
15
0
11
64
-90
Max
Min
120
0
50
0
50
0
50
20
300
15
0
11
64
-120
Max
-150
Min
150
0
50
0
50
0
50
20
300
15
Max
ns
ns
ns
ns
ns
ns
ns
ns
µs
sec
ns
sec
sec
Unit
Duration of Byte Programming Operation (1) t
WHWH1
FIG. 4
AC TEST CIRCUIT
Current Source
I
OL
AC TEST CONDITIONS
Parameter
Input Pulse Levels
Input Rise and Fall
Input and Output Reference Level
D.U.T.
V
Z
Typ
V
IL
= 0, V
IH
= 3.0
5
1.5
1.5
Unit
V
ns
V
V
1.5V
Output Timing Reference Level
C
eff
= 50 pf
(Bipolar Supply)
I
OH
Current Source
NOTES:
V
Z
is programmable from -2V to +7V.
I
OL
& I
OH
programmable from 0 to 16mA.
Tester Impedance Z
0
= 75
Ω.
V
Z
is typically the midpoint of V
OH
and V
OL
.
I
OL
& I
OH
are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
4
WF512K32-XXX5
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, WE CONTROLLED
(V
CC
= 5.0V, T
A
= -55°C to +125°C)
Parameter
Write Cycle Time
Chip Select Setup Time
Write Enable Pulse Width
Address Setup Time
Data Setup Time
Data Hold Time
Address Hold Time
Write Enable Pulse Width High
Duration of Byte Programming Operation (1)
Sector Erase Time (2)
Read Recovery Time before Write
V
CC
Set-up Time
Chip Programming Time
Output Enable Setup Time
Output Enable Hold Time (4)
Chip Erase Time (3)
NOTES:
1. Typical value for t
WHWH1
is 7µs.
2. Typical value for t
WHWH2
is 1sec.
3. Typical value for Chip Erase Time is 8sec.
4. For Toggle and Data Polling.
t
OES
t
OEH
0
10
64
Symbol
Min
t
AVAV
t
ELWL
t
WLWH
t
AVWH
t
DVWH
t
WHDX
t
WHAX
t
WHWL
t
WHWH1
t
WHWH2
t
GHWL
t
VCS
0
50
11
0
10
64
t
WC
t
CS
t
WP
t
AS
t
DS
t
DH
t
AH
t
WPH
60
0
40
0
40
0
40
20
300
15
0
50
11
0
10
64
-60
Max
Min
70
0
45
0
45
0
45
20
300
15
0
50
11
0
10
64
-70
Max
Min
90
0
45
0
45
0
45
20
300
15
0
50
11
0
10
64
-90
Max
-120
Min
120
0
50
0
50
0
50
20
300
15
0
50
11
Max
-150
Min
0
50
0
50
0
50
20
300
15
Max
Unit
WF512K32-XXX5
150
ns
ns
ns
ns
ns
ns
ns
ns
µs
sec
ns
µs
sec
ns
ns
sec
AC CHARACTERISTICS – READ ONLY OPERATIONS
(V
CC
= 5.0V, T
A
= -55°C to +125°C)
Parameter
Read Cycle Time
Address Access Time
Chip Select Access Time
Output Enable to Output Valid
Chip Select to Output High Z (1)
Output Enable High to Output High Z (1)
Output Hold from Address, CS or OE Change,
whichever is First
1. Guaranteed by design, but not tested
Symbol
Min
t
AVAV
t
AVQV
t
ELQV
t
GLQV
t
EHQZ
t
GHQZ
t
AXQX
t
RC
t
ACC
t
CE
t
OE
t
DF
t
DF
t
OH
0
60
60
60
30
20
20
0
-60
Max
Min
70
70
70
35
20
20
0
-70
Max
Min
90
90
90
35
20
20
0
-90
Max
Min
120
120
120
50
30
30
0
-120
Max
-150
Min
150
150
150
55
35
35
Max
ns
ns
ns
ns
ns
ns
ns
Unit
5
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
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