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RODUCT

NTRODUCTION –

X28HC256DM-12

Rochester Electronics has re-introduced and continues to manufacture critically needed semiconductors with the full

authorization of the original manufacturer and an attention to quality that meets or exceeds the original component.

Original Manufacturer:

X28HC256DM-12

Re-introduced by

Rochester Electronics on

October, 31, 2012

Original Part Number:

X28HC256DM-12

Description:

256K EEPROM

Package:

28 pin DIP

Manufacturing Flow:

MTO

Endurance:

1,000,000 cycles

Available in

Pb-Free

versions

[ by temperature / package type / speed / application ]

Related Devices

X28HC256D-12

X28HC256D-90

X28HC256DI-15

X28HC256DMB-15

X28HC256EI-12

X28HC256FM-90

X28HC256JM-15T1

X28HC256KI-15

X28HC256PM-12

X28HC256KMB-15

LOW POWER CMOS EEPROM

with hi-speed page write capability

The X28HC256 is a second generation high

performance CMOS 32k x 8 EEPROM. It is fabricated

with Intersil’s proprietary, textured poly floating

gate technology, providing a highly reliable 5V only

nonvolatile memory. The X28HC256 supports a 128-

byte page write operation, effectively providing

a 24µs/byte write cycle, and enabling the entire

memory to be typically rewritten in less than 0.8

seconds. The X28HC256 also features DATA

Polling and Toggle Bit Polling, two methods

of providing early end of write detection.

Worldwide Corporate Headquarters

16 Malcolm Hoyt Drive . Newburyport, MA 01950

phone

978.462.9332 .

sales@rocelec.com .

web

www.rocelec.com

X28HC256

256k, 32k x 8-Bit

Data Sheet

May 7, 2007

FN8108.2

5V, Byte Alterable EEPROM

The X28HC256 is a second generation high performance

CMOS 32k x 8 EEPROM. It is fabricated with Intersil’s

proprietary, textured poly floating gate technology, providing

a highly reliable 5V only nonvolatile memory.

The X28HC256 supports a 128-byte page write operation,

effectively providing a 24µs/byte write cycle, and enabling

the entire memory to be typically rewritten in less than 0.8

seconds. The X28HC256 also features DATA Polling and

Toggle Bit Polling, two methods of providing early end of

write detection. The X28HC256 also supports the JEDEC

standard Software Data Protection feature for protecting

against inadvertent writes during power-up and power-down.

Endurance for the X28HC256 is specified as a minimum

1,000,000 write cycles per byte and an inherent data

retention of 100 years.

Features

• Access time: 70ns

• Simple byte and page write

- Single 5V supply

- No external high voltages or V

P-P

control circuits

- Self-timed

- No erase before write

- No complex programming algorithms

- No overerase problem

• Low power CMOS

- Active: 60mA

- Standby: 500µA

• Software data protection

- Protects data against system level inadvertent writes

• High speed page write capability

• Highly reliable Direct Write

™

cell

- Endurance: 1,000,000 cycles

- Data retention: 100 years

• Early end of write detection

- DATA polling

- Toggle bit polling

• Pb-free plus anneal available (RoHS compliant)

Block Diagram

X BUFFERS

LATCHES AND

DECODER

TO A

ADDRESS

INPUTS

Y BUFFERS

LATCHES AND

DECODER

I/O BUFFERS

AND LATCHES

256kBIT

EEPROM

ARRAY

I/O

TO I/O

DATA INPUTS/OUTPUTS

CONTROL

LOGIC AND

TIMING

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 1-888-468-3774

Intersil (and design) is a registered trademark of Intersil Americas Inc.

All other trademarks mentioned are the property of their respective owners.

