SERVER-CLASS EMBEDDED PERFORMANCE
conga-TS175
-
7
th
Generation Intel
®
Core
™
processor
-
Intel
®
Xeon
®
processors for data center applications
-
Intel
®
Optane
™
memory can be connected via
PCI Express Gen 3.0
-
ECC memory support
-
Up to 32 GByte dual channel DDR4 memory
Formfactor
CPU
COM Express
®
Basic, (95 x 125 mm), Type 6 Connector Pinout
Intel
®
Xeon
®
E3-1505M v6
Intel
®
Xeon
®
E3-1505L v6
Intel
®
Core
TM
i7-7820EQ
Intel
®
Core
TM
i5-7440EQ
Intel
®
Core
TM
i5-7442EQ
Intel
®
Core
TM
i3-7100E
Intel Core
®
TM
4.0 GHz (Burst) | 3.0 GHz Clock
3.0 GHz (Burst) | 2.2 GHz Clock
3.7 GHz (Burst) | 3.0 GHz Clock
3.6 GHz (Burst) | 2.9 GHz Clock
2.9 GHz (Burst) | 2.1 GHz Clock
2.9 GHz Clock
2.1 GHz Clock
Quad Core
Quad Core
Quad Core
Quad Core
Quad Core
Dual Core
Dual Core
8MB cache
8MB cache
8MB cache
6MB cache
6MB cache
3MB cache
3MB cache
45W / 35W TDP
25W TDP
45W / 35W TDP
45W / 35W TDP
25W TDP
35W TDP
25W TDP
i3-7102E
Intel
®
Turbo Boost Technology | Intel
®
Hyper-Threading Technology (Intel
®
HT Technology) | Intel
®
Advanced Vector Extensions 2.0 (Intel
®
AVX2)
Intel
®
Advanced Encryption Standard New Instructions (Intel
®
AES-NI) | Integrated dual channel memory controller | up to 34,1 GByte/sec. memory
bandwidth | Integrated Intel
®
Gen9 HD Graphics with frequency up to 1GHz | Intel
®
Clear Video HD Technology | Intel
®
Virtualization Technology
(Intel
®
VT) | Intel
®
Trusted Execution Technology (Intel
®
TXT) | Intel
®
Secure Key
DRAM
Chipset
Ethernet
I/O Interfaces
Sound
Graphics
2 Sockets, SO-DIMM DDR4 up to 2400 MT/s and 32GByte dual channel, optionally with ECC support
Mobile Intel
®
100 Series Chipset
Intel
®
219-LM GbE LAN Controller with AMT 11.6 support
8x PCI Express
™
gen. 3.0 lanes | 4x Serial ATA
®
Gen 3 |
4x USB
3.0 (XHCI) | 8x USB 2.0 (XHCI) | 1x PEG x16 Gen 3 | LPC bus |
I²C bus (fast mode, 400 kHz, multi-master) | 2x UART
Digital High Definition Audio Interface with support for multiple audio codecs
OpenCL 2.0/2.1, OpenGL 4.4/4.5 and DirectX12 (for Windows 10) support | up to three independent displays: HDMI 1.4a / DisplayPort 1.2 / eDP 1.3
High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s | HEVC, VP9 and VDENC
encoding
Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200 |
Automatic Panel Detection via EDID/EPI
3x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k | VGA
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup |
I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
AMI Aptio
®
UEFI 2.x firmware | 8/16 MByte serial SPI firmware flash
The conga-TS175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0). It is capable of calculating efficient hash and
RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and e
commerce will benefit also with improved authentication, integrity and confidence levels.
ACPI 4.0 with battery support
Microsoft
®
Windows 10 (64bit only) | Microsoft
®
Windows 10 IoT Enterprise (64bit only) | Linux
See User’s Guide for full details
Operating: 0 .. +60°C
Storage: -40 .. +85°C
Storage: 5 - 95% r. H. non cond.
LVDS
(eDP optional)
Digital Display Interface (DDI)
congatec Board Controller
Embedded BIOS Features
Security
Power Management
Operating Systems
Power Consumption
Temperature
Humidity
Size
Operating: 10 - 90% r. H. non cond.
95 x 125 mm (3.74” x 4.92”)
www.congatec.com
conga-TS175
| Block diagram
7
th
Gen. Intel® Core™ processor
Aux Channel
CPU Platform
Turbo Boost 2.0 Technology
HT Technology
AVX2
SSE 4.2
AMT 11.0
VT
TXT
AES-NI
TSX
COM Express
Type 6
A-B Connector
DP to VGA
COM Express
Type 6
C-D Connector
Integrated Intel HD Graphics
Display Interface
HDMI and DP
up to 4K resolution
PCIe Gen. 3
*
DP/HDMI Port D
DP/HDMI Port C
DP/HDMI Port B
PEG x16
CRT
LVDS/eDP
LVDS/eDP
eDP to LVDS
Bridge
eDP
Hardware Graphics Accelerators
3D
2D
Video Codecs
MPEG-2
H.265
WMV9
Vector Graphics
DXVA2
APIs
OpenCL 2.1
OpenGL 4.4
DirectX 12
Multimedia Features
ASRC
DMI Gen3
Dual Channel DDR4
XDP
SM Bus
PECI
XDP
2x SO-DIMM (X1/X2)
HDA I/F
USB Port 0..7
PCIe lane 0 - 5
Ethernet
Ethernet 10/100/1000
Intel i219LM
SPI Flash 0
HDA
USB 2.0
PCIe Gen. 3
Mobile Intel
® 100 Series PCH-H
PECI
USB 3.0 Port 0 - 3
PCIe Gen. 3
MGMNT
PCIe lane 6 - 7
I/O Interfaces
SPI
SATA 6G
LPC
PCIe
SATA
LPC Bus
USB 2.0
HDA
USB 3.0
SPI
SATA Port 0 - 3
LPC Bus
TPM
congatec System
Management
Controller
(TX BC)
congatec custom
SM Bus
SER0/1
GPIOs
LID#/SLEEP#
FAN control
I2C Bus
UART0/1
GPIOs
I2C
*
DDI port D supports only HDMI if VGA is enabled.
