FRFC Series 0805, 1206, 1506, 2010, 2512
(Z1 Foil Technology)
Ultra High Precision Z1 Foil Technology Flip Chip Resistor for Load Life
Stability of 0.005% (50 ppm) with TCR of ± 0.2, 35% Space Saving vs.
Wraparound Design, Power to 750mW
Temperature coefficient of resistance (TCR):
± 0.2 ppm/°C typical (- 55 °C to + 125 °C,
+ 25 °C ref.)
Resistance range: 5
to 125 k(for higher
values, please contact us)
Tolerance: to ± 0.01 % (100 ppm)
Power coefficient “R due to self heating”
5 ppm at rated power
Power rating: 750 mW at + 70 °C (see table 2)
Load life stability: ± 0.005% typical at 70 °C, 2000 h
(rated power)
Foil resistors are not restricted to standard values; specific
“as required” values can be supplied at no extra cost or
delivery (e.g. 1K2345 vs. 1K)
Non-inductive, non-capacitive design
Short time overload 0.005 % (50 ppm)
Electrostatic discharge (ESD) at least to 25kV
Thermal stabilization time < 1 s (nominal value achieved
within 10 ppm of steady state value)
Non hot spot design
Rise time: 1 ns effectively no ringing
Current noise: 0.010 µV
RMS
/V of applied voltage
(< - 40 dB)
Voltage coefficient: 0.1 ppm/V
Non-inductive: 0.08 µH
Terminal finishes available: lead (Pb)-free, tin/lead alloy
Matched sets are available per request
quantities
available,
please
contact
Prototype
foil@vpgsensors.com
FEATURES
INTRODUCTION
The FRFC is based on the new generation Z1 Foil
Technology of the Bulk Metal
®
Precision Foil resistor
elements by Vishay Precision Group (VPG), which makes
these resistors virtually insensitive to destabilizing factors.
Their element, based on the new Z1 Foil Technology is a
solid alloy that displays the desirable bulk properties of its
parent material; thus, it is inherently stable (remarkably
improved load life stability of 30 ppm), noise-free and
withstands ESD to 25KV or more. The alloy is matched to the
substrate and forms a single entity with balanced
temperature characteristics for an unusually low and
predictable TCR over a wide range from - 55 °C to more than
+ 125 °C. Resistance patterns are photo-etched to permit
trimming of resistance values to very tight tolerances.
The flip chip configuration provides a substantial PCB space
saving of more than 35 % vs. a surface mount chip with
wraparound terminations. The FRFC is available in any
value within the specified resistance range.
The FRFC Series is an upgraded version of the VFCP Series
(Z Foil) with an improved rated power of 750mW.
FIGURE 1 - POWER DERATING CURVE
- 55 °C
+ 70 °C
RESISTANCE
VALUE
()
250to 125K
100to < 250
50to < 100
25to < 50
10to < 25
5 to <10
TOLERANCE
(%)
± 0.01
± 0.02
± 0.05
± 0.1
± 0.25
± 0.5
TYPICAL TCR AND
MAX. SPREAD
(- 55 °C to + 125 °C,
+ 25 °C Ref.)
± 0.2 ± 1.6
± 0.2 ± 1.6
± 0.2 ± 1.8
± 0.2 ± 2.8
± 0.2 ± 2.8
±0.2 ±7.8
Rated Power (%)
TABLE 1 - TOLERANCE AND TCR VS.
RESISTANCE VALUE
(1)
100
75
50
25
0
- 75
- 50
- 25
0
+ 25 + 50 + 75 + 100 + 125 + 150 + 175
Ambient Temperature (°C)
Lead (Pb)-free terminals
Tin/lead alloy terminals
Notes
(1)
For
tighter performances and non-standard values, please contact VFR’s application engineering at
foil@vpgsensors.com
* This datasheet provides information about parts that are RoHS-compliant and/or parts that are non-RoHS-compliant. For example, parts with
lead (Pb) terminations are not RoHS compliant. Please see the information/tables in this datasheet for details.
Document Number: 63237
Revision: 15-Oct-15
For any questions, contact
foil@vpgsensors.com
www.vishayfoilresistors.com
1
FRFC Series 0805, 1206, 1506, 2010, 2512
(Z1 Foil Technology)
FIGURE 2 - TRIMMING TO VALUES
(Conceptual Illustration)
Interloop
Capacitance
Reduction
in Series
Mutual Inductance
Reduction due
to Change in
Current Direction
Current Path
Before Trimming
Current Path After Trimming
Trimming Process
Removes this Material
from Shorting Strip Area
Changing Current Path
and Increasing
Resistance
Foil shown in black, etched spaces in white
Note
To acquire a precision resistance value,
the Bulk Metal Foil chip is trimmed by
selectively removing built-in “shorting bars.”
