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Low Power, High Resolution

16-Bit Sensor Signal Conditioner

ZSSC3016

Datasheet

Brief Description

The ZSSC3016 is a sensor signal conditioner (SSC)

integrated circuit for high-accuracy amplification and

analog-to-digital conversion of a differential input

signal. Designed for high-resolution altimeter module

applications, the ZSSC3016 can perform offset,

span, and 1 and 2 order temperature compensa-

tion of the measured signal. Developed for correc-

tion of resistive bridge sensors, it can also provide a

corrected temperature output measured with an

internal sensor.

The measured and corrected bridge values are

provided at the digital output pins, which can be

configured as I C™* (≤ 3.4MHz) or SPI (≤ 20MHz).

Digital compensation of signal offset, sensitivity,

temperature, and non-linearity is accomplished via

an 18-bit internal digital signal processor (DSP)

running a correction algorithm. Calibration coeffici-

ents are stored on-chip in a highly reliable, non-

volatile, multiple-time programmable (MTP) memory.

Programming the ZSSC3016 is simple via the serial

interface and the PC-controlled calibration software

provided in the IDT Development Kit. The interface

is used for the PC-controlled calibration procedure,

which programs the set of calibration coefficients in

memory. The digital mating is fast and precise,

eliminating the overhead normally associated with

trimming external components and multi-pass

calibration routines.

Benefits

•

Integrated 18-bit calibration math DSP

Fully corrected signal at digital output

Minimize calibration costs through the one-pass

calibration concept

No external trimming components required

Highly integrated CMOS design

Layout customized for die-die bonding with

sensor for high-density chip-on-board assembly

Excellent for low-voltage and low-power battery

applications

Support

•

Evaluation Kit

Physical Characteristics

•

Supply voltage range: 1.8 to 3.6V

Current consumption: 1mA (operating mode)

Sleep State current: 70nA (25°C)

Temperature resolution: <0.003K/LSB

Operation temperature: –40°C to +85 °C

Small die size

Delivery options: die for wafer bonding

Features

•

ZSSC3016 Application Example

VSS

VDD

VSS

VDD

EOC

•

Flexible, programmable analog front-end design;

up to 16-bit scalable, charge-balancing, two-

segment analog-to-digital converter (ADC)

Fully programmable gain amplifier for optimizing

sensor signals: gain range 14 to 72 (linear factor)

Internal auto-compensated temperature sensor

Digital compensation of individual sensor offset;

1 and 2 order digital compensation of sensor

gain

Digital compensation of 1 and 2 order temper-

ature gain and offset drift

Intelligent power management unit

Typical sensor elements can achieve accuracy of

better than ±0.10% FSO @ -40 to 85 °C

Batte

Sensor Module

VDD

VSS

ZSSC3016

Sensor

Bridge

VSSB

INN

VDDB

INP

VPP

MISO

MOSI

SDA

SCLK

SCL

SCLK_SCL

MISO

Microcontroller

EOC

SEL

MOSI_SDA

VPP

6.75V … programming

voltage for setup & calibration

C™ is a trademark of NXP.

January 25, 2016

Signal Output /

Post-processing

Low Power, High Resolution

16-Bit Sensor Signal Conditioner

ZSSC3016

Datasheet

ZSSC3016 Block Diagram

Applications

The ZSSC3016 is designed for operation in cali-

brated resistive (e.g., pressure) sensor modules:



Barometric altitude measurement for portable

navigation



Altitude measurement for emergency call

systems and car navigation



Inside hard disk pressure measurement



Weather forecast



Fan control

Ordering Information

(Contact IDT Sales for additional options.)

Ordering Examples

ZSSC3016CC1B

ZSSC3016CI1B

ZSSC3016CI1D ES

ZSSC3016KIT

Description

Temperature range: –40°C to +85°C, consumer-level parameters

according to section 1 of the data sheet

Package

Wafer (304µm) unsawn

Temperature range: –40°C to +85°C, industrial-level parameters according Wafer (304µm) unsawn

to section 1 of the data sheet, 10 years MTP data retention

Engineering samples, temperature range: –40°C to +85°C

ZSSC3016 Evaluation Kit, including sample and modular evaluation board

(Evaluation Software is downloadable from

www.IDT.com/ZSSC3016)

Corporate Headquarters

Sales

Dice in waffle pack

Kit

6024 Silver Creek Valley Road

San Jose, CA 95138

www.IDT.com

1-800-345-7015 or 408-284-8200

Fax: 408-284-2775

www.IDT.com/go/sales

Tech Support

www.IDT.com/go/support

DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance

specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The

information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an

implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property

rights of IDT or any third parties.

IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be

reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.

Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the

property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit

www.idt.com/go/glossary.

