FERRITE CHIP BEADS
1. PART NO. EXPRESSION :
Z5 SERIES
Z5K600-RP-10
(a)(b)(c) (d)
(e) (f)
(g)
(a) Series code
(b) Dimension code
(c) Material code
(d) Impedance code : 600 = 60
(e) R : Reel
(f) Current code : P = 4000mA
(g) 10 : Lead Free
2. CONFIGURATION & DIMENSIONS :
A
D
L
G
B
C
PCB Pattern
Unit:m/m
A
B
C
D
G
2.20 Ref.
H
3.40 Ref.
L
4.40 Ref.
3.20±0.20 2.50±0.20 1.30±0.20 0.50±0.30
3. SCHEMATIC :
4. MATERIALS :
b
a
Ag(100%)
Ni(100%)-1.5um(min.)
Sn(100%)-3.0um(min.)
(a) Body : Ferrite
(b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION :
a) Temp. rise : 30°C Max.
b) Rated current : Base on temp. rise
c) Storage temp. : -55°C to +125°C
d) Operating temp. : -55°C to +125°C
e) Resistance to solder heat : 260°C.10secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
H
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
FERRITE CHIP BEADS
6. ELECTRICAL CHARACTERISTICS :
Part Number
Z5K600-RP-10
Z5K900-RL-10
Z5K151-RR-10
Z5K201-RP-10
EIA
Size
1210
1210
1210
1210
Impedance
( )
60 ±25%
90 ±25%
150 ±25%
200 ±25%
Test
Frequency
( MHz )
100
100
100
100
DC Resistance
( )
Max.
0.03
0.10
0.02
0.03
Z5 SERIES
Rated Current
( mA )
Max.
4000
2000
5000
4000
7. IMPEDANCE VS. FREQUENCY CURVES :
Z5K600-R
40
0
H B3225K-6
P-00
C
Z5K600-RP -1
00T
200
160
Z5K900-RL-1
H B3225K-9
L-00
C
Z5K900-R
20
0
00T
160
IMP AN E(Ohm
ED C
)
IM
PED
ANC hm
E(O )
120
Z
80
120
80
Z
X
40
40
X
R
R
0
1000
1
10
100
1000
0
1
10
100
F
REQU CY
EN (MH
z)
F
REQU CY
EN (MH
z)
Z5K1
51
51T50
51-RR
0
H B3225K-1
-00
C
Z5K1 -RR-1
300
300
Z5K201
01T
-1
-RP
H B3225K-2
P -00
0
C
Z5K201-R
40
Z
IM
PED
ANC hm
E(O )
IM
PED
ANC hm
E(O )
200
Z
200
100
100
X
R
0
1
10
100
1000
0
1
10
100
X
R
1000
F
REQU CY
EN (MH
z)
F
REQU CY
EN (MH
z)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
FERRITE CHIP BEADS
8. RELIABILITY & TEST CONDITION :
Z5 SERIES
ITEM
Electrical Characteristics Test
Impedance
DC Resistance
Rated Current
Temperature Rise Test
Solder Heat Resistance
PERFORMANCE
TEST CONDITION
HP4291A, HP4287A+16092A
HP4338B
1. Applied the allowed DC current.
2. Temperature measured by digital surface thermometer.
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
Refer to standard electrical characteristics list
30°C max. ( t)
Appearance : No significant abnormality
Impedance change : Within ±30%
No mechanical damage
Remaining terminal electrode : 70% min.
Preheating Dipping
260°C
150°C
Natural
cooling
60
seconds
10±0.5
seconds
Solderability
More than 90% of the terminal electrode
should be covered with solder.
Preheating Dipping
245°C
150°C
Natural
cooling
Preheat : 150°C, 60sec.
Solder : Sn-Ag3.0-Cu0.5
Solder Temperature : 245±5°C
Flux for lead free : rosin
Dip Time : 4±1sec.
