WiFi Module production flowWiFi Module Production FlowSiP (System in Package Technology) It is the alternative of the SOC(System on Chip) It is much more than a package concept Functional system or subsystem into one package An advanced packaging technology of module Product Multi-Process of the components assembly on substrate Chip level interconnected technology (Flip chip, Chip stacking, Multi-Chip, Wire bonding) Quite often includes passive components (SMD, Embedded R / L / C)Download F/W Tx/Rx Test Throughput Test MAC/DomainSurface Mounting 0201 Chip Component Capability CSP and Flip Chip Bonding Lead Free Soldering N2 Atmosphere Soldering Reflow CFC Free Solvent CleanSingulation Saw Cutting SnappingTesting Device type:WLAN Module/Device(802.11a/g/b) , Power Amplifier/RF FEM, F……