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XC95216-10HQG208I

Flash PLD, 10ns, CMOS, PQFP208, HQFP-208

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:XILINX(赛灵思)

厂商官网:https://www.xilinx.com/

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
XILINX(赛灵思)
零件包装代码
QFP
包装说明
FQFP,
针数
208
Reach Compliance Code
compliant
其他特性
216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
最大时钟频率
66.7 MHz
JESD-30 代码
S-PQFP-G208
JESD-609代码
e3
长度
28 mm
湿度敏感等级
3
专用输入次数
I/O 线路数量
166
端子数量
208
最高工作温度
85 °C
最低工作温度
-40 °C
组织
0 DEDICATED INPUTS, 166 I/O
输出函数
MACROCELL
封装主体材料
PLASTIC/EPOXY
封装代码
FQFP
封装形状
SQUARE
封装形式
FLATPACK, FINE PITCH
峰值回流温度(摄氏度)
245
可编程逻辑类型
FLASH PLD
传播延迟
10 ns
认证状态
Not Qualified
座面最大高度
4.1 mm
最大供电电压
5.5 V
最小供电电压
4.5 V
标称供电电压
5 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子节距
0.4 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
30
宽度
28 mm
文档预览
Product Obsolete/Under Obsolescence
0
R
XC95216 In-System
Programmable CPLD
0
5
DS068 (v5.0) May 17, 2013
Product Specification
Features
10 ns pin-to-pin logic delays on all pins
f
CNT
to 111 MHz
216 macrocells with 4,800 usable gates
Up to 166 user I/O pins
5V in-system programmable
- Endurance of 10,000 program/erase cycles
- Program/erase over full commercial voltage and
temperature range
Enhanced pin-locking architecture
Flexible 36V18 Function Block
- 90 product terms drive any or all of 18 macrocells
within Function Block
- Global and product term clocks, output enables,
set and reset signals
Extensive IEEE Std 1149.1 boundary-scan (JTAG)
support
Programmable power reduction mode in each
macrocell
Slew rate control on individual outputs
User programmable ground pin capability
Extended pattern security features for design
protection
High-drive 24 mA outputs
3.3V or 5V I/O capability
Advanced CMOS 5V FastFLASH™ technology
Supports parallel programming of more than one
XC9500 concurrently
Available 160-pin PQFP, 352-pin BGA, and 208-pin
HQFP packages (Note: 352-pin BGA packages are
being discontinued for this device)
Description
The XC95216 is a high-performance CPLD providing
advanced in-system programming and test capabilities for
general purpose logic integration. It is comprised of eight
36V18 Function Blocks, providing 4,800 usable gates with
propagation delays of 10 ns. See
Figure 2
for the architec-
ture overview.
Power Management
Power dissipation can be reduced in the XC95216 by con-
figuring macrocells to standard or low-power modes of
operation. Unused macrocells are turned off to minimize
power dissipation.
Operating current for each design can be approximated for
specific operating conditions using the following equation:
I
CC
(mA) = MC
HP
(1.7) + MC
LP
(0.9) + MC (0.006 mA/MHz) f
Where:
MC
HP
= Macrocells in high-performance mode
MC
LP
= Macrocells in low-power mode
MC = Total number of macrocells used
f = Clock frequency (MHz)
Figure 1
shows a typical calculation for the XC95216
device.
600
High
man
Perfor
ce
(500)
Typical I
CC
(mA)
400
(360)
(340)
Low P
200
ower
0
50
100
DS068_01_110101
Clock Frequency (MHz)
Figure 1:
Typical I
CC
vs. Frequency for XC95216
© 1998–2007, 2013 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other
countries. All other trademarks are the property of their respective owners.
DS068 (v5.0) May 17, 2013
Product Specification
www.xilinx.com
1
Product Obsolete/Under Obsolescence
R
XC95216 In-System Programmable CPLD
3
JTAG Port
1
JTAG
Controller
In-System Programming Controller
36
I/O
I/O
I/O
Fast CONNECT II Switch Matrix
I/O
36
18
18
Function
Block 1
Macrocells
1 to 18
Function
Block 2
Macrocells
1 to 18
I/O
Blocks
I/O
I/O
I/O
I/O
3
I/O/GCK
1
I/O/GSR
2
I/O/GTS
36
18
Function
Block 3
Macrocells
1 to 18
36
18
Function
Block 4
Macrocells
1 to 18
36
18
Function
Block 12
Macrocells
1 to 18
DS068_02_110101
Figure 2:
XC95216 Architecture
Function block outputs (indicated by the bold line) drive the I/O blocks directly.