60
seconds
4±1.0
seconds
Terminal Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
For Z Series :
Size
1
2
3
4
5
6
Force (Kfg)
0.2
0.5
0.6
1.0
1.0
1.0
1.5
2.0
> 25
Time (sec)
W
W
7
8
Flexture Strength
The terminal electrode & the dielectric must
not be damaged by the forces applied on the
right conditions.
20(.787)
Bending
45(1.772)
45(1.772)
40(1.575)
Solder a chip on a test substrate, bend the substrate
by 2mm (0.079in) and return.
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
FERRITE CHIP BEADS
8. RELIABILITY & TEST CONDITION :
Z5 SERIES
ITEM
Bending Strength
PERFORMANCE
The ferrite should not be damaged by forces
applied on the right condition.
R0.5(0.02)
1.0(0.039)
TEST CONDITION
Series name
Z2
Z3
Z4
Z5
Z6
Z7
Z8
mm (inches)
0.80 (0.033)
1.40 (0.055)
2.00 (0.079)
2.70 (0.106)
P-Kgf
0.3
1.0
2.5
2.5
Chip
A
Random Vibration Test
Appearance : Cracking, shipping & any other
defects harmful to the characteristics should
not be allowed.
Impedance : Within ±30%
Drop 10 times on a concrete floor from a
height of 75cm.
Appearance : No damage.
Impedance : Within ±30% of initial value.
Frequency : 10-55-10Hz for 1 min.
Amplitude : 1.52mm
Directions & times : X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually perpendicular
directions (Total 6 hours).
a. No mechanical damage
b. Impedance change : ±30%
Temperature : 125±5°C
Applied Current : rated current
Duration : 500±12hrs
Measured at room temperature after placing for 2 to 3hrs.
Humidity : 90~95% RH.
Temperature : 40±2°C
Duration : 500±12hrs
Measured at room temperature after placing for 2 to 3hrs.
Drop
Loading at High
Temperature
Humidity
Thermal Shock
Appearance : No damage.
Impedance : Within ±30% of initial value.
Phase
1
2
Temperature (°C)
-55±2°C
+125±5°C
Times (min.)
30±3
30±3
For Z Series :
Condition for 1 cycle
Step1 : -55±2°C 30±3 min.
Step2 : +125±5°C 30±3 min.
Number of cycles : 5
Measured at room temperature after placing for 2 to 3hrs.
Temperature : -55±2°C
Duration : 500±12hrs
Measured at room temperature after placing for 2 to 3hrs.
Measured : 5 times
Low temperature storage test
Drop
Drop 10 times on a concrete floor from a
height of 75cm.
a. No mechanical damage
b. Impedance change : ±30%
Derating
6
6A
5A
4A
3A
2A
1.5A
1A
Derating Curve
Derated Current(A)
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85°C, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
5
4
3
2
1
0
85
125
Operating Tem perature(°C)
Operating Temperature(¢X )
C
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
FERRITE CHIP BEADS
9. SOLDERING AND MOUNTING :
9-1. Recommended PC Board Pattern
4.40
2.20
Z5 SERIES
9-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
9-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
9-2.2 Solder Wave :
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature
seen by the circuit when immersed in the molten solder wave, typical at 230°C. Due to the risk of thermal damage to
products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering
is shown in Fig. 2
9-2.3 Soldering Iron (Figure 3) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
d) 1.0mm tip diameter (max)
a) Preheat circuit and products to 150°C.
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
b) 350°C tip temperature (max)
f) Limit soldering time to 3 secs.
c) Never contact the ceramic with the iron tip
Preheating
Soldering
20~40s
TP(260°C/10s max.)
217
200
150
60~180s
25
480s max.
60~150s
TEMPERATURE °C
TEMPERATURE °C
Natural
cooling
3.40
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
Preheating
260
245
150
Soldering
Natural
cooling
Time(sec.)
Figure 1. Re-flow Soldering
Over 2min.
Gradual
Cooling
Within 3s
Preheating
Soldering
3s
(max.)
10s
(max.)
TEMPERATURE °C
Natural
cooling
Figure 2. Wave Soldering
350
330
150
Over 1min.
Gradual
Cooling
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
04.07.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
