所有封装集锦（050404）所 有 封 装 集 景AAC'97 AC'97 v2.2 specification 详细规格 AGP 3.3V Accelerated Graphics Port Specification 2.0 详细规格 AGP PRO Accelerated Graphics Port PRO Specification 1.01 详细规格 AGP Accelerated Graphics Port Specification 2.0 详细规格 AMR Audio/Modem RiserAX078AX14BBGA Ball Grid ArrayBQFP132EBGA 680L 详细规格LBGA 160L 详细规格PBGA 217L Plastic Ball Grid Array 详细规格SBGA 192L 详细规格TEPBGA 288L TEPBGA 288L 详细规格TSBGA 680L详细规格CC-Bend LeadCERQUAD Ceramic Quad Flat Pack 详细规格CLCC 详细规格CNR Communication and Networking Riser Specification Revision 1.2 详细规格CPGA Ceramic Pin Grid ArrayCeramic CaseLAMINATE CSP 112L Chip Scale Package详细规格DDIMM 168 详细规格 DIMM DDR 详细规格 DIMM168 Dual In-line Memory Module 详细规格 DIMM168 DIMM168 Pinout 详细规格 DIMM184 For DDR SDRAM Dual In-line Memory Module ……