SC3
Vishay Electro-Films
NiCr Thin Film, Top-Contact Resistor
CHIP
RESISTORS
FEATURES
•
Wire bondable
Product may not
be to scale
•
Small single chip size: 0.050 inches square
•
Resistance range: 100
Ω
to 50 kΩ
•
Resistor material: Nichrome
•
Oxidized silicon substrate for good power dissipation
•
400 mW capability
•
User trimmable
The SC3 series resistor chips on silicon offer a combination
of nichrome stability, wide resistance range and higher
power rating than is available on the same sized ceramic
substrate.
The SC3’s are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The SC3s are 100 % electrically tested and
visually inspected to MIL-STD-883.
APPLICATIONS
Vishay EFI SC3 chip resistors have excellent power dissipation capability and are ideally suited for prototyping.
Typical application areas are:
•
Amplifiers
•
Couplers
•
Oscillators
•
Filters
•
Attenuators
Recommended for hermetic environments where die is not exposed to moisture.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
0.1 %
PROCESS CODE
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
CLASS H*
202
200
201
*MIL-PRF-38534 inspection criteria
CLASS K*
206
204
205
100
Ω
50 k
Ω
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
Stability, 1000 h, + 125 °C
Operating Temperature Range
ThermalShock, MIL-STD-202, Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at + 70 °C (Derated to Zero at + 150 °C)
5 x Rated Power Short-Time Overload, + 25 °C, 5 s
- 20 dB typ.
± 0.1 % max.
ΔR/R
- 55 °C to + 125 °C
± 0.25 % max.
ΔR/R
± 0.25 % max.
ΔR/R
200 V
10
12
min.
100 V max.
400 mW
± 0.25 % max.
ΔR/R
www.vishay.com
46
For technical questions contact: efi@vishay.com
Document Number: 61014
Revision: 12-Mar-08
SC3
NiCr Thin Film, Top-Contact Resistor
Vishay Electro-Films
DIMENSIONS
in inches
CHIP
RESISTORS
0.050
0.045
0.050
0.0075
0.0075
SCHEMATIC
MECHANICAL SPECIFICATIONS
in inches
PARAMETER
Chip Size
Chip Thickness
Chip Substrate Material
Resistor Material
Bonding Pad Size
Number of Pads
Pad Material
Backing
Options:
Gold backing for eutectic die attach
Aluminum bonding pads, 10 kÅ minimum thickness
User trimmable
Consult Applications Engineer
0.050 x 0.050 ± 0.003 (1.27 x 1.27 ± 0.076 mm)
0.010 ± 0.002 (0.254 ± 0.05 mm)
Oxidized silicon, 10 kÅ minimum SiO
2
Nichrome
0.0075 x 0.045 (0.190 x 1.143 mm) minimum
2
15 kÅ minimum gold standard
None, lapped semiconductor silicon
ORDERING INFORMATION
Example: 100 % visual, 500
Ω,
± 10 %, ± 50 ppm/°C TCR, gold pads, class H visual inspection
W
INSPECTION/
PACKAGING
W = 100 % visually inspected
parts in matrix tray per
MIL-STD-883
X = Sample, commercial visually
inspected parts loaded in matrix
trays (4 % AQL)
SC3
PRODUCT
FAMILY
200
PROCESS
CODE
See Process Code
table
5000
RESISTANCE
VALUE
Use the first 4
significant digits
of the resistance
A
MULTIPLIER
CODE
B
= 0.01
A
= 0.1
0
=1
1
= 10
2
= 100
K
TOLERANCE
CODE
B
= 0.1 %
D
= 0.5 %
F
= 1.0 %
G
= 2.0 %
H
= 2.5 %
J
= 5.0 %
K
= 10 %
Document Number: 61014
Revision: 12-Mar-08
www.vishay.com
47
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
1
FPGA/CPLD
