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印刷电路板布局电磁兼容性的提高 (TI公司资料)pdf
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2018-05-13 | 1积分 | 166.96KB |  3 次下载

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标签: 电磁兼容

电磁兼容

印刷电路板布局电磁兼容性的提高 (TI公司资料):Printed-Circuit-Board Layout for Improved Electromagnetic Compatibility

1 Current Paths in an Electronic System 12 CMOS Inverter Circuit 23 Supply Current of CMOS Circuits as a Function of the Input Voltage 24 Circuit With Parasitic Components 35 Currents in the Supply Lines 46 Currents in the Supply Lines Using an Inductor 57 Placement of the IC, CB, and LCH 68 Arrangement of Signal Lines and Their Return Lines 69 Currents in Signal and Supply Lines 710 Layout of Signal and Ground Lines 711 Crystal Oscillator Circuit 812 Proposal for the Layout of the Metallization for an Oscillator 9

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PrintedCircuitBoard Layout for Improved Electromagnetic Compatibility SDYA011 October 1996 1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice and advises its customers to obtain the latest version of relevant information to verify before placing orders that the information being relied on is current TI warrants performance of its semiconductor products and related software to the specif......

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