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ZL50415/GKC

LAN Switching Circuit, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, MS-034, HSBGA-553

器件类别:电信电路   

厂商名称:CONEXANT

厂商官网:http://www.conexant.com/

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
CONEXANT
零件包装代码
BGA
包装说明
HBGA, BGA553,29X29,50
针数
553
Reach Compliance Code
compliant
JESD-30 代码
S-PBGA-B553
长度
37.5 mm
湿度敏感等级
1
功能数量
1
端子数量
553
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
HBGA
封装等效代码
BGA553,29X29,50
封装形状
SQUARE
封装形式
GRID ARRAY, HEAT SINK/SLUG
峰值回流温度(摄氏度)
225
电源
2.5,3.3 V
认证状态
Not Qualified
座面最大高度
2.46 mm
标称供电电压
2.5 V
表面贴装
YES
电信集成电路类型
LAN SWITCHING CIRCUIT
温度等级
INDUSTRIAL
端子形式
BALL
端子节距
1.27 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
37.5 mm
Base Number Matches
1
文档预览
ZL50415
Unmanaged 16-Port 10/100M Layer-2
Ethernet Switch
Data Sheet
Features
Integrated Single-Chip 10/100M Ethernet Switch
• Sixteen 10/100 Mbps auto-negotiating Fast Ethernet
(FE) ports with RMII or GPSI (7WS) interface
options per port
April 2006
Ordering Information
ZL50415/GKC
ZL50415GKG2
553 Pin HSBGA
553 Pin HSBGA**
Supports one Frame Data Buffer (FDB) memory
domains
(1 MB or 2 MB)
with pipelined, sync-burst
SRAM at 100 MHz
• Applies centralized shared memory architecture
**Pb Free Tin/Silver/Copper
-40°C to 85°C
with 2 drop precedence levels
• Scheduling using delay bounded (DB), strict priority
(SP), and Weighted Fair Queuing (WFQ) disciplines
• User controlled WRED thresholds
• Buffer management: per-class, shared, and per-port
buffer reservations
L2 Switching
• MAC address self learning, up to 64K MAC
addresses
• Supports port-based VLAN
High performance packet classification and
switching at full-wire speed
CPU access supports the following interface
options:
• Serial interface in unmanaged mode, with optional
I
2
C EEPROM support
Classification based on:
• Port-based priority: priority in a frame can be
overwritten by the priority of port
• VLAN Priority field in VLAN tagged frame (IEEE
802.1p)
• DS/TOS field in IP packet
• UDP/TCP logical ports: 8 hard-wired and 8
programmable ports, including one programmable
range
Supports Ethernet multicasting and broadcasting
and flooding control
Supports per-system option to enable flow
control for best effort frames even on QoS-
enabled ports
QoS Support
• 4 transmission priorities for Fast Ethernet ports
• Per-queue weighted random early discard (WRED)
VLAN 1 MCT
The drop precedence of the above classifications
is programmable
Supports IEEE 802.3ad link aggregation
2
port trunking groups
Frame Data Buffer A
SRAM (1 M / 2 M)
FDB Interface
LED
FCB
Frame Engine
Search
Engine
MCT
Link
16 x 10/100M
RMII
Ports 0 - 15
Management
Module
Serial
Figure 1 - System Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003-2006, Zarlink Semiconductor Inc. All Rights Reserved.
ZL50415
• two groups for 10/100 ports, with up to 4 ports per group
• Load sharing among trunked ports can be based on:
Data Sheet
- Source and/or destination MAC address
Port Mirroring
• supports a dedicated mirroring port in unmanaged mode
Full Duplex Ethernet IEEE 802.3x Flow Control
Backpressure flow control for Half Duplex ports
Full set of LED signals provided by a serial interface
Built-in reset logic triggered by system malfunction
Built-in self test (BIST) for internal and external SRAM
2
Zarlink Semiconductor Inc.
ZL50415
Description
Data Sheet
The ZL50415 is a high density, low cost, high performance, non-blocking Ethernet switch chip. A single chip
provides 16 ports at 10/100 Mbps and a CPU interface for unmanaged switch applications.
The chip supports up to 64K MAC addresses and port-based Virtual LANs (VLANs). The centralized shared
memory architecture permits a very high performance packet forwarding rate at full wire speed. The chip is
optimized to provide low-cost, high-performance workgroup switching.
A Frame Buffer Memory domain utilizes cost-effective, high-performance synchronous SRAM with aggregate
bandwidth of 6.4 Gbps to support full wire speed on all ports simultaneously.
With delay bounded, strict priority, and/or WFQ transmission scheduling and WRED dropping schemes, the
ZL50415 provides powerful QoS functions for various multimedia and mission-critical applications. The chip
provides 4 transmission priorities and 2 levels of dropping precedence. Each packet is assigned a transmission
priority and dropping precedence based on the VLAN priority field in a VLAN tagged frame, or the DS/TOS field, or
the UDP/TCP logical port fields in IP packets. The ZL50415 recognizes a total of 16 UDP/TCP logical ports, 8 hard-
wired and 8 programmable (including one programmable range).
The ZL50415 supports 2 groups of port trunking/load sharing. Two groups are dedicated to 10/100 ports, where
each 10/100 group can contain up to 4 ports. Port trunking/load sharing can be used to group ports between
interlinked switches to increase the effective network bandwidth.
In half-duplex mode all ports support backpressure flow control to minimize the risk of losing data during long
activity bursts. In full-duplex mode, IEEE 802.3x flow control is provided. The ZL50415 also supports a per-system
option to enable flow control for best effort frames, even on QoS-enabled ports.
