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Y4063412R000F0R

Fixed Resistor, Metal Foil, 0.5W, 412ohm, 1% +/-Tol, -2.5,2.5ppm/Cel, 1206

器件类别:无源元件    电阻器   

厂商名称:Vishay(威世)

厂商官网:http://www.vishay.com

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Vishay(威世)
Reach Compliance Code
compliant
ECCN代码
EAR99
构造
Chip
制造商序列号
FRSH
端子数量
2
最高工作温度
200 °C
最低工作温度
-55 °C
封装高度
0.64 mm
封装长度
3.2 mm
封装形式
SMT
封装宽度
1.57 mm
包装方法
TR
额定功率耗散 (P)
0.5 W
电阻
412 Ω
电阻器类型
FIXED RESISTOR
系列
FRSH
尺寸代码
1206
技术
METAL FOIL
温度系数
-2.5,2.5 ppm/°C
容差
1%
文档预览
FRSH Series (0603, 0805, 1206, 1506, 2010, 2512) (Z1-Foil)
Vishay Foil Resistors
Ultra High Precision Foil Wraparound Surface Mount Chip Resistor
with Extended Pads for High Power/High Temperature Applications
up to +225°C, Load Life Stability of 0.05% ,TCR to ± 1ppm/°C
FEATURES
Temperature coefficient of resistance (TCR):
±1 ppm/°C typical (- 55 °C to + 125 °C, + 25 °C ref.)
±2.5 ppm/°C typical (- 55 °C to + 200 °C, + 25 °C
ref.)
Resistance range: 10 to 125 k(for higher
and lower values, please contact VFR's
application engineering department)
Resistance tolerance: to ± 0.02 %
Working power
(1)
: to 1200mW at + 70 °C;
to 330mW at + 200 °C
Long term stability: to ± 0.05 % at + 225 °C for 2000h,
no power
Load life stability: to ± 0.05 % at + 200 °C for 2000h, at
working power
Vishay Foil resistors are not restricted to standard values;
specific "as required" values can be supplied at no extra
cost or delivery (e.g. 1K2345 vs. 1K)
Thermal stabilization time < 1 s (nominal value achieved
within 10 ppm of steady state value)
Electrostatic discharge (ESD) at least to 25 kV
Non inductive, non capacitive design
Rise time: 1 ns effectively no ringing
Current noise: 0.010 µV (RMS)/Volt of applied voltage
(< - 40 dB)
Voltage coefficient: < 0.1 ppm/V
Non inductive: < 0.08 µH
Non hot spot design
Terminal finishes available:
High Temperature solder -
Solidus temperature: +236°C
Liquidus temperature: +244°C
Matched sets are available on request
Prototype quantities available in just 5 working days
or sooner. For more information, please contact
foil@vishaypg.com
INTRODUCTION
Vishay Foil Resistors (VFR) introduces a new line of Ultra
Precision Bulk Metal
®
Z1-Foil technology: wraparound
surface mount chip resistors with extended pads for high
temperature up to + 225 °C
(1)
(working power: to 330mW at
+200 °C).
The new extended pad designs also exhibit better heat
dissipation, thus enabling higher power usage (Working
Power: to 1200mW at + 70°C
(1)
). The FRSH has a full
wraparound termination that ensures safe handling during
the manufacturing process, as well as providing stability
during multiple thermal cyclings.
The FRSH is available in any value within the specified
resistance range. VFR's application engineering department
is available to advise and make recommendations. For
non-standard
technical
requirements
and
special
applications, please contact
foil@vishaypg.com.
TABLE 1 - TOLERANCE AND TCR VS.
RESISTANCE VALUE
(1)(2)
(- 55 °C to + 200 °C, + 25 °C Ref.)
RESISTANCE
VALUE
()
250to 125K
100to < 250
50to < 100
25to < 50
10 to < 25
TOLERANCE
(%)
± 0.02
± 0.05
± 0.1
± 0.25
± 0.5
Percent of Rated Power
Note
(1)
Performances obtained with ceramic PCB.
(2)
For tighter performances and non-standard values up to 150 k,
please contact VFR's application engineering department by
sending an e-mail to the address in the footer below.
