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XC3S1200E-4FGG320CS1

Field Programmable Gate Array, 572MHz, 19512-Cell, CMOS, PBGA320,

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:XILINX(赛灵思)

厂商官网:https://www.xilinx.com/

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
XILINX(赛灵思)
包装说明
BGA, BGA320,18X18,40
Reach Compliance Code
unknown
ECCN代码
3A991.D
最大时钟频率
572 MHz
CLB-Max的组合延迟
0.76 ns
JESD-30 代码
S-PBGA-B320
JESD-609代码
e1
长度
19 mm
湿度敏感等级
3
可配置逻辑块数量
2168
等效关口数量
1200000
输入次数
250
逻辑单元数量
19512
输出次数
194
端子数量
320
最高工作温度
85 °C
最低工作温度
组织
2168 CLBS, 1200000 GATES
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装等效代码
BGA320,18X18,40
封装形状
SQUARE
封装形式
GRID ARRAY
峰值回流温度(摄氏度)
260
电源
1.2,1.2/3.3,2.5 V
可编程逻辑类型
FIELD PROGRAMMABLE GATE ARRAY
认证状态
Not Qualified
座面最大高度
2 mm
最大供电电压
1.26 V
最小供电电压
1.14 V
标称供电电压
1.2 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子面层
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
19 mm
文档预览
1
Spartan-3E FPGA Family
Data Sheet
Product Specification
DS312 December 14, 2018
Module 1:
Introduction and Ordering Information
DS312 (v4.2) December 14, 2018
Introduction
Features
Architectural Overview
Package Marking
Ordering Information
Module 3:
DC and Switching Characteristics
DS312 (v4.2) December 14, 2018
DC Electrical Characteristics
Absolute Maximum Ratings
Supply Voltage Specifications
Recommended Operating Conditions
DC Characteristics
I/O Timing
SLICE Timing
DCM Timing
Block RAM Timing
Multiplier Timing
Configuration and JTAG Timing
Module 2:
Functional Description
DS312 (v4.2) December 14, 2018
Input/Output Blocks (IOBs)
Overview
SelectIO™ Signal Standards
Switching Characteristics
Configurable Logic Block (CLB)
Block RAM
Dedicated Multipliers
Digital Clock Manager (DCM)
Clock Network
Configuration
Powering Spartan®-3E FPGAs
Production Stepping
Module 4:
Pinout Descriptions
DS312 (v4.2) December 14, 2018
Pin Descriptions
Package Overview
Pinout Tables
Footprint Diagrams
© Copyright 2005–2018 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, Artix, Kintex, Zynq, Vivado, and other designated brands included herein are trademarks of Xilinx
in the United States and other countries. PCI and PCI-X are trademarks of PCI-SIG and used under license. All other trademarks are the property of their respective owners.
DS312 December 14, 2018
Product Specification
www.xilinx.com
Send Feedback
1
8
Spartan-3E FPGA Family:
Introduction and Ordering Information
Product Specification
DS312 (v4.2) December 14, 2018
Introduction
The Spartan®-3E family of Field-Programmable Gate
Arrays (FPGAs) is specifically designed to meet the needs
of high volume, cost-sensitive consumer electronic
applications. The five-member family offers densities
ranging from 100,000 to 1.6 million system gates, as shown
in
Table 1.
The Spartan-3E family builds on the success of the earlier
Spartan-3 family by increasing the amount of logic per I/O,
significantly reducing the cost per logic cell. New features
improve system performance and reduce the cost of
configuration. These Spartan-3E FPGA enhancements,
combined with advanced 90 nm process technology, deliver
more functionality and bandwidth per dollar than was
previously possible, setting new standards in the
programmable logic industry.
Because of their exceptionally low cost, Spartan-3E FPGAs
are ideally suited to a wide range of consumer electronics
applications, including broadband access, home
networking, display/projection, and digital television
equipment.
The Spartan-3E family is a superior alternative to mask
programmed ASICs. FPGAs avoid the high initial cost, the
lengthy development cycles, and the inherent inflexibility of
conventional ASICs. Also, FPGA programmability permits
design upgrades in the field with no hardware replacement
necessary, an impossibility with ASICs.
