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XLH738070.000000X

标准时钟振荡器

器件类别:无源元件    频率控制器和定时装置    振荡器    标准时钟振荡器   

厂商名称:IDT(艾迪悌)

厂商官网:http://www.idt.com/

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器件参数
参数名称
属性值
厂商名称
IDT(艾迪悌)
产品种类
标准时钟振荡器
发货限制
Mouser目前不销售该产品。
频率
70 MHz
频率稳定性
20 PPM
负载电容
15 pF
工作电源电压
3.3 V
电源电压-最小
3.135 V
电源电压-最大
3.465 V
输出格式
HCMOS
端接类型
SMD/SMT
封装 / 箱体
7 mm x 5 mm
最小工作温度
- 20 C
最大工作温度
+ 70 C
长度
7 mm
宽度
5 mm
高度
1.3 mm
系列
XL
封装
Cut Tape
封装
Reel
电流额定值
55 mA
占空比 - 最大
55 %
工厂包装数量
500
文档预览
XL Family of Low Phase Noise
Quartz-based PLL Oscillators
Datasheet
XL
Description
The IDT XL devices (XO and VCXO options) are ultra-precision
crystal oscillators with 750 to 890fs typical phase jitter over 12kHz
to 20MHz bandwidth. Available in a wide frequency range from
0.750MHz to 1350MHz, the XL series crystal oscillators utilize a
family of proprietary ASICs, with a key focus on noise reduction
technologies.
The 3rd order Delta Sigma Modulator reduces noise to the levels
that are comparable to traditional Bulk Quartz and SAW
oscillators. With short lead-time, low cost, low noise, wide
frequency range, excellent ambient performance, the XL devices
are an excellent choice over the conventional technologies. The
XL (XO option) devices have stabilities as tight as ±20ppm and
the XL (VCXO option) devices have ±50ppm APR. Either option
provides extremely quick delivery for both standard and custom
frequencies.
Features
Output types: LVDS, LVPECL, LVCMOS
Phase jitter (12kHz to 20MHz): 750fs to 890fs typical
Supply voltage: 2.5V or 3.3V
Package options:
3.2 × 2.5 × 1.0 mm (not available for VCXO)
5.0 × 3.2 × 1.2 mm
7.0 × 5.0 × 1.3 mm
Operating temperature: -20°C to +70°C
Frequency stability options: ±20, ±25, ±50, or ±100 ppm
(XO only)
±50ppm APR (VCXO only)
Operating temperature: -40°C to +85°C
Frequency stability options: ±25, ±50, or ±100 ppm
(XO only)
±50ppm APR (VCXO only)
Operating temperature: -40°C to +105°C (XO only)
Frequency stability options: ±50 or ±100 ppm
kV of 85ppm/volt typical from 0.5VDC to VDD (VCXO only)
Better than ±10% linearity for Vc range
Pin Assignments (XO option)
NOTE:
To minimize power supply line noise, a 0.01μF bypass capacitor should be placed between V
DD
(Pin 6) and GND (Pin 3) on 6-pin
devices, or V
DD
(Pin 4) and GND (Pin 2) on 4-pin devices.
OUT2
VDD
VDD
OUT
6
5
4
4
NC
1
E/D / NC
2
NC / E/D
3
GND
1
E/D
NC
Table 1. XO 6-pin Package
Table 2. XO 4-pin Package
Number
1
2
3
4
5
6
Name
E/D
NC
NC
E/D
GND
OUT
OUT2
V
DD
Description
Enable/Disable
[a][b]
No connect
No connect
Enable/Disable
[a][b]
Connect to ground
Output
Complementary output
Supply voltage
Number
1
2
3
4
Name
E/D
GND
OUT
V
DD
GND
OUT
3
2
Description
Enable/Disable
[a][b]
Connect to ground
Output
Supply voltage
[a] Pulled high internally.
[b] Low = output disabled.
See
Ordering Information (XO)
for more details.
1
September 7, 2018
©2018 Integrated Device Technology, Inc.
XL Datasheet
Pin Assignments (VCXO option)
NOTE:
To minimize power supply line noise, a 0.01μF bypass capacitor should be placed between V
DD
(Pin 6) and GND (Pin 3).
OUT2
VDD
OUT
6
5
4
1
Vc
2
E/D
3
GND
Table 3. VCXO 6-pin Package
Number
1
2
3
4
5
6
Name
Vc
E/D
GND
OUT
OUT2
V
DD
Description
Voltage control
Enable/Disable
[a][b]
Connect to ground
Output
Complementary output (NC LVCMOS)
Supply voltage
[a] Pulled high internally.
[b] Low = output disabled.