To increase the resistance in known increments,
marked areas are cut, producing progressively
smaller increases in resistance. This method
reduces the effect of “hot spots” and improves
the long-term stability of VFR resistors.
TABLE 2 - SPECIFICATIONS
CHIP SIZE
RATED POWER (mW)
at
+ 70 °C
200
300
400
500
750
MAXIMUM
VOLTAGE RATING
(
P
R
)
40
86
109
187
306
RESISTANCE RANGE ()
MAXIMUM WEIGHT
(mg)
5.2
10.3
12
25
35
0805
1206
1506
2010
2512
5to 8K
5to 25K
5to 30K
5to 70K
5to 125K
TABLE 3 - FRFC PERFORMANCE LIMITS (MIL-PRF-55342)
TEST
Short Time Overload
High Temperature Exposure
Low Temperature Operation
Moisture Resistance
Load Life Test, 70°C, 2,000 h
Resistance to Soldering Heat
Thermal Shock
Thermal Shock
(1)
(2)
CONDITIONS
6.25 x P
nom.
+150°C, 100 hrs
- 65 °C, 45 min @ rated power (see table 2)
Per MIL-PRF-55342 (p. 4.8.9)
@ rated power (see table 2)
P.4.8.8.1
5 x (- 65 °C to + 150 °C)
100 x (- 65 °C to + 150 °C)
TYPICAL LIMIT % (PPM)
± 0.005% (50)
± 0.005% (50)
± 0.005% (50)
± 0.005% (50)
± 0.005% (50)
± 0.005% (50)
(2)
± 0.001% (10)
± 0.003% (30)
MAX LIMIT % (PPM)
(1)
± 0.01% (100)
± 0.01% (100)
± 0.01% (100)
± 0.03% (300)
± 0.01% (100)
± 0.01% (100)
(2)
± 0.005% (50)
± 0.01% (100)
As shown + 0.01
to allow for measurement errors at low values.
For R<100
,
the performance depends on PCB design and assembly.
www.vishayfoilresistors.com
2
For any questions, contact
foil@vpgsensors.com
Document Number: 63237
Revision: 15-Oct-15
FRFC Series 0805, 1206, 1506, 2010, 2512
(Z1 Foil Technology)
TABLE 4 - DIMENSIONS AND LAND PATTERN
in inches (millimeters)
BOTTOM VIEW (showing terminals for mounting)
D
Solder Terminals
LAND PATTERN
W
W1 (W - 0.003")
G
X
L1 (L - 0.005")
L
Z
CHIP
SIZE
0805
1206
1506
2010
2512
Notes
•
•
•
L
± 0.005 (0.13)
0.079 (2.01)
0.126 (3.20)
0.150 (3.81)
0.200 (5.08)
0.250 (6.35)
W
± 0.005 (0.13)
0.049 (1.24)
0.062 (1.57)
0.062 (1.57)
0.100 (2.54)
0.126 (3.20)
THICKNESS
MAXIMUM
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
D
± 0.005 (0.13)
0.010 (0.25)
0.015 (0.38)
0.012 (0.30)
0.020 (0.51)
0.024 (0.61)
Z
0.078 (1.98)
0.125 (3.18)
0.150 (3.81)
0.199 (5.05)
0.250 (6.35)
G
0.053 (1.35)
0.090 (2.29)
0.120 (3.05)
0.153 (3.89)
0.196 (4.98)
X
0.049 (1.24)
0.062 (1.57)
0.062 (1.57)
0.100 (2.54)
0.126 (3.20)
Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction
Vacuum pick up is recommended for handling
Soldering iron is not recommended
FIGURE 3 - CHIP CONFIGURATION
FIGURE 4 - TYPICAL RESISTANCE/
TEMPERATURE CURVE
(for more details, see table 1)
+250
+250
+200
+150
+100
+50
0
0.05 ppm/ºC
- 0.1 ppm/ºC
0.1 ppm/ºC
0.14 ppm/ºC
- 0.16 ppm/ºC
-55
-25
0
+25
0.2 ppm/ºC
+65
+75
+100
+125
-50
-100
-150
-200
-250
High Purity Alumina Substrate
Resistive
Bulk
®
Metal Foil
Δ
R
+200
+150
+100
+50
0
R
(ppm)
-50
-100
-150
-200
-250
Solder
Protective Coating
Note
• The TCR values for < 100
are influenced by the termination
composition and result in deviation from this curve
Document Number: 63237
Revision: 15-Oct-15
For any questions, contact
foil@vpgsensors.com
www.vishayfoilresistors.com
3
FRFC Series 0805, 1206, 1506, 2010, 2512
(Z1 Foil Technology)
FIGURE 5 - LOAD LIFE TEST
Load Life Test for 2000 hr @ 0.1W and 0.2W, +70°C
FRFC0805; Average of n=34 resistors per each size and power
200
150
100
50
100Ω, 0.2W
8 kΩ, 0.2W
∆R (ppm)
0
0
–50
200
400
600
800
1000
1200
1400
1600
1800
2000
100Ω, 0.1W
8 kΩ, 0.1W
–100
–150
–200
Time (hrs)
FIGURE 6 - THERMAL SHOCK TEST
Thermal Shock
5 and 100 x (–65°C to +150°C),
n=10 per each value
100
75
100Ω, x5 cycles
100Ω, x100 cycles
1 kΩ, x5 cycles
50
1 kΩ, x100 cycles
25
0
8 kΩ, x5 cycles
8 kΩ, x100 cycles
www.vishayfoilresistors.com
4
∆R (ppm)
For any questions, contact
foil@vpgsensors.com
Document Number: 63237
Revision: 15-Oct-15
FRFC Series 0805, 1206, 1506, 2010, 2512
(Z1 Foil Technology)