Document Number: 63211
Revision: 21-Dec-11
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TCR Typical
(ppm/°C)
-55°C
+70°C
FIGURE 1 - POWER DERATING CURVE
100
75
50
25
0
-75
±2.5
-50
-25
0
+25
+50
+75 +100 +125 +150 +175 +200 +225 +250
Ambient Temperature (°C)
For any questions, contact:
foil@vishaypg.com
www.vishayfoilresistors.com
1
FRSH Series (0603, 0805, 1206, 1506, 2010, 2512) (Z1-Foil)
Vishay Foil Resistors
HIGH TEMPERATURE PRODUCTS
Resistors are the passive building blocks of an electrical
circuit.  They may be used for dropping the voltage, buffering
the surge when the circuit is turned on, providing feedback in
a monitoring loop, sensing current flow, etc. When the
application requires stability over time and load, initial
accuracy, minimal change with temperature for more than
200 °C, resistance to moisture and a number of other
characteristics that will be described below, only the new
generation of Vishay Foil Resistors have the attributes
needed for such application. Over the past few months, there
has been considerable growth in the demand for precise,
stable and reliable resistors that can operate in harsh
environments and especially at high temperatures to 220 °C.
Many analog circuits for industrial, military, aerospace,
medical, down-hole, oil well and automotive applications
require passive components such as resistors to have a
minimal drift from their initial values when operating above +
175 °C and in humid environments. In these applications, the
most important factor is the temperature dependence and
the end of life tolerance (which is part of the stability) and to
a lesser extent, the initial tolerance.
The new Vishay Foil resistors provide stabilities well under
the maximum allowable drift required by customers’
specifications through thousands of hours of operation under
harsh conditions, such as the extreme temperatures and
radiation-rich environments of down-hole oil-well logging
applications, in the frigid arctic, under the sea or in deep
space. All Bulk Metal
®
Foil resistors receive stabilization
processing, such as repetitive short term power overloads, to
assure reliable service through the unpredictable stresses of
extreme operation. Compared to Bulk Metal
®
Foil, thick and
thin film resistor elements are produced with a
non-controllable material. Heat or mechanical stresses on
the resistive elements cause the particles forming the film to
expand. However, after these stresses are alleviated, the
particles in the film matrix do not return to the exact original
position. That degenerates their overall stability.
Vishay Foil Resistors’ Ultra High Precision Bulk Metal
®
Foil
technology includes many types of resistors with a variety of
standard configurations that can withstand unconventional
environmental conditions above and below the earth’s
surface using special post manufacturing operations
specially developed for this purpose. The stability of a
resistor depends primarily on its history of exposures to high
temperature. Stability is affected by:
1. Changes in the ambient temperature and heat from
adjacent components (defined by the Temperature
Coefficient of Resistance, or TCR)
2. Destabilizing thermal shock of suddenly-applied power
(defined by the Power Coefficient of Resistance, or PCR)
3. Long-term exposure to applied power (load-life stability)
4. Repetitive stresses from being switched on and off
In very high-precision resistors that need to operate in an
environment with temperatures above + 175 °C, these
effects must be taken into account to achieve high stability
with changes in load (Joule Effect) and ambient temperature.
The Bulk Metal
®
Foil Resistors’ new Z1-Foil technology
provides an order of magnitude reduction in the Bulk Metal
®
Foil element’s sensitivity to temperature changes — both
external and internal – with emphasis on long term stability in
high temperature environments.
In order to take full advantage of the low TCR and long term
stability improvement, it is necessary to take into account the
differences in the resistor’s response to each of the
above-mentioned effects. As described below, new products
have been developed to successfully deal with these factors.
For high temperature applications where stability and total
error budget is the main concern, the new generation of
Vishay Foil resistors offers the best resilience against time at
elevated temperature.
The new Vishay Foil technology allows us to produce
customer-oriented products designed to satisfy unique and
specific technical requirements. In addition to the special
chip stabilization under extreme environment conditions in
the production line, we offer additional specially oriented post
manufacturing operations (PMO) for high temperature
applications that require an even higher degree of reliability
and stability.
Electrostatic Discharge (ESD) is another potential problem
that can cause unpredictable failure in high temperature
applications that increase the sensitivity of the resistors to
ESD.
www.vishayfoilresistors.com
2
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For any questions, contact:
foil@vishaypg.com
ESD damage to electronic devices can occur at any point in
the device’s life cycle, from manufacturing to field service. A
resistor that is exposed to an ESD event may fail immediately
or may experience a latent defect. With latent defects,
premature failure can occur after the resistor is already
functioning in the finished product after an unpredictable
length of service. Bulk Metal
®
Foil resistors  are capable of
withstanding electrostatic discharges at least to 25 kV without
degradation.
