描述 |
Battery Management Sys-Side Impedance Track Fuel Gauge |
Battery Management Sys-Side Impedance Track Fuel Gauge |
Brand Name |
Texas Instruments |
Texas Instruments |
是否无铅 |
含铅 |
含铅 |
是否Rohs认证 |
符合 |
符合 |
厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
零件包装代码 |
BGA |
BGA |
包装说明 |
VFBGA, BGA12,3X4,20 |
DSBGA-12 |
针数 |
12 |
12 |
Reach Compliance Code |
compli |
compli |
ECCN代码 |
EAR99 |
EAR99 |
Samacsys Descripti |
System-Side Impedance Track Fuel Gauge |
System-Side Impedance Track Fuel Gauge |
可调阈值 |
YES |
YES |
模拟集成电路 - 其他类型 |
POWER SUPPLY SUPPORT CIRCUIT |
POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 |
R-PBGA-B12 |
R-PBGA-B12 |
JESD-609代码 |
e1 |
e1 |
长度 |
2.295 mm |
2.295 mm |
湿度敏感等级 |
1 |
1 |
信道数量 |
1 |
1 |
功能数量 |
1 |
1 |
端子数量 |
12 |
12 |
最高工作温度 |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
VFBGA |
VFBGA |
封装等效代码 |
BGA12,3X4,20 |
BGA12,3X4,20 |
封装形状 |
RECTANGULAR |
RECTANGULAR |
封装形式 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) |
260 |
260 |
电源 |
2.5 V |
2.5 V |
认证状态 |
Not Qualified |
Not Qualified |
座面最大高度 |
0.625 mm |
0.625 mm |
最大供电电压 (Vsup) |
2.6 V |
2.6 V |
最小供电电压 (Vsup) |
2.4 V |
2.4 V |
标称供电电压 (Vsup) |
2.5 V |
2.5 V |
表面贴装 |
YES |
YES |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 |
BALL |
BALL |
端子节距 |
0.5 mm |
0.5 mm |
端子位置 |
BOTTOM |
BOTTOM |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
1.795 mm |
1.795 mm |