X28HC256

Ordering Information

PART NUMBER

X28HC256DI-15

X28HC256DM-15

X28HC256DMB-15

X28HC256EMB-15

X28HC256FMB-15

X28HC256J-15*, **

X28HC256JZ-15* (Note)

X28HC256JI-15*, **

X28HC256JIZ-15* (Note)

X28HC256JM-15*

X28HC256KI-15

X28HC256KM-15

X28HC256KMB-15

X28HC256P-15

X28HC256PZ-15 (Note)

X28HC256PI-15

X28HC256PIZ-15 (Note)

X28HC256PM-15

X28HC256SI-15*

X28HC256SIZ-15* (Note)

X28HC256SM-15

X28HC256D-12

X28HC256DI-12

X28HC256DM-12

X28HC256DMB-12

X28HC256EI-12

X28HC256EM-12

X28HC256EMB-12

X28HC256FMB-12

X28HC256J-12*

X28HC256JZ-12* (Note)

X28HC256JI-12*

X28HC256JIZ-12* (Note)

X28HC256KI-12

X28HC256KM-12

X28HC256KMB-12

X28HC256P-12

X28HC256PZ-12 (Note)

X28HC256PI-12

PART MARKING

X28HC256DI-15 RR

X28HC256DM-15 RR

C X28HC256DMB-15

C X28HC256EMB-15

C X28HC256FMB-15

X28HC256J-15 RR

X28HC256J-15 ZRR

X28HC256JI-15 RR

X28HC256JI-15 ZRR

X28HC256JM-15 RR

X28HC256KI-15 RR

X28HC256KM-15 RR

C X28HC256KMB-15

X28HC256P-15 RR

X28HC256P-15 RRZ

X28HC256PI-15 RR

X28HC256PI-15 RRZ

X28HC256PM-15 RR

X28HC256SI-15 RR

X28HC256SI-15 RRZ

X28HC256SM-15 RR

X28HC256D-12 RR

X28HC256DI-12 RR

X28HC256DM-12 RR

C X28HC256DMB-12

X28HC256EI-12 RR

X28HC256EM-12 RR

C X28HC256EMB-12

C X28HC256FMB-12

X28HC256J-12 RR

X28HC256J-12 ZRR

X28HC256JI-12 RR

X28HC256JI-12 ZRR

X28HC256KI-12 RR

X28HC256KM-12 RR

C X28HC256KMB-12

X28HC256P-12 RR

X28HC256P-12 RRZ

X28HC256PI-12 RR

120

ACCESS TIME

(ns)

150

TEMP. RANGE

(°C)

-40 to +85

-55 to +125

MIL-STD-883

0 to +70

-40 to +85

-55 to +125

-40 to +85

-55 to +125

MIL-STD-883

0 to +70

-40 to +85

-55 to +125

-40 to +85

-55 to +125

0 to +70

-40 to +85

-55 to +125

MIL-STD-883

-40 to +85

-55 to +125

MIL-STD-883

0 to +70

-40 to +85

-55 to +125

MIL-STD-883

0 to +70

-40 to +85

28 Ld CERDIP

32 Ld LCC (458 mils)

28 Ld FLATPACK (440 mils)

32 Ld PLCC

32 Ld PLCC (Pb-free)

32 Ld PLCC

32 Ld PLCC (Pb-free)

32 Ld PLCC

28 Ld PGA

28 Ld PDIP

28 Ld PDIP (Pb-free)***

28 Ld PDIP

28 Ld PDIP (Pb-free)***

28 Ld PDIP

28 Ld SOIC (300 mil)

28 Ld SOIC (300 mil) (Pb-free)

28 Ld SOIC (300 mil)

28 Ld CERDIP (520 mils)

32 Ld LCC (458 mils)

28 Ld FLATPACK (440 mils)

32 Ld PLCC

32 Ld PLCC (Pb-free)

32 Ld PLCC

32 Ld PLCC (Pb-free)

28 Ld PGA

28 Ld PDIP

28 Ld PDIP (Pb-free)***

28 Ld PDIP

N32.45x55

G28.550x650A

E28.6

N32.45x55

G28.550x650A

E28.6

MDP0027

F28.6

PACKAGE

PKG. DWG. #

F28.6

FN8108.2

May 7, 2007

X28HC256

Ordering Information

(Continued)

PART NUMBER

X28HC256PIZ-12 (Note)

X28HC256S-12*

X28HC256SZ-12 (Note)

X28HC256SI-12*

X28HC256SIZ-12 (Note)

X28HC256SM-12*, **

X28HC256D-90

X28HC256DI-90

X28HC256DM-90

X28HC256DMB-90

X28HC256EM-90

X28HC256EMB-90

X28HC256FI-90

X28HC256FM-90

X28HC256FMB-90

X28HC256J-90*

X28HC256JZ-90* (Note)

X28HC256JI-90*

X28HC256JIZ-90* (Note)

X28HC256JM-90*

X28HC256KM-90

X28HC256KMB-90

X28HC256P-90

X28HC256PZ-90 (Note)

X28HC256PI-90

X28HC256PIZ-90 (Note)

X28HC256S-90*

X28HC256SI-90*

X28HC256SIZ-90 (Note)

X28HC256SI-20T1

*Add "T1" suffix for tape and reel.