POWER COEFFICIENT OF RESISTANCE (PCR)
The TCR of a resistor for a given temperature range is established by measuring the resistance at two different ambient temperatures: at room
temperature and in a cooling chamber or oven. The ratio of relative resistance change and temperature difference gives the slope of
R/R = f (T)
curve. This slope is usually expressed in parts per million per degree Centigrade (ppm/°C). In these conditions, a uniform temperature is achieved
in the measured resistance. In practice, however, the temperature rise of the resistor is also partially due to self-heating as a result of the power
it is dissipating (self-heating). As stipulated by the Joule effect, when current flows through a resistance, there will be an associated generation
of heat. Therefore, the TCR alone does not provide the actual resistance change for precision resistor. Hence, another metric is introduced to
incorporate this inherent characteristic – the Power Coefficient of Resistance (PCR). PCR is expressed in parts per million per Watt or in ppm at
rated power. In the case of Z-based Bulk Metal® Foil, the PCR is 5 ppm typical at rated power or 4 ppm per Watt typical for power resistors.
FIGURE 7 - BEHAVIOR OF THREE
DIFFERENT RESISTOR
TECHNOLOGIES UNDER
APPLIED POWER (POWER
COEFFICIENT TEST)
0.1
0.2
0.3
0.4
Thin Film
Chip Resistor
0.5
POST MANUFACTURING OPERATIONS
(PMO) ENHANCE THE ALREADY SUPERIOR
STABILITY OF FOIL RESISTORS
These Post Manufacturing Operations (PMOs) are uniquely
applicable to resistors made of resistive foil and they take the
already superior stability of Vishay Foil resistors one step further.
They constitute an exercising of the resin that bonds the foil to the
substrate, the foil, the alumina,the molding and the contacts. The
operations employed are:
Temperature Cycling/Thermal Shock
Short Time Overload/Power Shot (Accelerated Load Life)
Power Conditioning
Temperature Cycling
+ 100
ppm
Thick Film
Chip Resistor
0
ppm
Z-Foil
Chip Resistor
Temperature Cycling is done initially in the chip stage of all
production and will eliminate any fallout. The cycling exercises the
Foil and the contacts without reducing its initial bonding strength. A
small reduction in resistance is tolerable during this PMO.
Short Time Overload (Accelerated Load Life)
-
100
ppm
Applied power,
(W)
Value:
1K
Short Time Overload (STO) occurs when a circuit is subjected at one
point in time to a temporary, unexpected high pulse (or overload)
that can result in device failure. This STO is performed on all
resistors during manufacturing, with a function to eliminate any hot
spots if they exist.
Power Conditioning
The standard load life curve of a Foil resistor exhibits a significant
portion of its change in the first 250-500 hours, after which the curve
begins to stabilize. The power conditioning exercise applies a load
for a specified amount of time to eliminate this knee in the load life
curve. Upon delivery, the resistor will be on the flat part of the curve
for your convenience. The power conditioning is a function of the
application and should be worked out between our Applications
Engineering department and your design team.
Can We Use PMO on Other Resistor Technologies?
Applying these same operations to resistors of Thick Film, Thin Film,
and Wirewound have vastly different consequences and can drive
these devices out of tolerance or open circuit. These devices
experience too many failures to discuss here. On the other hand,
these operations are an enhancement to Foil resistor performance
and should be considered when the level of stability required is
beyond the published limits for standard products.
Document Number: 63237
Revision: 15-Oct-15
For any questions, contact
foil@vpgsensors.com
www.vishayfoilresistors.com
5
Microchip MCU