LVCMOS, LVTTL, HSTL, and SSTL single-ended signal
standards
3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
622+ Mb/s data transfer rate per I/O
True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL
differential I/O
Enhanced Double Data Rate (DDR) support
DDR SDRAM support up to 333 Mb/s
Abundant, flexible logic resources
Densities up to 33,192 logic cells, including optional shift
register or distributed RAM support
Efficient wide multiplexers, wide logic
Fast look-ahead carry logic
Enhanced 18 x 18 multipliers with optional pipeline
IEEE 1149.1/1532 JTAG programming/debug port
Hierarchical SelectRAM™ memory architecture
Up to 648 Kbits of fast block RAM
Up to 231 Kbits of efficient distributed RAM
Up to eight Digital Clock Managers (DCMs)
Clock skew elimination (delay locked loop)
Frequency synthesis, multiplication, division
High-resolution phase shifting
Wide frequency range (5 MHz to over 300 MHz)
Eight global clocks plus eight additional clocks per each half
of device, plus abundant low-skew routing
Configuration interface to industry-standard PROMs
Low-cost, space-saving SPI serial Flash PROM
x8 or x8/x16 parallel NOR Flash PROM
Low-cost Xilinx®
Platform Flash
with JTAG
Complete Xilinx
ISE®
and
WebPACK™
software
MicroBlaze™
and
PicoBlaze
embedded processor cores
Fully compliant 32-/64-bit 33
MHz PCI support
(66 MHz in
some devices)
Low-cost QFP and BGA packaging options
Common footprints support easy density migration
Pb-free packaging options
XA Automotive version
available
Features
Very low cost, high-performance logic solution for
high-volume, consumer-oriented applications
Proven advanced 90-nanometer process technology
Multi-voltage, multi-standard SelectIO™ interface pins
Up to 376 I/O pins or 156 differential signal pairs
Table 1:
Summary of Spartan-3E FPGA Attributes
Device
System Equivalent
Gates Logic Cells
CLB Array
(One CLB = Four Slices)
Total
Total
Rows Columns
CLBs
Slices
22
16
240
960
34
26
612
2,448
46
34
1,164
4,656
60
46
2,168
8,672
76
58
3,688
14,752
Distributed
RAM bits
(1)
15K
38K
73K
136K
231K
Block
Dedicated
RAM
Multipliers
bits
(1)
72K
216K
360K
504K
648K
4
12
20
28
36
DCMs
2
4
4
8
8
Maximum
User I/O
108
172
232
304
376
Maximum
Differential
I/O Pairs
40
68
92
124
156
XC3S100E
100K
2,160
XC3S250E
250K
5,508
XC3S500E
500K
10,476
XC3S1200E 1200K
19,512
XC3S1600E 1600K
33,192
Notes:
1. By convention, one Kb is equivalent to 1,024 bits.
© Copyright 2005–2018 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, Artix, Kintex, Zynq, Vivado, and other designated brands included herein are trademarks of Xilinx
in the United States and other countries. PCI and PCI-X are trademarks of PCI-SIG and used under license. All other trademarks are the property of their respective owners.
DS312 (v4.2) December 14, 2018
Product Specification
www.xilinx.com
Send Feedback
2
Spartan-3E FPGA Family: Introduction and Ordering Information
Architectural Overview
The Spartan-3E family architecture consists of five
fundamental programmable functional elements:
Configurable Logic Blocks (CLBs)
contain flexible
Look-Up Tables (LUTs) that implement logic plus
storage elements used as flip-flops or latches. CLBs
perform a wide variety of logical functions as well as
store data.
Input/Output Blocks (IOBs)
control the flow of data
between the I/O pins and the internal logic of the
device. Each IOB supports bidirectional data flow plus
3-state operation. Supports a variety of signal
standards, including four high-performance differential
standards. Double Data-Rate (DDR) registers are
included.
Block RAM
provides data storage in the form of
18-Kbit dual-port blocks.
Multiplier Blocks
accept two 18-bit binary numbers as
inputs and calculate the product.
Digital Clock Manager (DCM) Blocks
provide
self-calibrating, fully digital solutions for distributing,
delaying, multiplying, dividing, and phase-shifting clock
signals.
These elements are organized as shown in
Figure 1.
A ring
of IOBs surrounds a regular array of CLBs. Each device has
two columns of block RAM except for the XC3S100E, which
has one column. Each RAM column consists of several
18-Kbit RAM blocks. Each block RAM is associated with a
dedicated multiplier. The DCMs are positioned in the center
with two at the top and two at the bottom of the device. The
XC3S100E has only one DCM at the top and bottom, while
the XC3S1200E and XC3S1600E add two DCMs in the
middle of the left and right sides.
The Spartan-3E family features a rich network of traces that
interconnect all five functional elements, transmitting
signals among them. Each functional element has an
associated switch matrix that permits multiple connections
to the routing.
X-Ref Target - Figure 1
Figure 1:
Spartan-3E Family Architecture
DS312 (v4.2) December 14, 2018
Product Specification
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3
Spartan-3E FPGA Family: Introduction and Ordering Information
Configuration
Spartan-3E FPGAs are programmed by loading
configuration data into robust, reprogrammable, static
CMOS configuration latches (CCLs) that collectively control
all functional elements and routing resources. The FPGA’s
configuration data is stored externally in a PROM or some
other non-volatile medium, either on or off the board. After
applying power, the configuration data is written to the
FPGA using any of seven different modes:
Master Serial from a Xilinx Platform Flash PROM
Serial Peripheral Interface (SPI) from an
industry-standard SPI serial Flash
Byte Peripheral Interface (BPI) Up or Down from an
industry-standard x8 or x8/x16 parallel NOR Flash
Slave Serial, typically downloaded from a processor
Slave Parallel, typically downloaded from a processor
Boundary Scan (JTAG), typically downloaded from a
processor or system tester.
I/O Capabilities
The Spartan-3E FPGA SelectIO interface supports many
popular single-ended and differential standards.
Table 2
shows the number of user I/Os as well as the number of
differential I/O pairs available for each device/package
combination.