www.congatec.com
conga-TS175
| Order Information
Article
conga-TS175/i7-7820EQ
PN
045950
Description
COM Express Type 6 Basic module with Intel
®
Core
™
i7-7820EQ quad core processor with 3GHz up to 3.7GHz, 8MB Intel
®
Smart
Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for
Intel
®
Optane
™
memory.
COM Express Type 6 Basic modul Intel
®
Core
™
i5-7440EQ quad core processor with 2.9GHz up to 3.6GHz, 6MB Intel
®
Smart
Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for
Intel
®
Optane
™
memory.
COM Express Type 6 Basic module with Intel
®
Core
™
i5-7442EQ quad core processor with 2.1GHz up to 2.9GHz, 6MB Intel
®
Smart
Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for
Intel
®
Optane
™
memory.
COM Express Type 6 Basic module with Intel
®
Core
™
i3-7100E dual core processor with 2.9GHz, 3MB Intel
®
Smart Cache, GT2
graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset HM175 with support for Intel
®
Optane
™
memory.
COM Express Type 6 Basic module with Intel
®
Core
™
i3-7102E dual core processor with 2.1GHz, 3MB Intel
®
Smart Cache, GT2
graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset HM175 with support for Intel
®
Optane
™
memory.
COM Express Type 6 Basic module with Intel
®
Xeon
®
E3-1505M V6 quad core processor with 3GHz up to 4GHz, 8MB Intel
®
Smart
Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset CM238 with ECC memory
support.
COM Express Type 6 Basic module with Intel
®
Xeon
®
E3-1505L V6 quad core processor with 2.2GHz up to 3GHz, 8MB Intel
®
Smart
Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset CM238 with ECC memory
support.
conga-TS175/i5-7440EQ
045951
conga-TS175/i5-7442EQ
045952
conga-TS175/i3-7100E
045953
conga-TS175/i3-7102E
045954
conga-TS175/E3-1505MV6
045955
conga-TS175/E3-1505LV6
045956
Article
conga-TS170/HSP-HP-B
conga-TS170/HSP-HP-T
conga-TS170/CSP-HP-B
conga-TS170/CSP-HP-T
conga-TS170/CSA-HP-B
conga-TS170/CSA-HP-T
PN
045934
045935
045932
045933
045930
045931
Description
Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs
are with 2.7mm bore hole.
Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs
are M2.5mm thread.
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes,
15mm silver fins and 21mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes,
15mm silver fins and 21mm overall heat sink height. All standoffs are M2.5mm thread.
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes,
15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes,
15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
4 GByte DDR4 SODIMM memory module with 2400 MT/s
8 GByte DDR4 SODIMM memory module with 2400 MT/s
16 GByte DDR4 SODIMM memory module with 2400 MT/s
4 GByte DDR4 ECC SODIMM memory module with 2400 MT/s
8 GByte DDR4 ECC SODIMM memory module with 2400 MT/s
16 GByte DDR4 ECC SODIMM memory module with 2400 MT/s
Evaluation carrier board for Type 6 COM-Express-modules
LVDS to DVI converter board for digital flat panels with onboard EEPROM
Connector for COM-Express carrier boards, height 5mm, packing unit 4 pieces
Connector for COM-Express carrier boards, height 8mm, packing unit 4 pieces
DDR4-SODIMM-2400 (4GB)
DDR4-SODIMM-2400 (8GB)
DDR4-SODIMM-2400 (16GB)
DDR4-SODIMM-2400 ECC (4GB)
DDR4-SODIMM-2400 ECC (8GB)
DDR4-SODIMM-2400 ECC (16GB)
conga-TEVAL
conga-LDVI/EPI
COMe-carrier-board-Socket-5
COMe-carrier-board-Socket-8
068790
068791
068792
068795
068796
068797
065800
011115
400007
400004
© 2018 congatec AG. All rights reserved.
All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee
of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their
respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. Sep 19, 2018 MR
www.congatec.com
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congatec
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conga-TS175/E3-1505LV6 conga-TS175/E3-1505MV6 conga-TS175/i3-7100E conga-TS175/i3-7102E conga-
TS175/i5-7440EQ conga-TS175/i5-7442EQ conga-TS175/i7-7820EQ
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