HIGH PERFORMANCE NXP i.MX8 SERIES
conga-QMX8
PRELIMINARY
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-
-
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NXP i.MX8 ARM Cortex-A72, Cortex-A53 and -M4F
Advanced Graphics, Performance and Virtualization
3D Graphics up to 4K with HDMI 2.0a & LVDS
Vision Extensions, MIPI CSI-2 dual camera interface
Extended longevity, up to 15 years
Temperature range up to -40°C .. +85°C
Formfactor
CPU
Qseven Rev. 2.1 | 70x70 mm²
NXP i.MX8 ARM Processor Cores
i.MX 8 QuadMax
i.MX 8 QuadPlus
i.MX 8 Dual Max
ARM Cortex-A72
2x
1x
2x
ARM Cortex-A53
4x
4x
-
ARM Cortex-M4F
2x
2x
2x
GPU
2x GC7000XSVX
2x GC7000Lite/XSVX
1x GC7000Lite/XSVX
DRAM
Ethernet
I/O Interfaces
Mass Storage
Sound
Graphics
Up to 8 GByte onboard LPDDR4 memory | 3200 MT/s
1x 1 Gbit Ethernet
5x USB 2.0 (shared with 1x USB OTG client) | 1x USB 3.0 | 1x SATA III | 1x SDIO SD 3.0 | up to 3x PCIe 3.0 lanes (one shared with SATA III), 2 Root
Ports | I²C Bus | CAN FD | SPI | 2x UART
eMMC 5.0 up to 64 GByte | Onboard MicroSD 3.0 card socket
I²S
Integrated in NXP i.MX8 Series GT7000 multimedia GPU
VPU (4K h.265 dec / HD h.264 enc) | 2D Graphics (GPU2D) and 3D Graphics (GPU3D) | 3D graphics with 4 high performance / 4 vec4 shaders
up to 16 execution units | 2 independent displays | dual stream 1080p/720p decoder/encoder | OpenGL | Vulcan | VX extensions | OpenCL
HDMI 2.0a with HDCP 2.2 | 1x dual channel LVDS 24 bit | eDP 1.4 output and DP 1.3 output (shared with HDMI)
1x MIPI-DSI with 4-lanes each shared with camera 1 | 2x MIPI-CSI with 4-lanes each
Watchdog Timer
I²C bus (fast mode | 400 kHz | multi-master)
JTAG debug interface
2x CAN FD interface
High Precision Real Time Clock
Multiple Domains with Hardware Virtualization | Multiple Operating Systems Support | System MMU | Resource Partitioning and Split GPU
High Assurance Boot support | Inline Encryption Engine (AES-128)
TNG, AES-128, AES-256, 3DES, ARC4, RSA4096, SHA-1, SHA-2, SHA-256, MD-5 | RSA-1024, 2048, 3072, 4096
U-Boot boot loader
Linux | Yocto | Android
Typ. application tbd. @ 5V
Operating:
Storage:
0 to +60°C commercial grade
-40 to +85°C industrial grade
-40 to +85°C
10 to 90% r. H. non cond.
5 to 95% r. H. non cond.
Video Interfaces
Features
Virtualization
Security
Boot Loader
Operating Systems
Power Consumption
Temperature
Humidity
Size
Operating:
Storage:
70 x 70 mm (2¾” x 2¾”)
www.congatec.com
conga-QMX8
| Block diagram
conga-QMX8
Power Rail
Control
onboard
LPDDR4
memory
Power Rail
LPDDR4
Control
I²C
RGMII
MDIO
HMDI
RS232
Driver
UART
UART
LVDS 2x24 bit
PCIe 0-1
eMMC 5.0
SDIO
PCIe2 or SATA0
MUX
PMIC
PMIC
Qseven 2.1
Power
RTC
RTC battery
JTAG
JTAG
GBit Eth-Phy
Gigabit Ethernet
HDMI
LVDS
PCIe 0-1
PCIe 2
SATA
UART
Audio
I²C Bus
SM-Bus
SDIO
USB 3.0
USB 2.0 OTG
NXP i.MX8
ARM processors series
QSPI
Feature
Connector
QSPI
MIPI-CSI CH0
UART
I²S
I²C
GPIO
Feature
Connector
MUX
MIPI-CSI CH1
MIPI-DSI CH0
SDIO
USB 3.0
USB 2.0 OTG
USB 2.0
USB Hub
4x USB 2.0
CAN
CAN FD
conga-QMX8
| Order Information
Article
conga-QMX8/QCM-4GB eMMC16
PN
016400
Qseven module with high-performance NXP i.MX8 Quad Max processor with 2x ARM® Cortex
®
-A72, 4x ARM
®
Cortex®-A53 and
2x ARM
®
Cortex
®
-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package.
Commercial temperature range.
Qseven module with high-performance NXP i.MX8 Quad Plus processor with 1x ARM
®
Cortex
®
-A72, 4x ARM
®
Cortex
®
-A53 and
2x ARM
®
Cortex
®
-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package.
Commercial temperature range.
Qseven module with high-performance NXP i.MX8 Quad Plus processor with 2x ARM
®
Cortex
®
-A72 and 2x ARM
®
Cortex
®
-M4F,
4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package.
Commercial temperature range.
Qseven module with high-performance NXP i.MX8 Quad Max processor with 2x ARM® Cortex
®
-A72, 4x ARM
®
Cortex®-A53 and
2x ARM
®
Cortex
®
-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package.
ndustrial temperature range.
Qseven module with high-performance NXP i.MX8 Quad Plus processor with 1x ARM
®
Cortex
®
-A72, 4x ARM
®
Cortex
®
-A53 and
2x ARM
®
Cortex
®
-M4F, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package.
Industrial temperature range.
Qseven module with high-performance NXP i.MX8 Dual Max processor with 2x ARM
®
Cortex
®
-A72 and 2x ARM
®
Cortex
®
-M4F,
4GB onboard LPDDR4 memory and 16GB onboard eMMC. Lidded package.
Industrial temperature range.
Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex
®
A72 processor. All standoffs are
with 2.7mm bore hole.
Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex
®
A72 processor. All standoffs are
M2.5mm thread.
Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex
®
A72 processor. All standoffs are
with 2.7mm bore hole.
Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex
®
A72 processor. All standoffs are
M2.5mm thread.
conga-QMX8/QCP-4GB eMMC16
016401
conga-QMX8/DCM-4GB eMMC16
016402
conga-QMX8/i-QCM-4GB eMMC16
016421
conga-QMX8/i-QCP-4GB eMMC16
016422
conga-QMX8/i-DCM-4GB eMMC16
016423
conga-QMX8/CSP-B
conga-QMX8/CSP-T
conga-QMX8/HSP-B
conga-QMX8/HSP-T
016450
016451
016452
016453
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of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their
respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. July 06, 2018 MR
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QMX8-X/i-DXP-2G eMMC16 conga-QMX8/i-QCM-4GB eMMC16 conga-QMX8/i-QCP-4GB eMMC16