Spartan-3E FPGAs support the following single-ended
standards:
3.3V low-voltage TTL (LVTTL)
Low-voltage CMOS (LVCMOS) at 3.3V, 2.5V, 1.8V,
1.5V, or 1.2V
3V PCI at 33 MHz, and in some devices,
66 MHz
HSTL I and III at 1.8V, commonly used in memory
applications
SSTL I at 1.8V and 2.5V, commonly used for memory
applications
Spartan-3E FPGAs support the following differential
standards:
LVDS
Bus LVDS
mini-LVDS
RSDS
Differential HSTL (1.8V, Types I and III)
Differential SSTL (2.5V and 1.8V, Type I)
2.5V LVPECL inputs
Furthermore, Spartan-3E FPGAs support MultiBoot
configuration, allowing two or more FPGA configuration
bitstreams to be stored in a single parallel NOR Flash. The
FPGA application controls which configuration to load next
and when to load it.
Table 2:
Available User I/Os and Differential (Diff) I/O Pairs
Package
Footprint
Size (mm)
Device
XC3S100E
XC3S250E
XC3S500E
XC3S1200E
XC3S1600E
Notes:
1.
2.
3.
All Spartan-3E devices provided in the same package are pin-compatible as further described in Module 4,
Pinout Descriptions.
The number shown in
bold
indicates the maximum number of I/O and input-only pins. The number shown in (italics) indicates the number
of input-only pins.
The XC3S500E is available in the VQG100 Pb-free package and not the standard VQ100. The VQG100 and VQ100 pin-outs are identical
and general references to the VQ100 will apply to the XC3S500E.
VQ100
VQG100
16 x 16
User
66
(2)
9(7)
66
(7)
66
(3)
(7)
-
-
Diff
30
(2)
30
(2)
30
(2)
-
-
CP132
CPG132
8x8
User
83
(11)
92
(7)
92
(7)
-
-
Diff
35
(2)
41
(2)
41
(2)
-
-
TQ144
TQG144
22 x 22
User
108
(28)
108
(28)
-
-
-
Diff
40
(4)
40
(4)
-
-
-
PQ208
PQG208
30.5 x 30.5
User
-
158
(32)
158
(32)
-
-
Diff
-
65
(5)
65
(5)
-
-
FT256
FTG256
17 x 17
User
-
172
(40)
190
(41)
190
(40)
-
Diff
-
68
(8)
77
(8)
77
(8)
-
FG320
FGG320
19 x 19
User
-
-
232
(56)
250
(56)
250
(56)
Diff
-
-
92
(12)
99
(12)
99
(12)
FG400
FGG400
21 x 21
User
-
-
-
304
(72)
304
(72)
Diff
-
-
-
124
(20)
124
(20)
FG484
FGG484
23 x 23
User
-
-
-
-
376
(82)
Diff
-
-
-
-
156
(21)
DS312 (v4.2) December 14, 2018
Product Specification
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4
Spartan-3E FPGA Family: Introduction and Ordering Information
Package Marking
Figure 2
provides a top marking example for Spartan-3E
FPGAs in the quad-flat packages.
Figure 3
shows the top
marking for Spartan-3E FPGAs in BGA packages except
the 132-ball chip-scale package (CP132 and CPG132). The
markings for the BGA packages are nearly identical to those
for the quad-flat packages, except that the marking is
rotated with respect to the ball A1 indicator.
Figure 4
shows
the top marking for Spartan-3E FPGAs in the CP132 and
CPG132 packages.
X-Ref Target - Figure 2
On the QFP and BGA packages, the optional numerical
Stepping Code follows the Lot Code.
The “5C” and “4I” part combinations can have a dual mark
of “5C/4I”. Devices with a single mark are only guaranteed
for the marked speed grade and temperature range. All “5C”
and “4I” part combinations use the Stepping 1 production
silicon.
Mask Revision Code
Fabrication Code
R
SPARTAN
Device Type
Package
Speed Grade
Temperature Range
TM
R
Process Technology
Date Code
Stepping Code
(optional)
Lot Code
XC3S250E
PQ208AGQ0525
D1234567A
4C
Pin P1
DS312-1_06_102905
Figure 2:
Spartan-3E QFP Package Marking Example
X-Ref Target - Figure 3
Mask Revision Code
BGA Ball A1
Device Type
Package
R
SPARTAN
R
Fabrication Code
Process Code
XC3S250E
TM
FT256AGQ0525
D1234567A
4C
Date Code
Stepping Code
(optional)
Lot Code
Speed Grade
Temperature Range
DS312-1_02_090105
Figure 3:
Spartan-3E BGA Package Marking Example
X-Ref Target - Figure 4
Ball A1
Lot Code
3S250E
F1234567-0525
PHILIPPINES
Device Type
Date Code
Temperature Range
Package
C5 = CP132
C6 = CPG132
C5AGQ
4C
Speed Grade
Process Code
Fabrication Code
DS312-1_05_032105
Mask Revision Code
Figure 4:
Spartan-3E CP132 and CPG132 Package Marking Example
DS312 (v4.2) December 14, 2018
Product Specification
www.xilinx.com
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