ACPR at 1W CDMA Power Output (Single Carrier IS-95, 9 Ch
Fwd, Offset=750KHz, ACPR Integrated Bandwidth)
Linearity
ALT-1 at 2W CDMA (Single Carrier IS-95, 9 Ch Fwd,
Offset=1980 KHz, ACPR Integrated Bandwidth)
3
rd
Order IMD at 10W PEP (Two Tone; 1MHz)
Delay
Phase Linearity
R
TH, j-l
R
TH, j-2
Signal Delay from Pin 1 to Pin 5
Deviation from Linear Phase (Peak to Peak)
Thermal Resistance Stage 1 (Junction to Case)
Thermal Resistance Stage 2 (Junction to Case)
Unit
MHz
W
dB
dB
dB
%
%
%
dB
dB
dBc
nS
Deg
ºC/W
ºC/W
-27
10
20
Min.
1930
10
26
12
28
0.4
14
26
12
6.5
-58
-70
-32
2.9
0.5
11
4
1.0
Typ.
Max.
1990
Test Conditions: Z
in
= Z
out
= 50Ω, V
DD
= 28.0V, I
DQ1
= 230mA, I
DQ2
= 150mA, T
Flange
= 25ºC
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of this information, and all such
information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any thrid party. Sirenza Microdevices
does not authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems. Copyright 2003 Sirenza Microdevices, Inc. All worldwide rights reserved.
303 S. Technology Court,
Broomfield, CO 80021
Phone: (800) SMI-MMIC
1
http://www.sirenza.com
EDS-102932 Rev C
XD010-24S-D2F 1930-1990 MHz 12W Power Amp Module
Quality Specifications
Parameter
ESD Rating
MTTF
Human Body Model, JEDEC Document - JESD22-A114-B
85
o
C
Unit
V
H
Baseplate,
200
o
C
Channel
Typical
8000
1.2 X 10
6
Pin Out Description
Pin #
1
2
3,4
5
Flange
Function
RF Input
V
D1
V
D2
RF Output
Gnd
Description
Module RF input. Care must be taken to protect against video transients that may damage the active devices.
This is the bias feed for the 1
st
stage of the amplifier module. The gate bias is temperature compensated to maintain con-
stant current over the operating temperature range. See Note 1.
This is the bias feed for the 2
nd
stage of the amplifier module. The gate bias is temperature compensated to maintain con-
stant current over the operating temperature range. See Note 1.
Module RF output. Care must be taken to protect against video transients that may damage the active devices.
Exposed area on the bottom side of the package needs to be mechanically attached to the ground plane of the board for
optimum thermal and RF performance. See mounting instructions for recommendation.
Simplified Device Schematic
2 V
D1
3
4 V
D2
Temperature
Compensation
Temperature
Compensation
RF
in
1
Q1
Q2
RF
out
5
Case Flange = Ground
Absolute Maximum Ratings
Parameters
1 Stage Bias Voltage (V
D1
)
2
nd
st
Value
35
35
+20
5:1
+200
-20 to +90
-40 to
+100
Unit
V
V
dBm
VSWR
ºC
ºC
ºC
Stage Bias Voltage (V
D2
)
RF Input Power
Load Impedance for Continuous Operation
Without Damage
Output Device Channel Temperature
Operating Temperature Range
Storage Temperature Range
Note 1:
The internally generated gate voltage is thermally compensated
to maintain constant quiescent current over the temperature
range listed in the data sheet. No compensation is provided for
gain changes with temperature. This can only be accomplished
with AGC external to the module.
Note 2:
Internal RF decoupling is included on all bias leads. No addi-
tional bypass elements are required, however some applica-
tions may require energy storage on the drain leads to
accommodate time-varying waveforms.
Note 3:
This module was designed to have its leads hand soldered to an
adjacent PCB. The maximum soldering iron tip temperature
should not exceed 700° C, and the soldering iron tip should not
be in direct contact with the lead for longer than 10 seconds.
Refer to app note AN060 (www.sirenza.com) for further installa-
tion instructions.
Operation of this device beyond any one of these limits may
cause permanent damage. For reliable continuous operation
see typical setup values specified in the table on page one.
Caution: ESD Sensitive
Appropriate precaution in handling, packaging
and testing devices must be observed.