VFR’s Application Engineering department is always
available to assist with any special requirements you might
have. If you are not sure which resistor best suits your needs,
please do not hesitate to contact them for more information:
Foil@vishaypg.com
Document Number: 63211
Revision: 21-Dec-11
FRSH Series (0603, 0805, 1206, 1506, 2010, 2512) (Z1-Foil)
Vishay Foil Resistors
FIGURE 2 - TRIMMING TO VALUES
(Conceptual Illustration)
TABLE 4 - SPECIFICATIONS
(1)
CHIP
SIZE
0603
0805
1206
1506
2010
2512
RATED
POWER (mW)
at + 70°C
120
300
500
600
800
1200
WORKING
POWER (mW)
at + 200 °C*
33
83
140
167
220
330
RESISTANCE
RANGE
()
100 to 5K
10to 8K
10to 25K
10to 30K
10 to 70K
10to 125K
Interloop Capacitance
Reduction in Series
Current Path
Before Trimming
Current Path
After Trimming
Trimming Process
Removes this Material
from Shorting Strip Area
Changing Current Path
and Increasing
Resistance
Mutual Inductance
Reduction due
to Change in
Current Direction
To acquire a precision resistance value, the Bulk Metal
®
Foil
chip is trimmed by selectively removing built-in “shorting bars.”
To increase the resistance in known increments, marked areas
are cut, producing progressively smaller increases in resistance.
This method reduces the effect of “hot spots” and improves the
long term stability of the Vishay Foil chips.
TABLE 2- DIMENSIONS AND LAND PATTERN
in Inches (Millimeters)
Top View
L
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Note:
Foil shown in black, etched spaces in white
Note
*
Maximum working voltage for a given resistance value is calculated
using
V
=
P
R
.
Recommended Land Pattern*
Footprint
T
W
G
X
Z
Extended Pads
D
CHIP
SIZE
0805
1206
1506
2010
2512
L
± 0.005 (0.13)
0.063 (1.60)
0.080 (2.03)
0.126 (3.20)
0.150 (3.81)
0.198 (5.03)
0.249 (6.32)
W
± 0.005 (0.13)
0.032(0.81)
0.050 (1.27)
0.062 (1.57)
0.062 (1.57)
0.097 (2.46)
0.127 (3.23)
THICKNESS
MAXIMUM
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
D
± 0.005 (0.13)
0.011 (0.28)
0.015 (0.38)
0.035 (0.89)
0.047 (1.20)
0.071 (1.82)
0.095 (2.43)
Z
G
X
0.031 (0.78)
0.050 (1.27)
0.071 (1.80)
0.071 (1.80)
0.103 (2.62)
0.127 (3.23)
0603
0.102 (2.59)
0.122 (3.10)
0.175 (4.45)
0.199 (5.05)
0.247 (6.27)
0.291 (7.39)
0.031 (0.78)
0.028 (0.71)
0.029 (0.74)
0.029 (0.74)
0.029 (0.74)
0.029 (0.74)
* For 0603 and 0805 land pattern dimensions are per IPC-782
TABLE 3 - COMPARATIVE PERFORMANCES
(2)
- THIN FILM VS. BULK METAL
®
Z1-FOIL
TECHNOLOGY
R
LIMITS OF
THIN FILM
(TYPICAL)
± 0.1 %
± 0.1 %
± 0.1 %
± 0.5 %
± 0.5 %
R
LIMITS OF
BULK METAL
®
Z1-FOIL TECHNOLOGY -
FRSH SERIES
(1)
(TYPICAL)
± 0.05% (500 ppm)
± 0.0025% (25 ppm)
± 0.003% (30 ppm)
± 0.05% (500 ppm)
± 0.05 % (500 ppm)
TEST OR CONDITIONS
Thermal Shock, 5 x (- 65 °C to + 200 °C)
Low Temperature Operation, - 65 °C, 45 min at Rated Power
Moisture Resistance
Load Life Stability, + 200 °C for 2000 h at Working Power (see table 4)
Long term stability, + 225 °C for 2000h, no power.
