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WP710A10SGD

Non-Isolated DC/DC Converters 7.5W 24V 5Vout 1.5A Horizontal Mount

器件类别:光电子/LED   

厂商名称:Kingbright

厂商官网:http://www.us.kingbright.com

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器件参数
参数名称
属性值
产品种类
Product Category
Standard LEDs - Through Hole
制造商
Manufacturer
Kingbright
RoHS
Details
封装 / 箱体
Package / Case
T-1 (3 mm)
Illumination Color
Green
Wavelength/Color Temperature
568 nm
Luminous Intensity
40 mcd
Viewing Angle
40 deg
Lens Color/Style
Tinted, Diffused
If - Forward Current
20 mA
Vf - Forward Voltage
2.2 V
功率额定值
Power Rating
62.5 mW
长度
Length
3 mm
宽度
Width
3 mm
高度
Height
4.6 mm
最大工作温度
Maximum Operating Temperature
+ 85 C
最小工作温度
Minimum Operating Temperature
- 40 C
系列
Packaging
Bulk
LED Size
T-1 (3 mm)
Lens Dimensions
3 mm x 4.6 mm
Lens Shape
Dome
安装风格
Mounting Style
Through Hole
Number of LEDs
1
工作电源电压
Operating Supply Voltage
2.2 V
Peak Wavelength
565 nm
工厂包装数量
Factory Pack Quantity
1000
类型
Type
Solid State LED Lamp
Vr - Reverse Voltage
5 V
Wavelength
568 nm
文档预览
WP710A10SGD
T-1 (3mm) Solid State Lamp
DESCRIPTION
The Super Bright Green source color devices are
made with Gallium Phosphide Green Light Emitting
Diode
PACKAGE DIMENSIONS
FEATURES
Low power consumption
Popular T-1 diameter package
General purpose leads
Reliable and rugged
Long life - solid state reliability
Available on tape and reel
RoHS compliant
APPLICATIONS
Status indicator
Illuminator
Signage applications
Decorative and entertainment lighting
Commercial and residential architectural lighting
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the leads emerge from the package.
4. The specifications, characteristics and technical data described in the datasheet are subject to change
without prior notice.
SELECTION GUIDE
Part Number
Emitting Color
(Material)
Iv (mcd) @ 20mA
[2]
Lens Type
Min.
Typ.
2θ1/2
Viewing Angle
[1]
WP710A10SGD
Super Bright Green (GaP)
Green Diffused
18
40
50°
Notes:
1.
θ1/2
is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
3. Luminous intensity value is traceable to CIE127-2007 standards.
© 2017 Kingbright. All Rights Reserved. Spec No: DSAL0544 / 1101029079 Rev No: V.5B Date: 06/06/2017
Page 1 / 5
WP710A10SGD
ELECTRICAL / OPTICAL CHARACTERISTICS at T
A
=25°C
Parameter
Wavelength at Peak Emission I
F
= 20mA
Dominant Wavelength I
F
= 20mA
Spectral Bandwidth at 50%
Φ
REL MAX
I
F
= 20mA
Capacitance
Forward Voltage I
F
= 20mA
Reverse Current (V
R
= 5V)
Temperature Coefficient of
λ
peak
I
F
= 20mA, -10°C
T
85°C
Temperature Coefficient of
λ
dom
I
F
= 20mA, -10°C
T
85°C
Temperature Coefficient of V
F
I
F
= 20mA, -10°C
T
85°C
Symbol
λ
peak
λ
dom [1]
Δλ
C
V
F [2]
I
R
TC
λpeak
TC
λdom
TC
V
Emitting Color
Super Bright Green
Super Bright Green
Super Bright Green
Super Bright Green
Super Bright Green
Super Bright Green
Super Bright Green
Super Bright Green
Super Bright Green
Value
Typ.
565
568
30
15
2.2
-
-
-
-
Max.
-
-
-
-
2.5
10
-
-
-
Unit
nm
nm
nm
pF
V
uA
nm/°C
nm/°C
mV/°C
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance
λd
: ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
ABSOLUTE MAXIMUM RATINGS at T
A
=25°C
Parameter
Power Dissipation
Reverse Voltage
Junction Temperature
Operating Temperature
Storage Temperature
DC Forward Current
Peak Forward Current
Electrostatic Discharge Threshold (HBM)
Thermal Resistance (Junction / Ambient)
Thermal Resistance (Junction / Solder point)
Lead Solder Temperature
[3]
Lead Solder Temperature
[4]
Symbol
P
D
V
R
T
j
T
op
T
stg
I
F
I
FM [1]
Value
62.5
5
110
-40 To +85
-40 To +85
25
140
8000
650
320
260°C For 3 Seconds
260°C For 5 Seconds
Unit
mW
V
°C
°C
°C
mA
mA
V
°C/W
°C/W
-
R
th JA [2]
R
th JS [2]
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. R
t h JA
,R
t h JS
Results from mounting on PC board FR4 (pad size
16 mm
2
per pad).
3. 2mm below package base.
4. 5mm below package base.
5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