DS068 (v5.0) May 17, 2013
Product Specification
www.xilinx.com
2
Product Obsolete/Under Obsolescence
R
XC95216 In-System Programmable CPLD
Absolute Maximum Ratings
Symbol
V
CC
V
IN
V
TS
T
STG
T
J
Description
Supply voltage relative to GND
Input voltage relative to GND
Voltage applied to 3-state output
Storage temperature (ambient)
Junction temperature
Value
–0.5 to 7.0
–0.5 to V
CC
+ 0.5
–0.5 to V
CC
+ 0.5
–65 to +150
+150
Units
V
V
V
o
C
o
C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
Recommended Operation Conditions
Symbol
V
CCINT
V
CCIO
Parameter
Supply voltage for internal logic
and input buffers
Supply voltage for output drivers
for 5V operation
Commercial T
A
= 0
o
C to 70
o
C
Industrial T
A
= –40
o
C to +85
o
C
Commercial T
A
= 0
o
C to 70
o
C
Industrial T
A
= –40
o
C to +85
o
C
Min
4.75
4.5
4.75
4.5
3.0
0
2.0
0
Max
5.25
5.5
5.25
5.5
3.6
0.80
V
CCINT
+ 0.5
V
CCIO
V
V
V
V
Units
V
Supply voltage for output drivers for 3.3V operation
V
IL
V
IH
V
O
Low-level input voltage
High-level input voltage
Output voltage
Quality and Reliability Characteristics
Symbol
T
DR
N
PE
Data Retention
Program/Erase Cycles (Endurance)
Parameter
Min
20
10,000
Max
-
-
Units
Years
Cycles
DC Characteristic Over Recommended Operating Conditions
Symbol
V
OH
V
OL
I
IL
I
IH
C
IN
I
CC
Parameter
Output high voltage for 5V outputs
Output high voltage for 3.3V outputs
Output low voltage for 5V outputs
Output low voltage for 3.3V outputs
Input leakage current
I/O high-Z leakage current
I/O capacitance
Operating supply current
(low power mode, active)
Test Conditions
I
OH
= –4.0 mA, V
CC
= Min
I
OH
= –3.2 mA, V
CC
= Min
I
OL
= 24 mA, V
CC
= Min
I
OL
= 10 mA, V
CC
= Min
V
CC
= Max
V
IN
= GND or V
CC
V
CC
= Max
V
IN
= GND or V
CC
V
IN
= GND
f = 1.0 MHz
V
I
= GND, No load
f = 1.0 MHz
Min
2.4
2.4
-
-
-
-
-
Max
-
-
0.5
0.4
±10
±10
10
Units
V
V
V
V
μA
μA
pF
mA
200 (Typical)
DS068 (v5.0) May 17, 2013
Product Specification
www.xilinx.com
3
Product Obsolete/Under Obsolescence
R
XC95216 In-System Programmable CPLD
AC Characteristics
XC95216-10
Symbol
T
PD
T
SU
T
H
T
CO
f
CNT(1)
T
PSU
T
PH
T
PCO
T
OE
T
OD
T
POE
T
POD
T
WLH
T
APRPW
Parameter
I/O to output valid
I/O setup time before GCK
I/O hold time after GCK
GCK to output valid
16-bit counter frequency
I/O setup time before p-term clock input
I/O hold time after p-term clock input
P-term clock output valid
GTS to output valid
GTS to output disable
Product term OE to output enabled
Product term OE to output disabled
GCK pulse width (High or Low)
Asynchronous preset/reset pulse width (High
or Low)
Min
-
6.0
0
-
111.1
66.7
2.0
4.0
-
-
-
-
-
4.5
7.5
Max
10.0
-
-
6.0
-
-
-
-
10.0
6.0
6.0
10.0
10.0
-
-
XC95216-15
Min
-
8.0
0
-
95.2
55.6
4.0
4.0
-
-
-
-
-
5.5
8.0
Max
15.0
-
-
8.0
-
-
-
-
12.0
11.0
11.0
14.0
14.0
-
-
XC95216-20
Min
-
10.0
0
-
83.3
50.0
4.0
6.0
-
-
-
-
-
5.5
8.0
Max
20.0
-
-
10.0
-
-
-
-
16.0
16.0
16.0
18.0
18.0
-
-
Units
ns
ns
ns
ns
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
f
SYSTEM(2)
Multiple FB internal operating frequency
Notes:
1. f
CNT
is the fastest 16-bit counter frequency available, using the local feedback when applicable.
