型号
- 型号
- 关键词
RF and Baseband Circuit, 8 X 8 MM, QFN-56
厂商名称：Zarlink Semiconductor (Microsemi)
厂商官网：http://www.zarlink.com/
下载文档| 型号 | ZL20200/LCE | ZL20200/LDE |
|---|---|---|
| 描述 | RF and Baseband Circuit, 8 X 8 MM, QFN-56 | RF and Baseband Circuit, 8 X 8 MM, QFN-56 |
| 是否Rohs认证 | 不符合 | 不符合 |
| 厂商名称 | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) |
| 包装说明 | HVQCCN, LCC56,.31SQ,20 | HVQCCN, LCC56,.31SQ,20 |
| Reach Compliance Code | unknown | compliant |
| JESD-30 代码 | S-XQCC-N56 | S-XQCC-N56 |
| JESD-609代码 | e0 | e0 |
| 长度 | 8 mm | 8 mm |
| 功能数量 | 1 | 1 |
| 端子数量 | 56 | 56 |
| 最高工作温度 | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVQCCN | HVQCCN |
| 封装等效代码 | LCC56,.31SQ,20 | LCC56,.31SQ,20 |
| 封装形状 | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 电源 | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 0.9 mm |
| 最大压摆率 | 0.17 mA | 0.17 mA |
| 标称供电电压 | 3 V | 3 V |
| 表面贴装 | YES | YES |
| 电信集成电路类型 | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT |
| 温度等级 | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD |
| 宽度 | 8 mm | 8 mm |