With unique metal sealing technology, this product realizes an
excellent frequency stability over temperature and small size
package. They are suitable for various types of digital
communication equipment.
Applications
Other Usage
Industrial
Packaging Information
Packaging
P0
Specifications
180mm Plastic Tape
Minimum
Order Quantity
3000
1 of 3
Atten ti o n
1.T his datasheet is downloaded from the website of Murata Manufacturing Co., Ltd. T herefore, it’s specifications are subject to change or our products in it may be discontinued
without advance notice. Please check with our sales representatives or product engineers before ordering.
2.T his datasheet has only typical specifications because there is no space for detailed specifications.
T herefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
URL : http://www.murata.com/
Last updated
：
2015/11/16
Product Search Data Sheet
XRCHH26M000F1QD8P0
Specifications
Shape
SMD
Frequency
26.0000MHz
Frequency Tolerance
±10ppmmax. (25±3
℃
)
Operating Temperature Range
-30
℃
to 85
℃
Frequency Shift by Temperature
±15ppmmax.
Frequency Aging
±1ppmmax./year(±3ppm max./5years)
Wash
Not avairable
Load Capacitance
8pF
Equivalent Series Resistance(Max.)
60Ω
Drive Level(Max.)
60μW
2 of 3
Atten ti o n
1.T his datasheet is downloaded from the website of Murata Manufacturing Co., Ltd. T herefore, it’s specifications are subject to change or our products in it may be discontinued
without advance notice. Please check with our sales representatives or product engineers before ordering.
2.T his datasheet has only typical specifications because there is no space for detailed specifications.
T herefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
12月13日,， IBM 宣布将与三星、摩根大通和巴克莱银行等12家主要公司合作，共同开发商用 量子计算 。下面就随网络通信小编一起来了解一下相关内容吧。 IBM 表示，这12家公司将使用 IBM 的开源软件和开发工具，与IBM共同打造 量子计算 。 量子计算 被视为下一代计算技术，能够解决当前计算机所无法解决的诸多问题。 当前，量子计算还处于初级发展阶段，但IBM希望通过此次合...[详细]
随着嵌入式系统的广泛应用，各种小型终端需要开发出与外界联系的USB接口。目前，常用的技术有两种。基于单片机的USB接口，特点是需要外置芯片，电路复杂，留下的CPU资源不多；基于ARM的USB接口，特点是资源丰富，但ARM系列产品较多，如果选型不当，还需要搭接较多的外围电路，且不能很好地发挥CPU性能。 USB(Universal Serial Bus)是通用串行总线的缩写，因其具有方便易用，动态...[详细]
stm32/stm8
