Device Package
User Guide
UG112 (v3.7) September 5, 2012
R
R
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Device Package User Guide
www.xilinx.com
UG112 (v3.7) September 5, 2012
Revision History
The following table shows the revision history for this document.
Date
01/31/04
02/04/05
05/31/06
05/18/07
Version
1.0
1.1
2.0
3.0
Initial release
Added Pb-free packaging information.
Revision
Extensive updates and new material added.
Updated
“Material Data Declaration Sheet (MDDS)” in Chapter 1;
revised link to “Xilinx
Packaging Material Content Data for Standard and PB-Free Packages”.
Revised
“Part Marking” in Chapter 1;
added
“Ordering Information”, “Marking
Template”, Table 1-1: “Example Part Numbers (FPGA, CPLD, and PROM)”,
and
Table 1-2: “Xilinx Device Marking Definition—Example”.
Updated
“Flip-Chip BGA Packages” in Chapter 1;
added content to
“Package
Construction”
to clarify Type I and Type II lid usage.
Updated
“Thermal Management & Thermal Characterization Methods & Conditions” in
Chapter 3;
removed “Junction-to-Board Measurement -
ΨJB”,
added link to new
“Data
Acquisition and Package Thermal Database”,
added
Figure 3-11, page 53, “Package
Thermal Data Query for Device-Specific Data”
(query tool replaces Table 3-1: “Summary
of Thermal Resistance for Packages”, which was removed).
Updated
“Recommended PCB Design Rules for BGA, CSP, and CCGA Packages,”
page 87;
added missing (D) values for CP56 and CP132 packages and corrected SF363
package specification (D) value in
Table 5-3, page 88.
Added CS48 to
Table 5-4, page 88.
Updated
Table 6-2, page 108
to include MSL ratings for Pb-free packages.
Updated
“Package Peak Reflow Temperature” in Chapter 7;
correction to peak reflow
temperature. Added post-wash bake details to
“Post Reflow Washing”
section.
12/18/08
3.1
Added link to Package Thermal Data Query Tool on xilinx.com. Updated remaining
external links.
Added Spartan®-3A DSP information to
Table 1-1, page 13.
Added these packages to
Table 2-3, page 36:
FG484 and FGG484.
Added these packages to
Table 5-3, page 88:
SFG363, FF676, FGG484, FFG676, FT64 and
FTG64.
Removed these packages from
Table 5-3, page 88:
FF896, FFG896, FF1704, FFG1704,
FF1696 and FFG1696.
Added these packages to
Table 5-4, page 88:
CS484 and CSG484.
UG112 (v3.7) September 5, 2012
www.xilinx.com
Device Package User Guide
Date
03/17/09
Version
3.2
Revision
Revised
“Small Form Factor Packages,” page 15
to include description of third template
used for marking small form factor packages.
Revised
“Package Construction,” page 20
to describe flip-chip package vent hole
locations.
Added missing Pb-free packages to
Table 1-3, page 27.
Revised mass of FG676 and FGG676 packages in
Table 1-3, page 27.
Added CS484 and CSG484 information to
Table 1-3, page 27
and
Table 2-3, page 36.
Added FF1136 and FFG1136 tray and box information to
Table 2-3, page 36.
Changed link from DS529 to UG331 in third paragraph of
“Data Acquisition and
Package Thermal Database,” page 52.
Added CS484 electrical data to
Table 4-1, page 75.
Added note to
Table 5-3, page 88,
referring to UG195.
Revised humidity value in third paragraph of
“Dry Bake Recommendation and Dry Bag
Policy,” page 107.
Revised humidity value in first and fourth paragraph of
“Expiration Date,” page 107.
Updated links in
Table A-1, page 121.
04/23/09
3.3
Added FG400, FGG400, FF323, FFG323,
FF324, FFG324,
FF665, FFG665, FF676, FFG676,
FF1153, FFG1153, FF1156, FFG1156, FF1738, FFG1738, FF1760, and FFG1760 to
Table 2-3,
page 36.
Revised the via land diameters for CF1140, CF1144, and CF1509 packages in
Table 5-5,
page 89.
06/10/09
3.4
Revised third paragraph of
“Package Construction,” page 20
about EF flip-chip package
epoxy protection.
Revised second paragraph of
“Post Reflow Washing,” page 117
excepting EF packages
from cleaning solution/solvent recommendation.
11/06/09
3.5
Added link to MDDS documents under
“Material Data Declaration Sheet (MDDS),”
page 10.
Added FF896, EF1152, EF1704, FF1704, EF668, and EF672 to
Table 5-3, page 88.
Added EF957 to
Table 5-4, page 88.
Added CS225/CSG225 and CS324/CSG324 in
Table 2-3, page 36.
Added CF1752 to
heading in CF1509 column, and changed “Solder (ball) land pitch” to “Solder (column)
land pitch” in
Table 5-5, page 89.
Added VO48/VOG48 in
Table 6-2, page 108.
Updated
“Thermal Management,” page 39.
Updated
“Characterization Methods,”
page 47
and added
“Calibration of System Monitor,” page 47.
Removed T
t
and T
l
from
and added T
S
to
“Definition of Terms,” page 48.
Updated
“Junction-to-Case
Measurement — qJC,” page 49,
with JEDEC Standard JESD51-14. Updated document
references in
“Data Acquisition and Package Thermal Database,” page 52.
Removed
“Junction-to-Top Measurement —
Ψ
JT
” and “Support for Compact Thermal Models
(CTM).” Updated note for T
A
in
“Thermal Data Usage Examples,” page 54.
Updated
“Additional Power Management Options,” page 57.
09/22/10
3.6
09/05/12
3.7
Device Package User Guide
www.xilinx.com
UG112 (v3.7) September 5, 2012
Table of Contents
Revision History
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Chapter 1: Package Information
Package Overview
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Introduction to Xilinx Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Packaging Technology at Xilinx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Material Data Declaration Sheet (MDDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package Samples
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Specifications and Definitions
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Inches vs. Millimeters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pressure Handling Capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clockwise or Counterclockwise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Cavity-Up or Cavity-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
11
12
12
Part Marking
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Marking Template . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Package Technology Descriptions
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Pb-Free Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Cavity-Up Plastic BGA Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flip-Chip BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Assembling Flip-Chip BGAs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chip Scale Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quad Flat No-Lead (QFN) Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ceramic Column Grid Array (CCGA) Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermally Enhanced Lead Frame Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16
17
18
19
21
22
23
24
25
Package Mass Table
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Chapter 2: Pack and Ship
Introduction
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Tape and Reel
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Cover Tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bar Code Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Shipping Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Standard Bar Code Label Locations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
31
32
32
32
32
34
Tubes
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Trays
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Device Package User Guide
UG112 (v3.7) September 5, 2012
www.xilinx.com
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