f
CNT
is also the Export Control Maximum flip-flop toggle rate, f
TOG
.
2. f
SYSTEM
is the internal operating frequency for general purpose system designs spanning multiple FBs.
V
TEST
R
1
Device Output
R
2
C
L
Output Type
V
CCIO
5.0V
3.3V
V
TEST
5.0V
3.3V
R
1
160Ω
260Ω
R
2
120Ω
360Ω
C
L
35 pF
35 pF
DS067_03_110101
Figure 3:
AC Load Circuit
DS068 (v5.0) May 17, 2013
Product Specification
www.xilinx.com
4
Product Obsolete/Under Obsolescence
R
XC95216 In-System Programmable CPLD
Internal Timing Parameters
XC95216-10
Symbol
Buffer Delays
T
IN
T
GCK
T
GSR
T
GTS
T
OUT
T
EN
T
PTCK
T
PTSR
T
PTTS
T
PDI
T
SUI
T
HI
T
COI
T
AOI
T
RAI
T
LOGI
Input buffer delay
GCK buffer delay
GSR buffer delay
GTS buffer delay
Output buffer delay
Output buffer enable/disable delay
-
-
-
-
-
-
3.5
2.5
6.0
6.0
3.0
0
-
-
-
-
-
-
4.5
3.0
7.5
11.0
4.5
0
-
-
-
-
-
-
6.5
3.0
9.5
16.0
6.5
0
ns
ns
ns
ns
ns
ns
Parameter
Min
Max
XC95216-15
Min
Max
XC95216-20
Min
Max
Units
Product Term Control Delays
Product term clock delay
Product term set/reset delay
Product term 3-state delay
-
-
-
3.0
2.5
3.5
-
-
-
2.5
3.0
5.0
-
-
-
2.5
3.0
5.0
ns
ns
ns
Internal Register and Combinatorial Delays
Combinatorial logic propagation delay
Register setup time
Register hold time
Register clock to output valid time
Register async. S/R to output delay
Register async. S/R recover before clock
Internal logic delay
-
2.5
3.5
-
-
10.0
-
-
1.0
-
-
0.5
7.0
-
2.5
11.0
-
3.5
4.5
-
-
10.0
-
-
3.0
-
-
0.5
8.0
-
3.0
11.5
-
3.5
6.5
-
-
10.0
-
-
4.0
-
-
0.5
8.0
-
3.0
11.5
ns
ns
ns
ns
ns
ns
ns
ns
T
LOGILP
Internal low power logic delay
Feedback Delays
T
F
T
LF
FastCONNECT feedback delay
Function block local feedback delay
-
-
9.5
3.5
-
-
11.0
3.5
-
-
13.0
5.0
ns
ns
Time Adders
T
PTA(1)
Incremental product term allocator delay
T
SLEW
Slew-rate limited delay
-
-
1.0
4.5
-
-
1.0
5.0
-
-
1.5
5.5
ns
ns
Notes:
1. T
PTA
is multiplied by the span of the function as defined in the XC9500 family data sheet.
