XMC1300 AB-Step
Microcontroller Series
for Industrial Applications
XMC1000 Family
ARM
®
Cortex
®
-M0
32-bit processor core
Data Sheet
V2.0 2017-10
Microcontrollers
Edition 2017-10
Published by
Infineon Technologies AG
81726 Munich, Germany
©
2017 Infineon Technologies AG
All Rights Reserved.
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XMC1300 AB-Step
Microcontroller Series
for Industrial Applications
XMC1000 Family
ARM
®
Cortex
®
-M0
32-bit processor core
Data Sheet
V2.0 2017-10
Microcontrollers
XMC1300 AB-Step
XMC1000 Family
XMC1300 Data Sheet
Revision History: V2.0 2017-10
Previous Version: V1.9 2017-03
Page
Page 10,
Page 13
Subjects
Add marking option for XMC1302-T28X0032, XMC1302-T28X0064,
XMC1302-T28X0128, XMC1302-T28X0200.
Trademarks
C166™, TriCore™, XMC™ and DAVE™ are trademarks of Infineon Technologies AG.
ARM
®
, ARM Powered
®
and AMBA
®
are registered trademarks of ARM, Limited.
Cortex™, CoreSight™, ETM™, Embedded Trace Macrocell™ and Embedded Trace
Buffer™ are trademarks of ARM, Limited.
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Data Sheet
V2.0, 2017-10
XMC1300 AB-Step
XMC1000 Family
Table of Contents
Table of Contents
1
1.1
1.2
1.3
1.4
2
2.1
2.2
2.2.1
2.2.2
2.2.3
3
3.1
3.1.1
3.1.2
3.1.3
3.1.4
3.2
3.2.1
3.2.2
3.2.3
3.2.4
3.2.5
3.2.6
3.2.7
3.3
3.3.1
3.3.2
3.3.3
3.3.4
3.3.5
3.3.6
3.3.6.1
3.3.6.2
3.3.6.3
4
4.1
4.1.1
4.2
Summary of Features
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Device Type Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Chip Identification Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
General Device Information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Pin Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Port I/O Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Hardware Controlled I/O Function Description . . . . . . . . . . . . . . . . . . .
Electrical Parameters
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Reliability in Overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input/Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog to Digital Converters (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . .
Out of Range Comparator (ORC) Characteristics . . . . . . . . . . . . . . . . .
Analog Comparator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .
Temperature Sensor Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power-Up and Supply Monitoring Characteristics . . . . . . . . . . . . . . . .
On-Chip Oscillator Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Serial Wire Debug Port (SW-DP) Timing . . . . . . . . . . . . . . . . . . . . . . .
SPD Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Peripheral Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Synchronous Serial Interface (USIC SSC) Timing . . . . . . . . . . . . . .
Inter-IC (IIC) Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Inter-IC Sound (IIS) Interface Timing . . . . . . . . . . . . . . . . . . . . . . . .
Package and Reliability
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5
16
16
18
22
25
27
33
33
33
34
35
37
38
38
42
46
48
49
50
55
56
56
57
59
61
62
63
63
66
68
70
70
70
72
Data Sheet
V2.0, 2017-10