Approval sheet
WR02X(W)
±
5%,
±
1%
Thick Film General purpose chip resistors
Size 0201
*Contents in this sheet are subject to change without prior notice.
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ASC_WR02X_V15
Jan. - 2013
Approval sheet
FEATURE
1. Small size and light weight
2. High reliability and stability
3. Reduced size of final equipment
4. Suitable for high density print circuit board assembly
5. Higher component and equipment reliability
6. Lead free product
APPLICATION
•
•
•
•
•
Mobile phone
PDA
Camcorders
Palmtop computers
Hybrid module
DESCRIPTION
The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are
added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The
composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to
nominated value within tolerance which controlled by laser trimming of this resistive layer.
The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For
ease of soldering the outer layer of these end terminations is a pure Tin.
Fig 1. Construction of Chip-R WR02X
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ASC_WR02X_V15
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Approval sheet
QUICK REFERENCE DATA
Item
Series No.
Size code
Resistance Range
General Specification
WR02X(W)
0201(0603)
1Ω~10MΩ (
±5%
tolerance ), Jumper
1Ω~3.3MΩ (
±1%
tolerance )
Resistance Tolerance
±1%
E96/E24
±5%
E24
10Ω - 10MΩ,
≤±200
1
-
9.76Ω, +600~-200
TCR (ppm/°C)
Max. dissipation @ T
amb
=70°C
Max. Operation Voltage (DC or RMS)
Max. Overload Voltage (DC or RMS)
Climatic category
(IEC 60068)
Note :
1.
2.
1/20 W
25V
50V
55/125/56
This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication
60115-8”
Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by
RCWV
=
Rated Power
×
Resistance Value
or Max. RCWV listed above, whichever is lower.
DIMENSION(unit : mm)
Protective c oat
WR02X(W)
L
W
T
Tb
Tt
0.60
±
0.03
0.30
±
0.03
0.23
±
0.03
0.15
±
0.05
0.10
±
0.05
W T
L
T
End term ination
Tb
Tt
Resistive layer
Ceramic S
ubstrate
MARKING
WR02X(W) has no marking.
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Approval sheet
FUNCTIONAL DESCRIPTION
Product characterization
Standard values of nominal resistance are taken from the E24/E96 series for resistors with a tolerance of
±5%
&
±1%.
The values of the E24/E96 series are in accordance with “IEC publication 60063”
Derating
The power that the resistor can dissipate depends on the operating temperature; see Fig.2
Figure 2. Maximum dissipation in percentage of rated power
As a function of the ambient temperature
MOUNTING
Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by
automatic placement systems.
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.
SOLDERING CONDITION
The robust construction of chip resistors allows them to
be completely immersed in a solder bath of 260°C for 10
seconds. Therefore, it is possible to mount Surface
Mount Resistors on one side of a PCB and other
discrete components on the reverse (mixed PCBs).
Surface Mount Resistors are tested for solderability at
235°C during 2 seconds. The test condition for no
leaching is 260°C for 30 seconds. Typical examples of
soldering processes that provide reliable joints without
any damage are given in Fig 3.
Fig 3. Infrared soldering profile for Chip Resistors WR02X(W)
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Approval sheet
CATALOGUE NUMBERS
The resistors have a catalogue number starting with :
WR02
Size code
WR02
: 0201
Type code
X : Normal
W : 1% For <10Ω and
>1MΩ
X
472_
Resistance code
5%, E24: 2 significant digits
followed by no. of
zeros
100Ω
10KΩ
= 101_
= 103
J
Tolerance
J :
±5%
F :
±1%
P : Jumper
A
Packaging code
A : 7” Reeled taping
(15Kpcs/Reel)
T : 7” Reeled taping
(10Kpcs/Reel)
D : 7” Reeled taping
(20Kpcs/Reel)
L
Termination code
L
=
Sn base (lead
free)
1%, E24+E96: 3 significant
digits followed by no.
of zeros
100Ω
37.4KΩ
=1000
=3742
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Jan. - 2013
模拟与混合信号