Notes
(1)
Performances obtained with ceramic PCB.
(2)
As shown + 0.01
to allow for measurement errors at low values.
Document Number: 63211
Revision: 21-Dec-11
For any questions, contact:
foil@vishaypg.com
www.vishayfoilresistors.com
3
FRSH Series (0603, 0805, 1206, 1506, 2010, 2512) (Z1-Foil)
Vishay Foil Resistors
FIGURE 3 - RECOMMENDED MOUNTING
Notes
(1)
IR and vapor phase reflow are recommended.
(2)
Avoid the use of cleaning agents which could attack epoxy resins, which form part
of the resistor construction
(3)
Vacuum pick up is recommended for handling
(4)
In case of using soldering iron, measurement precautions should be taken to avoid
damaging the resistor
PULSE TEST
All parts baked at +125°C for 1 hour and allowed to cool at room
temperature for 1 hour, prior to testing. By using an electrolytic
0.01µF capacitor charged to 1200 VDC, a single pulse was
performed on 30 units of 1206, 10K of Surface Mount Vishay Foil
resistor and Thin Film resistor. The unit was allowed time to cool
down, after which the resistance measurement was taken and
displayed in ppm deviation from the initial reading.
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2
"#

*+
140000
120000
100000
80000
60000
40000
20000
0
-20000
ΔR (ppm)
0
5
10
15
Resistor #
20
25
30
TEST DESCRIPTION
FIGURE 4 - PULSE TEST DESCRIPTION
!)
TEST RESULTS
FIGURE 5 - PULSE TEST RESULTS AT 1200 VDC*
Thin Film
Bulk Metal
®
Foil
Size: 1206
Value: 10K
n = 30
*Note: Average of 30 units yielded deviation of 30,723 ppm of the
thin film vs. -14 ppm for the Bulk Metal
®
Foil
www.vishayfoilresistors.com
4
For any questions, contact:
foil@vishaypg.com
Document Number: 63211
Revision: 21-Dec-11
FRSH Series (0603, 0805, 1206, 1506, 2010, 2512) (Z1-Foil)
Vishay Foil Resistors
ELECTROSTATIC DISCHARGE (ESD)
ESD can be categorized into three types of damages
Parametric Failure
- occurs when the ESD event alters one or more
device parameters (resistance in the case of resistors), causing it to
shift from its required tolerance. This failure does not directly pertain
to functionality; thus a parametric failure may be present while the
device is still functional.
Catastrophic Damage
- occurs when the ESD event causes the
device to immediately stop functioning. This may occur after one or
a number of ESD events with diverse causes, such as human body
discharge or the mere presence of an electrostatic field.
Latent Damage
- occurs when the ESD event causes moderate
damage to the device, which is not noticeable, as the device appears
to be functioning correctly. However, the load life of the device has
been dramatically reduced, and further degradation caused by
operating stresses may cause the device to fail during service.
Latent damage is the source for greatest concern, since it is very
difficult to detect by re-measurement or by visual inspection, since
damage may have occurred under the external coating.
TEST DESCRIPTION
TEST RESULTS
FIGURE 6 - ESD TEST DESCRIPTION
2500 V to 4500 V
1 MΩ
500 pF
Rx
By using an electrolytic 500 pF capacitor charged up to 4500 V,
pulses were performed on groups of 10 units of 1206, 10 k of three
different Surface Mount Chip Resistors technologies, with an initial
voltage spike of 2500 V (Figure 6). The unit was allowed time to cool
down, after which the resistance measurement was taken and
displayed in ppm deviation from the initial reading. Readings were
then taken in 500 V increments up to 4500 V. Table 5 shows the
maximum drift in each group.
New
- For live demonstration of ESD pulses, please visit our new
video landing page:
http://www.vishaypg.com/foil-resistors/videos/
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DMM
TABLE 5 - ESD TEST RESULTS
VOLTS
2500
3000
3500
4000
4500
∆R
(%)
FOIL
<0.005
<0.005
<0.005
<0.005
<0.005
97
366
>5000
>5000
OPEN
THICK FILM
-2.7
-4.2
-6.2
-7.4
-8.6
THIN FILM
Document Number: 63211
Revision: 21-Dec-11
For any questions, contact:
foil@vishaypg.com
www.vishayfoilresistors.com
5
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