**Add "T2" suffix for tape and reel.

***Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.

NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate

termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL

classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

PART MARKING

X28HC256PI-12 RRZ

X28HC256S-12 RR

X28HC256S-12 RRZ

X28HC256SI-12 RR

X28HC256SI-12 RRZ

X28HC256SM-12 RR

X28HC256D-90 RR

X28HC256DI-90 RR

X28HC256DM-90 RR

C X28HC256DMB-90

X28HC256EM-90 RR

C X28HC256EMB-90

X28HC256FI-90 RR

X28HC256FM-90 RR

C X28HC256FMB-90

X28HC256J-90 RR

X28HC256J-90 ZRR

X28HC256JI-90 RR

X28HC256JI-90 ZRR

X28HC256JM-90 RR

X28HC256KM-90 RR

C X28HC256KMB-90

X28HC256P-90 RR

X28HC256P-90 RRZ

X28HC256PI-90 RR

X28HC256PI-90 RRZ

X28HC256S-90 RR

X28HC256SI-90 RR

X28HC256SI-90 RRZ

200

120

ACCESS TIME

(ns)

TEMP. RANGE

(°C)

-40 to +85

0 to +70

-40 to +85

-55 to +125

0 to +70

-40 to +85

-55 to +125

MIL-STD-883

-55 to +125

MIL-STD-883

-40 to +85

-55 to +125

MIL-STD-883

0 to +70

-40 to +85

-55 to +125

MIL-STD-883

0 to +70

-40 to +85

0 to +70

-40 to +85

PACKAGE

28 Ld PDIP (Pb-free)***

28 Ld SOIC (300 mils)

28 Ld SOIC (300 mils) (Pb-free)

28 Ld SOIC (300 mils)

28 Ld SOIC (300 mils) (Pb-free)

28 Ld SOIC (300 mils)

28 Ld CERDIP (520 mils)

32 Ld LCC (458 mils)

28 Ld FLATPACK (440 mils)

32 Ld PLCC

32 Ld PLCC (Pb-free)

32 Ld PLCC

32 Ld PLCC (Pb-free)

32 Ld PLCC

28 Ld PGA

28 Ld PDIP

28 Ld PDIP (Pb-free)***

28 Ld PDIP

28 Ld PDIP (Pb-free)**

28 Ld SOIC (300 mils)

28 Ld SOIC (300 mils) (Pb-free)

28 Ld SOIC (300 mils) Tape and Reel

N32.45x55

G28.550x650A

E28.6

MDP0027

PKG. DWG. #

E28.6

MDP0027

F28.6

FN8108.2

May 7, 2007

X28HC256

Pinouts

X28HC256

(28 LD CERDIP, FLATPACK, PDIP, SOIC)

TOP VIEW

I/O

X28HC256

(32 LD PLCC, LCC)

TOP VIEW

X28HC256

(28 LD PGA)

BOTTOM VIEW

I/O I/O

I/O

I/O A

I/O

4 3

I/O

2 1 32 31 30

X28HC256

CE A

X28HC256

OE A

14 15 16 17 18 19 20

I/O

WE A

Pin Descriptions

Addresses (A

to A

)

The Address inputs select an 8-bit memory location during a

read or write operation.

Chip Enable (CE)

The Chip Enable input must be LOW to enable all read/write

operations. When CE is HIGH, power consumption is

reduced.

Output Enable (OE)

The Output Enable input controls the data output buffers,

and is used to initiate read operations.

Data In/Data Out (I/O

to I/O

)

Data is written to or read from the X28HC256 through the I/O

pins.

Write Enable (WE)

The Write Enable input controls the writing of data to the

X28HC256.

FN8108.2

May 7, 2007