303 S. Technology Court
Broomfield, CO 80021
Phone: (800) SMI-MMIC
2
http://www.sirenza.com
EDS-102932 Rev C
XD010-24S-D2F 1930-1990 MHz 12W Power Amp Module
Typical Performance Curves
Gain, Output Power and Efficiency vs. Input Power
Freq=1960 MHz, Vdd=28 V, T
Flange
= 25°C
35
Gain (dB), Output Power (W), Efficiency (%)
30
25
20
15
10
5
0
0
0.002
0.004
0.006
Input Power (W)
0.008
0.01
0.012
Gain (dB), Efficiency (%)
Pout
Gain
Efficiency
35
30
25
Gain
20
15
10
5
0
1920
Efficiency
ACPR
-40
-45
-50
-55
-60
2000
ACPR (dB)
Gain, Efficiency and ACPR vs. Frequency
Freq=1960 MHz, Vdd=28 V, T
Flange
= 25°C
Output Power=2 Watts
-25
-30
-35
1930
1940
1950
1960
1970
1980
1990
Frequency (MHz)
Gain and Efficiency vs. Output Power and Temperature
Freq=1960 MHz, Vdd=28 V, T
Flange
=-20°C, 25°C, 90°C
35
30
25
Gain (dB)
20
15
10
5
0
0
2
4
6
Output Power (W)
8
10
12
Gain @-20°C
Gain @ 25°C
Gain @ 90°C
Efficiency @-20°C
Efficiency @ 25°C
Efficiency @ 90°C
5
0
35
30
25
20
15
10
Efficiency (%)
Gain (dB), Efficiency (%)
35
30
25
20
15
10
5
0
0
Gain and Efficiency vs. Output Power and Voltage
Freq=1960 MHz, Vdd=24V, 28 V, 32 V T
Flange
= 25°C
Gain @ 24 VDC
Gain @ 28 VDC
Gain @ 32 VDC
Efficiency @ 24 VDC
Efficiency @ 28 VDC
Efficiency @ 32 VDC
2
4
6
Output Power (W)
8
10
12
0
-10
-20
ACPR (dB)
-30
-40
-50
-60
-70
0
ACPR and ALT1 vs. Output Power and Temperature
Freq=1960 MHz IS-95 Vdd=28 V, T
Flange
=-20°C, 25°C, 90°C
ACPR 885 kHz, 30 kHz
ALT1 1.25 MHz, 30 kHz
ACPR @ 25°C
ACPR @-20°C
ACPR @ 90°C
ALT1 @-20°C
ALT1 @ 25°C
ALT1 @ 90°C
Two Tone IMD vs. Output Power and Temperature
Freq=1960, 1961 MHz, Vdd=28 V, T
Flange
=-20 C, 25 C, 90 C
-30
-40
-50
-20
0
-10
IMD @ 25 C
IMD @ 90
IMD @ -20
o
o
o
ALT1 (dB)
-60
-70
-80
-90
-100
0.5
1
1.5
2
2.5
Output Power (W)
IMD (dBc)
-30
-40
-50
-60
0
1
2
3
Output Power, Avg (W)
4
5
6
303 S. Technology Court
Broomfield, CO 80021
Phone: (800) SMI-MMIC
3
http://www.sirenza.com
EDS-102932 Rev C
XD010-24S-D2F 1930-1990 MHz 12W Power Amp Module
Test Board Schematic with module attachments shown
Test Board Bill of Materials
Component
PCB
J1, J2
J3
C1, C10
C2, C20
C3, C30
C25, C26
C21, C22
C23, C24
Mounting
Screws
Description
Rogers 4350,
e
r
=3.5
Thickness=30mils
SMA, RF, Panel Mount Tab W /
Flange
MTA Post Header, 6 Pin, Rect-
angle, Polarized, Surface
Mount
Cap, 10mF, 35V, 10%, Tant,
Elect, D
Cap, 0.1mF, 100V, 10%, 1206
Cap, 1000pF, 100V, 10%, 1206
Cap, 68pF, 250V, 5%, 0603
Cap, 0.1mF, 100V, 10%, 0805
Cap, 1000pF, 100V, 10%, 0603
4-40 X 0.250”
Manufacturer
Rogers
Johnson
AMP
Kemet
Johanson
Johanson
ATC
Panasonic
AVX
Various
Test Board Layout
To receive Gerber files, DXF drawings, a detailed BOM, and assembly recommendations for the test board with fixture, contact applications
support at
support@sirenza.com.
Data sheet for evaluation circuit (XD010-EVAL) available from Sirenza website.
303 S. Technology Court
Broomfield, CO 80021
Phone: (800) SMI-MMIC
4
http://www.sirenza.com
EDS-102932 Rev C
XD010-24S-D2F 1930-1990 MHz 12W Power Amp Module
Package Outline Drawing
Recommended PCB Cutout and Landing Pads for the D2F Package
Note 3:
Dimensions are in inches
Refer to Application note AN-060 “Installation Instructions for XD Module Series” for additional mounting info. App note availbale at at www.sirenza.com
51单片机
