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iW600-00-DFN2

Secondary-Side Voltage Positioning Controller

厂商名称:Dialog

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iW600
Secondary-Side Voltage Positioning Controller
1 Description
The iW600 is a secondary-side voltage position controller to detect the voltage undershoot. It can be used in Dialog’s
primary-side control systems to achieve ultra-low no-load power consumption and fast dynamic load response. The iW600
operates in “Normally-OFF” mode with negligible power consumption during power supply normal steady state operation,
while monitoring dynamic load change through the voltage on the secondary rectifier. A wake-up signal is transferred
through the flyback power transformer to the primary side when a dynamic load change is detected. The iW600 eliminates
loop compensation components and the optocoupler on the secondary side to minimize the bill of material cost.
2 Features
Fast system output voltage detection
Transmits detection signal to the primary side through
flyback transformer
● Two-electrical-terminal connection simplifies system
PCB layout
No external components
Enables <10mW no-load power consumption in typical
5V-output systems
● Available in 3-lead SOT-23 and 2-lead DFN packages
3 Applications
● AC/DC adapters/chargers
L
2
iW600
D1
1
V
OUT
+
+
N
RTN
U1
iW1600
1
2
V
SENSE
GND
V
CC
8
GND
7
OUTPUT
6
+
4
HV
CS/CDC
5
R
CDC
Figure 3.1: iW600 Typical Application Circuit (Using iW1600 as Primary-Side Controller) (Achieving < 10mW
No-load Power Consumption in 5V/2A 10W Adapter with Fast Dynamic Load Response)
Product Summary
www.dialog-semiconductor.com
Rev. 1.0
1 of 6
10-November-2016
© 2016 Dialog Semiconductor
iW600
Secondary-Side Voltage Positioning Controller
4 Pinout Description
iW600
3
N/C
1 STR
GND 2
iW600
STR
1
GND
2
Figure 4.1: 3-Lead SOT-23 Package
Figure 4.2: 2-Lead DFN Package
Pin No.
Name
Type
Pin Description
1
2
3
STR
GND
N/C
Power Input/ Stroke pin. Controller Power input and voltage monitoring input. It also
Analog Input/ builds in a open-drain circuit to drive the flyback power transformer
Power Output when dynamic load is detected.
Ground
N/C
Ground.
Not connected. Recommend design a solder pad and solder this pin on
the printed circuit board for mechanical stability.
Note 1: The N/C pin is only available in the 3-lead SOT-23 package.
Product Summary
www.dialog-semiconductor.com
Rev. 1.0
2 of 6
10-November-2016
© 2016 Dialog Semiconductor
iW600
Secondary-Side Voltage Positioning Controller
5 Absolute Maximum Ratings
Absolute maximum ratings are the parameter values or ranges which can cause permanent damage if exceeded. For
maximum safe operating conditions, refer to Electrical Characteristics (Section 6).
Parameter
Input voltage range
Continuous DC supply current at V
STR
pin (V
STR
= 60V)
Open-draining pull-down pulse current (V
STR
= 40V)
Maximum junction temperature
Operating junction temperature
Storage temperature
Thermal resistance junction-to-ambient (SOT-23)
Thermal resistance junction-to-ambient (DFN)
ESD rating per JEDEC JESD22-A114
Symbol
V
STR
I
CC_OP
Value
-1 to 60
1
400
Units
V
mA
mA
°C
°C
°C
°C/W
°C/W
V
T
JMAX
T
JOPT
T
STG
150
-40 to 150
-65 to 150
260
680
±2,000
θ
JA
θ
JA
Product Summary
www.dialog-semiconductor.com
Rev. 1.0
3 of 6
10-November-2016
© 2016 Dialog Semiconductor
iW600
Secondary-Side Voltage Positioning Controller
6 Physical Dimensions
3-Lead SOT-23 Package
D
Symbol
Inches
MIN
0.035
0.001
0.015
0.003
0.110
0.083
0.047
0.070
MAX
0.044
0.004
0.020
0.007
0.120
0.104
0.081
0.020
Millimeters
MIN
0.89
0.01
0.37
0.09
2.80
2.10
1.20
1.78
MAX
1.11
0.10
0.50
0.18
3.04
2.64
1.40
2.04
3
E1
1
2
E
A
A1
B
C
e1
A1
D
E
E1
A
B
e1
COPLANARITY
0.10
Compliant to JEDEC Standard TO236
Controlling dimensions are in millimeters
SEATING
PLANE
C
This package is RoHS compliant, and conform to Halide free limits.
Soldering Temperature Resistance:
[a] Package is IPC/JEDEC Std 020D Moisture Sensitivity Level 1
[b] Package exceeds JEDEC Std No. 22-A111 for Solder Immersion resistance;
packages can withstand 10 s immersion @ < 260 °C
Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions
or gate burrs shall not exceed 0.25 mm per end. Dimension E1 does not include interlead flash
or protrusion. Interlead flash or protrusion shall not exceed 0.25 mm per side.
The package top may be smaller than the package bottom. Dimension D and E1 are determined
at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and
interlead flash, but including any mismatch between the top and bottom of the plastic body.
Product Summary
www.dialog-semiconductor.com
Rev. 1.0
4 of 6
10-November-2016
© 2016 Dialog Semiconductor
iW600
Secondary-Side Voltage Positioning Controller
2-Lead DFN Package
D
2
A
A1
2
MILLIMETERS
MIN
L2
E
e
A
A1
A2
b
D
L1
1
NOM
0.75
0.203 REF
0.90
1.30
1.00 BSC
1.70
0.40
1.00
MAX
0.80
0.05
0.95
1.35
1.75
2.50
1.10
0.70
0.00
0.85
1.25
1.65
0.30
0.90
e
E
L1
L2
PIN 1 REFERENCE
A2
SEATING
PLANE
1
b
Top View
Side View
Bottom View
All dimensions are in millimeters.
Coplanarity applies to the exposed pad as well as the terminals.
Coplanarity shall not exceed 0.05 millimeters.
Warpage shall not exceed 0.05 millimeters.
Soldering Temperature Resistance:
[a] Package is IPC/JEDEC Std 020D Moisture Sensitivity Level 1.
[b] Package exceeds JEDEC Std No. 22-A111 for Solder Immersion Resistance; package can withstand
10 seconds immersion < 260˚C.
7 Ordering Information
Part Number
Options
Package
Description
iW600-00-ST3
iW600-00-DFN2
N/A
N/A
SOT-23L-3L
DFN-1.3m-2L
Tape & Reel
1
Tape & Reel
1
Note 1: Tape & Reel packing quantity is 3,000/reel. Minimum ordering quantity is 3,000.
Product Summary
www.dialog-semiconductor.com
Rev. 1.0
5 of 6
10-November-2016
© 2016 Dialog Semiconductor
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