DS068 (v5.0) May 17, 2013
Product Specification
www.xilinx.com
5
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参数对比
与XC95216-10HQG208I相近的元器件有:XC95216-10PQG160C、XC95216-20PQG160C、XC95216-15PQG160C、XC95216-15BG352I、XC95216-15HQG208I、XC95216-20HQG208C、XC95216-20HQG208I。描述及对比如下:
型号 XC95216-10HQG208I XC95216-10PQG160C XC95216-20PQG160C XC95216-15PQG160C XC95216-15BG352I XC95216-15HQG208I XC95216-20HQG208C XC95216-20HQG208I
描述 Flash PLD, 10ns, CMOS, PQFP208, HQFP-208 IC cpld 216mc 10ns 160pqfp IC cpld 216mc 20ns 160pqfp IC cpld 216mc 15ns 160pqfp IC cpld 216mc 15ns 352bga Flash PLD, 15ns, CMOS, PQFP208, HQFP-208 Flash PLD, 20ns, CMOS, PQFP208, HQFP-208 Flash PLD, 20ns, CMOS, PQFP208, HQFP-208
是否无铅 不含铅 不含铅 不含铅 不含铅 含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 不符合 符合 符合 符合
厂商名称 XILINX(赛灵思) XILINX(赛灵思) XILINX(赛灵思) XILINX(赛灵思) XILINX(赛灵思) XILINX(赛灵思) XILINX(赛灵思) XILINX(赛灵思)
零件包装代码 QFP QFP QFP QFP BGA QFP QFP QFP
包装说明 FQFP, LEAD FREE, PLASTIC, QFP-160 LEAD FREE, PLASTIC, QFP-160 LEAD FREE, PLASTIC, QFP-160 BGA-352 FQFP, FQFP, FQFP,
针数 208 160 160 160 352 208 208 208
Reach Compliance Code compliant unknown unknown unknown not_compliant compliant compliant compliant
最大时钟频率 66.7 MHz 66.7 MHz 50 MHz 55.6 MHz 55.6 MHz 55.6 MHz 50 MHz 50 MHz
JESD-30 代码 S-PQFP-G208 S-PQFP-G160 S-PQFP-G160 S-PQFP-G160 S-PBGA-B352 S-PQFP-G208 S-PQFP-G208 S-PQFP-G208
JESD-609代码 e3 e3 e3 e3 e0 e3 e3 e3
长度 28 mm 28 mm 28 mm 28 mm 35 mm 28 mm 28 mm 28 mm
湿度敏感等级 3 3 3 3 3 3 3 3
I/O 线路数量 166 133 133 133 166 166 166 166
端子数量 208 160 160 160 352 208 208 208
最高工作温度 85 °C 70 °C 70 °C 70 °C 85 °C 85 °C 70 °C 85 °C
组织 0 DEDICATED INPUTS, 166 I/O 0 DEDICATED INPUTS, 133 I/O 0 DEDICATED INPUTS, 133 I/O 0 DEDICATED INPUTS, 133 I/O 0 DEDICATED INPUTS, 166 I/O 0 DEDICATED INPUTS, 166 I/O 0 DEDICATED INPUTS, 166 I/O 0 DEDICATED INPUTS, 166 I/O
输出函数 MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 FQFP QFP QFP QFP LBGA FQFP FQFP FQFP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, FINE PITCH FLATPACK FLATPACK FLATPACK GRID ARRAY, LOW PROFILE FLATPACK, FINE PITCH FLATPACK, FINE PITCH FLATPACK, FINE PITCH
峰值回流温度(摄氏度) 245 245 245 245 225 245 245 245
可编程逻辑类型 FLASH PLD FLASH PLD FLASH PLD FLASH PLD FLASH PLD FLASH PLD FLASH PLD FLASH PLD
传播延迟 10 ns 10 ns 20 ns 15 ns 15 ns 15 ns 20 ns 20 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 4.1 mm 3.7 mm 3.7 mm 3.7 mm 1.4 mm 4.1 mm 4.1 mm 4.1 mm
最大供电电压 5.5 V 5.25 V 5.25 V 5.25 V 5.5 V 5.5 V 5.25 V 5.5 V
最小供电电压 4.5 V 4.75 V 4.75 V 4.75 V 4.5 V 4.5 V 4.75 V 4.5 V
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
端子面层 Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Tin/Lead (Sn63Pb37) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn)
端子形式 GULL WING GULL WING GULL WING GULL WING BALL GULL WING GULL WING GULL WING
端子节距 0.4 mm 0.65 mm 0.65 mm 0.65 mm 1.27 mm 0.4 mm 0.4 mm 0.4 mm
端子位置 QUAD QUAD QUAD QUAD BOTTOM QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 30 30 30 30 30 30 30
宽度 28 mm 28 mm 28 mm 28 mm 35 mm 28 mm 28 mm 28 mm
其他特性 216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V YES YES YES 216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V 216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V - -
ECCN代码 - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
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