[数字麦克风] MEMS研究设计创新方案介绍——0.001秒实时3D形貌检测

lyceetec 2017-11-16 14:54 楼主

MEMS Analysis Tool是一个后分析软件。它提供了量化和精确的3D空间和频率分析，时间序列的形貌图(4D)，通过DHM®同时拍摄面内和离面运动，离面运动精度达到MEMS激光测振仪精度，面内运动精度则远超MEMS测振仪精度，达到了1nm。

MEMS Analysis Tool是基于DHM数字全息显微镜一款软件，数字全息显微镜DHM基于菲涅尔衍射的重建算法，仅需0.001秒采集单张全息图即可得到实时3D形貌信息，无需扫描，在MEMS的设计与研究中有着独特的优势。此外，在形貌检测、形变测量、实时大面积形貌监测等也有广泛应用。
案例：MEMS MicrophoneA MEMS microphone is composed by a diaphragm vibrating between two holed back-plates. Measurement of topography and vibration modes of each of them are challenging :

The diaphragm has a one millimeter diameter and has to be measured through the grid of 7 microns diameter holes of the back-plate.
The 1 micrometer thin back-plate silicon membranes is transparent for visible and near IR illumination. It is a source of measurement artifacts due to multiple reflection through and by the plates.

MEMS microphone : Diaphragm ⌀1mm, lateral resolution 0.5 µm Crop : detail of ⌀7 µm back-plate holes
Stitched up measurement in stroboscopic modeStitching algorithms enable to combine multiple individual measurements to produce a high lateral resolution topography map of the microphone over its complete surface. It enables diaphragm characterization through the back-plate holes.
Combining stitching with stroboscopic synchronization acquisition provides a time sequence of both the diaphragm and the back-plates topographies along the excitation period of the microphone. Complete vibration analysis of each of them can be performed.

Movie:

Field of view : 1 x 1 mm
Lateral resolution : 0.5 μm
32 topographies are recorded along the excitation period
10×10 stitching : each topography measurement has a super high resolution of 30 MpxUV laser sourceThe thin silicon back-plate membranes is totally reflective using a DHM® operating with UV light sources. It prevents from any measurement artifact observed using blue, green, red or NIR wavelengths.
- Thin silicon membrane (<1 μm)