The ZL50415 is fabricated using 0.25 micron technology. Inputs, however, are 3.3 V tolerant, and the outputs are
capable of directly interfacing to LVTTL levels. The ZL50415 is packaged in a 553-pin Ball Grid Array package.
3
Zarlink Semiconductor Inc.
ZL50415
Changes Summary
The April 2006 issue is the starting point for the change summary section.
Revision Date
April 2006
Summary of Changes
- Corrected ZL5041x ordering codes (should be
/GKC)
- Added Pb-free order code (ZL50415GKG2)
- Corrected ECR1Pn default value (should be 0xC0)
- Corrected PR100 default value (should be 0x35)
- Corrected SFCB default value (should be 0x46)
Data Sheet
4
Zarlink Semiconductor Inc.
ZL50415
Data Sheet
Table of Contents
1.0 BGA and Ball Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.1 BGA Views (Top-View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.1.1 Encapsulated view in unmanaged mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
1.2 Ball – Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.3 Ball – Signal Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1.4 Signal Mapping and Internal Pull Up/Down Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.0 Block Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.1 Frame Data Buffer (FDB) Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.2 MAC Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.2.1 RMII MAC Module (RMAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.2.1.1 GPSI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.2.1.2 SCANLINK and SCANCOL interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2.2.2 PHY Addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2.3 Frame Engine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2.4 Search Engine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2.5 LED Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2.5.1 Port Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2.5.2 LED Interface Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.6 Internal Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.7 Timeout Reset Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.0 System Configuration (Stand-alone and Stacking) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.1 Management and Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.1.1 I2C Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.1.1.1 Start Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.1.1.2 Address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.1.1.3 Data Direction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.1.1.4 Acknowledgment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.1.1.5 Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.1.1.6 Stop Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.1.2 Synchronous Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.1.2.1 Write Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.1.2.2 Read Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.0 Data Forwarding Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.1 Unicast Data Frame Forwarding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.2 Multicast Data Frame Forwarding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.0 Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.2 Memory Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.3 Memory Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
6.0 Search Engine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6.1 Search Engine Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6.2 Basic Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6.3 Search, Learning, and Aging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6.3.1 MAC Search. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
6.3.2 Learning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.3.3 Aging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.4 Port--Based VLAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.5 Quality of Service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
6.5.1 Priority Classification Rule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
7.0 Frame Engine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
7.1 Data Forwarding Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5
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参数对比
与ZL50415/GKC相近的元器件有:ZL50415GKG2。描述及对比如下:
型号 ZL50415/GKC ZL50415GKG2
描述 LAN Switching Circuit, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, MS-034, HSBGA-553 LAN Switching Circuit, PBGA553, 37.50 X 37.50 MM, 2.33 MM HEIGHT, LEAD FREE, MS-034, HSBGA-553
厂商名称 CONEXANT CONEXANT
零件包装代码 BGA BGA
包装说明 HBGA, BGA553,29X29,50 HBGA,
针数 553 553
Reach Compliance Code compliant compli
JESD-30 代码 S-PBGA-B553 S-PBGA-B553
长度 37.5 mm 37.5 mm
湿度敏感等级 1 1
功能数量 1 1
端子数量 553 553
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HBGA HBGA
封装形状 SQUARE SQUARE
封装形式 GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
峰值回流温度(摄氏度) 225 260
认证状态 Not Qualified Not Qualified
座面最大高度 2.46 mm 2.46 mm
标称供电电压 2.5 V 2.5 V
表面贴装 YES YES
电信集成电路类型 LAN SWITCHING CIRCUIT LAN SWITCHING CIRCUIT
温度等级 INDUSTRIAL INDUSTRIAL
端子形式 BALL BALL
端子节距 1.27 mm 1.27 mm
端子位置 BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED 30
宽度 37.5 mm 37.5 mm
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器件捷径:
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