© 2017 Kingbright. All Rights Reserved. Spec No: DSAL0544 / 1101029079 Rev No: V.5B Date: 06/06/2017
Page 2 / 5
WP710A10SGD
TECHNICAL DATA
RELATIVE INTENSITY vs. WAVELENGTH
100%
Relative Intensity (a. u.)
80%
60%
40%
20%
-75°
0%
350
400
450
500
550
600
Wavelength (nm)
650
700
750
800
-60°
T
a
= 25 °C
Green
T
a
= 25 °C
-45°
-15°
-30°
SPATIAL DISTRIBUTION
15°
30°
45°
60°
75°
-90°
1.0
0.5
0.0
0.5
90°
1.0
SUPER BRIGHT GREEN
Forward Current vs.
Forward Voltage
Luminous Intensity vs.
Forward Current
Forward Current Derating Curve
Luminous Intensity vs.
Ambient Temperature
Luminous intensity normalised at
20 mA
Permissible forward current (mA)
T
a
= 25 °C
Forward current (mA)
40
30
20
10
0
1.7
2.0
1.5
1.0
0.5
0.0
0
T
a
= 25 °C
40
30
20
10
0
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
Luminous intensity normalised
at T
a
= 25 °C
50
2.5
50
2.5
2.0
1.5
1.0
0.5
0.0
-40 -20 0 20 40 60 80 100
Ambient temperature (°C)
1.9
2.1
2.3
2.5
Forward voltage (V)
2.7
10
20
30
40
Forward current (mA)
50
RECOMMENDED WAVE SOLDERING PROFILE
Notes:
1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple
attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath
temperature of 260°C
2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max).
3. Do not apply stress to the epoxy resin while the temperature is above 85°C.
4. Fixtures should not incur stress on the component when mounting and during soldering process.
5. SAC 305 solder alloy is recommended.
6. No more than one wave soldering pass.
PACKING & LABEL SPECIFICATIONS
© 2017 Kingbright. All Rights Reserved. Spec No: DSAL0544 / 1101029079 Rev No: V.5B Date: 06/06/2017
Page 3 / 5
WP710A10SGD
PRECAUTIONS
Storage conditions
1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient
temperature.
2. LEDs should be stored with temperature
30°C and relative humidity < 60%.
3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.
Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.
LED Mounting Method
1. The lead pitch of the LED must match the
pitch of the mounting holes on the PCB
during component placement.
Lead-forming may be required to insure
the lead pitch matches the hole pitch.
Refer to the figure below for proper lead
forming procedures.
Note 1-3: Do not route PCB trace in the contact area between the
leadframe and the PCB to prevent short-circuits.
"
"
Correct mounting method
"
x
"
Incorrect mounting method
2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.
Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the
internal structures and cause failure.
3. Use stand-offs
(Fig.1)
or spacers
(Fig.2)
to securely position the LED above the PCB.
4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead
bend
(Fig. 3 ,Fig. 4)
.
5. During lead forming, use tools or jigs to hold the leads securely so that the bending force
will not be transmitted to the LED lens and its internal structures. Do not perform lead
forming once the component has been mounted onto the PCB.
(Fig. 5 )
© 2017 Kingbright. All Rights Reserved. Spec No: DSAL0544 / 1101029079 Rev No: V.5B Date: 06/06/2017
Page 4 / 5
WP710A10SGD
Lead Forming Procedures
1. Do not bend the leads more than twice.
(Fig. 6 )
2. During soldering, component covers and holders should leave
clearance to avoid placing damaging stress on the LED during
soldering.
(Fig. 7)
3. The tip of the soldering iron should never touch the lens epoxy.
4. Through-hole LEDs are incompatible with reflow soldering.
5. If the LED will undergo multiple soldering passes or face other
processes where the part may be subjected to intense heat,
please check with Kingbright for compatibility.
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at
http://www.KingbrightUSA.com/ApplicationNotes
PRECAUTIONARY NOTES
© 2017 Kingbright. All Rights Reserved. Spec No: DSAL0544 / 1101029079 Rev No: V.5B Date: 06/06/2017
Page 5 / 5
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