DATA SHEET
SEMICONDUCTOR
YSESD3ZxxBT1G Series
BIDIRECTIONAL TVS DIODES
APPLICATIONS
◆
Cell Phone Handsets and Accessories
◆
Microprocessor based equipment
◆
Personal Digital Assistants (PDA’s)
◆
Notebooks, Desktops, and Servers
◆
Portable Instrumentation
◆
Peripherals
◆
Pagers
H
SOD-323
IEC COMPATIBILITY
◆
IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
◆
IEC61000-4-4 (EFT) 40A (5/50ηs)
◆
IEC61000-4-5 (Lightning) 24A (8/20µs)
PIN CONFIGURATION
FEATURES
◆
350 Watts Peak Pulse Power per Line (tp=8/20µs)
◆
Protects one I/O or power line
◆
Low clamping voltage
◆
Working voltages: 3.3V ~ 36V
◆
Low leakage current
MECHANICAL CHARACTERISTICS
◆
SOD-323 Package
◆
Molding Compound Flammability Rating : UL 94V-O
◆
Weight 5 Millgrams (Approximate)
◆
Quantity Per Reel : 3,000pcs
◆
Reel Size : 7 inch
◆
Lead Finish : Lead Free
http://www.yeashin.com
1
REV.03 20140705
DEVICE CHARACTERISTICS
YSESD3ZxxBT1G Series
MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified)
PARAMETER
Peak Pulse Power (tp=8/20µs waveform)
Lead Soldering Temperature
Operating Temperature Range
Storage Temperature Range
SYMBOL
P
PP
T
L
T
J
T
STG
VALUE
350
260 (10 sec.)
-55 ~ 150
-55 ~ 150
UNITS
Watts
℃
℃
℃
ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified)
DEVICE
MARKING
V
RWM
(V)
V
B
(V)
(mA)
1
1
1
1
1
1
1
1
I
T
V
C
@1A
(max.) (max.)
7
9.8
13.4
19
24
29
43
60
10.5
18
24
32
38
45
52
75
(@A)
20
17
12
11
10
9
7
5
V
C
I
R
(µA)
C
T
(pF)
PART NUMBER
(max.) (min.)
YSESD3Z3.3BT1G
YSESD3Z05BT1G
YSESD3Z08BT1G
YSESD3Z12BT1G
YSESD3Z15BT1G
YSESD3Z18BT1G
YSESD3Z24BT1G
YSESD3Z36BT1G
2A
2B
2C
2D
2J
2K
2H
2N
3.3
5
8
12
15
18
24
36
4
6
8.5
13.3
16.7
20
26.7
40
(max.) (max.)
40
10
1
1
1
1
1
1
450
200
100
75
68
57
50
40
http://www.yeashin.com
2
REV.03 20140705
PACKAGE OUTLINE & DIMENSIONS
YSESD3ZxxBT1G Series
* SOLDERING FOOTPRINT
http://www.yeashin.com
3
REV.03 20140705