See
Ordering Information (VCXO)
for more details.
©2018 Integrated Device Technology, Inc.
2
September 7, 2018
XL Datasheet
Contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin Assignments (XO option) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin Assignments (VCXO option) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
ESD Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Mechanical Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Solder Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Output Waveforms – LVDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Output Waveforms – LVPECL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Output Waveforms – LVCMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package Outline Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Ordering Information (XO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Ordering Information (VCXO). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
©2018 Integrated Device Technology, Inc.
3
September 7, 2018
XL Datasheet
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the device. These ratings, which are standard values for IDT
commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range.
Table 4. Absolute Maximum Ratings
Item
V
DD
E/D
OUT
Storage Temperature
Maximum Junction Temperature
Core Current
Theta J
A
Theta J
B
-0.5 to +5.0V
-0.5V to V
DD
+ 0.5V
-0.5V to V
DD
+ 0.5V
-55°C to 125°C
125°C
65mA maximum
JU6
7.0 × 5.0 × 1.3 mm
75.9 °C/W
48.6°C/W
Rating
JS6
5.0 × 3.2 × 1.2 mm
89.6 °C/W
54.3 °C/W
JX6
3.2 × 2.5 × 1.0 mm
94.7 °C/W
66.8 °C/W
ESD Compliance
Table 5. ESD Compliance
Human Body Model (HBM
Machine Model (MM)
1000V
150V
Mechanical Testing
Table 6. Mechanical Testing
Parameter
Mechanical Shock
Mechanical Vibration
High Temperature Burn-in
Hermetic Seal
Test Method
Drop from 75cm to hardwood surface–3 times.
10–55Hz, 1.5mm amplitude, 1 minute sweep; 2 hours each in 3 directions (X, Y, Z).
Under power at 125°C for 2000 hours.
He pressure: 4 ±1kgf/cm
2
2 hour soak.
Solder Reflow Profile
t
P
260°C
Ramp up 3°C/s Max
225°C
180°C
160°C
120 ±20 seconds
in pre-heating
area
50 ±10
seconds
above 225°C
reflow area
10 seconds Max within
5°C of 260°C peak
Ramp down not
to exceed 6°C/s
25°C
400 seconds MAX from +25°C to 260°C peak
©2018 Integrated Device Technology, Inc.
4
September 7, 2018
XL Datasheet
DC Electrical Characteristics
Table 7. 3.3V IDD DC Electrical Characteristics
V
DD
= 3.3V ±5%, T
A
= -20°C to +70°C; -40°C to +85°C, -40°C to +105°C.
Symbol
Parameter
Output Type
LVDS
LVPECL
I
DD
Power Supply Current
LVCMOS
Conditions
0.75MHz to 20MHz.
20+MHz to 50MHz.
50+MHz to 130MHz.
130+MHz to 200MHz.
200+MHz to 250MHz.
Minimum
Typical
Maximum
100
120
32
35
47
55
60
mA
Units
Table 8. 2.5V IDD DC Electrical Characteristics
V
DD
= 2.5V ±5%, T
A
= -20°C to +70°C; -40°C to +85°C, -40°C to +105°C.
Symbol
Parameter
Output Type
Conditions
0.75MHz to 20MHz.
LVDS
20+MHz to 220MHz.
220+MHz to 630MHz.
630+MHz to 1000MHz.
0.75MHz to 20MHz.
LVPECL
I
DD
Power Supply Current
20+MHz to 220MHz.
220+MHz to 630MHz.
630+MHz to 1000MHz.
0.75MHz to 20MHz.
20+MHz to 50MHz.
LVCMOS
50+MHz to 100MHz.
100+MHz to 130MHz.
130+MHz to 160MHz.
160+MHz to 180MHz.
Minimum
Typical
Maximum
26
34
44
65
33
41
63
72
22
25
29
32
35
37
mA
Units
©2018 Integrated Device Technology, Inc.
5
September 7, 2018
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