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WP710A10ZGC/G

T-1 (3mm) Solid State Lamp

DESCRIPTIONS

The Green source color devices are made with InGaN

Light Emitting Diode

Electrostatic discharge and power surge could

damage the LEDs

It is recommended to use a wrist band or

anti-electrostatic glove when handling the LEDs

All devices, equipments and machineries must be

electrically grounded

PACKAGE DIMENSIONS

FEATURES

Low power consumption

Popular T-1 diameter package

General purpose leads

Reliable and rugged

Long life - solid state reliability

Available on tape and reel

RoHS compliant

APPLICATIONS

Status indicator

Illuminator

Signage applications

Decorative and entertainment lighting

Commercial and residential architectural lighting

ATTENTION

Observe precautions for handling

electrostatic discharge sensitive devices

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ±0.25(0.01") unless otherwise noted.

3. Lead spacing is measured where the leads emerge from the package.

4. The specifications, characteristics and technical data described in the datasheet are subject to change

without prior notice.

SELECTION GUIDE

Part Number

Emitting Color

(Material)

Iv (mcd) @ 20mA

[2]

Lens Type

Min.

Typ.

2θ1/2

Viewing Angle

[1]

WP710A10ZGC/G

■

Green (InGaN)

Water Clear

8000

14000

30°

Notes:

θ1/2

is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.

2. Luminous intensity / luminous flux: +/-15%.

3. Luminous intensity value is traceable to CIE127-2007 standards.

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WP710A10ZGC/G

ELECTRICAL / OPTICAL CHARACTERISTICS at T

=25°C

Parameter

Wavelength at Peak Emission I

= 20mA

Dominant Wavelength I

= 20mA

Spectral Bandwidth at 50%

REL MAX

= 20mA

Capacitance

Forward Voltage I

= 20mA

Reverse Current (V

= 5V)

Symbol

peak

dom [1]

Δλ

F [2]

Emitting Color

Green

Value

Typ.

520

525

100

3.2

Max.

4.0

Unit

Notes:

1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance

λd

: ±1nm. )

2. Forward voltage: ±0.1V.

3. Wavelength value is traceable to CIE127-2007 standards.

4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.

ABSOLUTE MAXIMUM RATINGS at T

=25°C

Parameter

Power Dissipation

Reverse Voltage

Junction Temperature

Operating Temperature

Storage Temperature

DC Forward Current

Peak Forward Current

Electrostatic Discharge Threshold (HBM)

Lead Solder Temperature

[2]

Lead Solder Temperature

[3]

Symbol

stg

FM [1]

Value

120

115

-40 to +85

100

450

260°C For 3 Seconds

260°C For 5 Seconds

Unit

°C

Notes:

1. 1/10 Duty Cycle, 0.1ms Pulse Width.

2. 2mm below package base.

3. 5mm below package base.

4. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

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WP710A10ZGC/G

TECHNICAL DATA

RELATIVE INTENSITY vs. WAVELENGTH

100%

Relative Intensity (a. u.)

80%

60%

40%

20%

350

-60°

= 25 °C

Green

= 25 °C

-30°

-45°

-15°

SPATIAL DISTRIBUTION

0°

15°

30°

45°

60°

-75°

400

450

500

550

600

Wavelength (nm)

650

700

750

800

75°

-90°

1.0

0.5

0.0

0.5

90°

1.0

GREEN

Forward Current vs.

Forward Voltage

Luminous Intensity vs.

Forward Current

Forward Current Derating Curve

Luminous Intensity vs.

Ambient Temperature

Luminous intensity normalised at

20 mA

Permissible forward current (mA)

= 25 °C

Forward current (mA)

2.0

1.5

1.0

0.5

0.0

= 25 °C

-40 -20 0 20 40 60 80 100

Ambient temperature (°C)

Luminous intensity normalised at

= 25 °C

2.5

2.0

1.5

1.0

0.5

0.0

-40 -20 0 20 40 60 80 100

Ambient temperature (°C)

2.5

3.0

3.5

4.0

Forward voltage (V)

4.5

Forward current (mA)

RECOMMENDED WAVE SOLDERING PROFILE

Notes:

1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple

attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath

temperature of 260°C

2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max).

3. Do not apply stress to the epoxy resin while the temperature is above 85°C.

4. Fixtures should not incur stress on the component when mounting and during soldering process.

5. SAC 305 solder alloy is recommended.

6. No more than one wave soldering pass.

PACKING & LABEL SPECIFICATIONS

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WP710A10ZGC/G

PRECAUTIONS

Storage conditions

1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient

temperature.

2. LEDs should be stored with temperature

≤

30°C and relative humidity < 60%.

3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.

Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.

LED Mounting Method

1. The lead pitch of the LED must match the

pitch of the mounting holes on the PCB

during component placement.

Lead-forming may be required to insure

the lead pitch matches the hole pitch.

Refer to the figure below for proper lead

forming procedures.

Note 1-3: Do not route PCB trace in the contact area between the

leadframe and the PCB to prevent short-circuits.

○

Correct mounting method

Incorrect mounting method

2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.

Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the

internal structures and cause failure.

3. Use stand-offs

(Fig.1)

or spacers

(Fig.2)

to securely position the LED above the PCB.

4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead

bend

(Fig. 3 ,Fig. 4)

5. During lead forming, use tools or jigs to hold the leads securely so that the bending force

will not be transmitted to the LED lens and its internal structures. Do not perform lead

forming once the component has been mounted onto the PCB.

(Fig. 5 )

Page 4 / 5

WP710A10ZGC/G

Lead Forming Procedures

1. Do not bend the leads more than twice.

(Fig. 6 )

2. During soldering, component covers and holders should leave

clearance to avoid placing damaging stress on the LED during

soldering.

(Fig. 7)

3. The tip of the soldering iron should never touch the lens epoxy.

4. Through-hole LEDs are incompatible with reflow soldering.

5. If the LED will undergo multiple soldering passes or face other

processes where the part may be subjected to intense heat,

please check with Kingbright for compatibility.

1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.

2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to

the latest datasheet for the updated specifications.

3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If

customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.

4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening

liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.

5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.

6. All design applications should refer to Kingbright application notes available at

http://www.KingbrightUSA.com/ApplicationNotes

PRECAUTIONARY NOTES

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