All contents of this document are copyright of Integrated

January 25, 2016

ZSSC3016 Datasheet

Table of Contents

Table of Figures ....................................................................................................................................................... 4

List of Tables ........................................................................................................................................................... 4

1 IC Characteristics ............................................................................................................................................. 6

1.1. Absolute Maximum Ratings ....................................................................................................................... 6

1.2. Operating Conditions ................................................................................................................................. 6

1.3. Electrical Parameters ................................................................................................................................ 7

1.4. Power Supply Rejection Ratio vs. Frequency ........................................................................................... 9

2 Circuit Description .......................................................................................................................................... 10

2.1. Brief Description ...................................................................................................................................... 10

2.2. Signal Flow and Block Diagram............................................................................................................... 10

2.3. Analog Front End ..................................................................................................................................... 11

2.3.1. Amplifier ............................................................................................................................................ 11

2.3.2. Analog-to-Digital Converter ............................................................................................................... 13

2.3.3. Temperature Measurement .............................................................................................................. 16

2.3.4. Bridge Supply .................................................................................................................................... 16

2.4. Digital Section .......................................................................................................................................... 16

2.4.1. Digital Signal Processor (DSP) Core ................................................................................................ 16

2.4.2. MTP Memory..................................................................................................................................... 17

2.4.3. Clock Generator ................................................................................................................................ 17

2.4.4. Power Supervision ............................................................................................................................ 17

2.4.5. Interface ............................................................................................................................................ 17

3 Functional Description .................................................................................................................................... 18

3.1. Power Up ................................................................................................................................................. 18

3.2. Measurements ......................................................................................................................................... 18

3.3. Operational Modes .................................................................................................................................. 18

3.4. Command Interpretation .......................................................................................................................... 21

3.4.1. SPI/I C™ Commands ....................................................................................................................... 21

3.5. Communication Interface......................................................................................................................... 23

3.5.1. Common Functionality ...................................................................................................................... 23

3.5.2. SPI .................................................................................................................................................... 25

3.5.3. I C™ .................................................................................................................................................. 27

3.6. Memory .................................................................................................................................................... 29

3.6.1. Programming Memory ...................................................................................................................... 29

3.6.2. Memory Status Commands .............................................................................................................. 30

3.6.3. Memory Contents .............................................................................................................................. 31

3.7. Calibration Sequence .............................................................................................................................. 37

3.7.1. Calibration Step 1 – Assigning Unique Identification ........................................................................ 37

3.7.2. Calibration Step 2 – Data Collection ................................................................................................. 37

January 25, 2016

ZSSC3016 Datasheet

3.7.3. Calibration Step 3 – Coefficient Calculations .................................................................................... 38

3.8. The Calibration Math ............................................................................................................................... 39

3.8.1. Bridge Signal Compensation ............................................................................................................ 39

3.8.2. Temperature Signal Compensation .................................................................................................. 41

Die Pad Assignments ..................................................................................................................................... 42

Quality and Reliability ..................................................................................................................................... 43

Ordering Sales Codes .................................................................................................................................... 43

Related Documents ........................................................................................................................................ 44

Glossary ......................................................................................................................................................... 44

Document Revision History ............................................................................................................................ 45

Table of Figures

Figure 2.1

Figure 2.2

Figure 3.1

Figure 3.2

Figure 3.3

Figure 3.4

Figure 3.5

Figure 3.6

Figure 3.7

Figure 3.8

Figure 3.9

Figure 3.10

Figure 3.11

Figure 4.1

ZSSC3016 Functional Block Diagram .............................................................................................. 10

ADC Offset ........................................................................................................................................ 15

Operational Flow Chart: Power up.................................................................................................... 19

Operational Flow Chart: Command Mode and Normal Mode .......................................................... 20

SPI configuration CPHA=0 ............................................................................................................... 25

SPI Configuration CPHA=1 .............................................................................................................. 26

SPI Command Request .................................................................................................................... 26

SPI Read Status ............................................................................................................................... 27

SPI Read Data .................................................................................................................................. 27

I C™ Command Request ................................................................................................................. 28

I C™ Read Status ............................................................................................................................ 28

I C™ Read Data ............................................................................................................................... 29

Memory Program Operation ............................................................................................................. 30

ZSSC3016 Pad Assignments ........................................................................................................... 42

List of Tables

Table 1.1

Table 1.2

Table 1.3

Table 1.4

Table 2.1

Table 2.2

Table 2.3

Table 2.4

Maximum Ratings ............................................................................................................................... 6

Operating Conditions .......................................................................................................................... 6

Constraints for VDD Power-on Reset ................................................................................................. 7

Electrical Parameters .......................................................................................................................... 7

Amplifier Gain: Stage 1 ..................................................................................................................... 11

Amplifier Gain: Stage 2 ..................................................................................................................... 12

Gain Polarity ..................................................................................................................................... 12

MSB/LSB Settings ............................................................................................................................ 13

January 25, 2016

ZSSC3016 Datasheet

Table 2.5

Table 2.6

Table 2.7

Table 3.1

Table 3.2

Table 3.3

Table 3.4

Table 3.5

Table 3.6

Table 3.7

Table 3.8

Table 4.1

ADC Conversion Times for a Single A2D Conversion...................................................................... 14

Conversion Times vs. Noise Performance for 16-Bit Fully Signal Conditioned Results (AZBM,

BM, AZTM, TM and Digital SSC Correction) .................................................................................... 14

ADC Offset Settings .......................................................................................................................... 16

SPI/I C™ Commands ....................................................................................................................... 21

Get_Raw Commands ....................................................................................................................... 23

General Status Byte .......................................................................................................................... 24

Status Byte for Read Operations ...................................................................................................... 24

Status Byte for Write Operations ...................................................................................................... 24

Mode Status ...................................................................................................................................... 24

Memory Status Word ........................................................................................................................ 30

MTP Memory Content Assignments. ................................................................................................ 31

Pad Assignments .............................................................................................................................. 42

January 25, 2016