10
9
8
7
6
5
4
3
2
1
F
0.5
0.25
E
D
注記NOTES
1.½用材料
MATERIAL
ハウジング：46ナイロン、ガラス充填、UL94V-0、½
HOUSING:PA46,GLASS FILLED,UL94V-0,WHITE
アクチュエータ：ポリフェニレンサルフィド（PPS）、ガラス充填、
UL94V-0、茶色
ACTUATOR:POLYPHENYLENE SULFIDE,GLASS FILLED,
UL94V-0,BROWN
ターミナル：リン青銅、ニッケル下地金めっき（t=0.2）
TERMINAL:PHOSPHOR BRONZE,GOLD OVER NICKEL PLATING
E
金具：リン青銅、ニッケル下地錫めっき（t=0.2）
FITTING NAIL: PHOSPHOR BRONZE,TIN OVER NICKEL PLATING
2.エンボステープ梱包時は、アクチュエータがロックした状態になります。
IN THE PACKAGE,ACTUATOR OF PART
NO.52437-**29 SHOULD BE LOCKED.
3
½ルダーテール半田付け面のズレ量、及び金具半田付け面のズレ量は、
基準面Hに対して上方向に0.1MAXIMUM、下方向0.15MAXIMUMとする。
MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM
DATUM-H.
UPPER DIRECTON:0.1MAXIMUM
LOWER DIRECTION:0.15 MAXIMUM
4
偶数極に適用
D
APPLY FOR EVEN CIRCUIT.
5
ﾊﾟﾀ½ﾝ剥離止め金具
FITTING NAIL FOR PREVENTION OF PEELING OF P.W.B. PATTERN.
6
R0.3は、FPCの導½部にかからないこと
R0.3 MUST NOT BE OVERLAPED TO PATTERN OF FPC.
7.½ルダーテールの平坦度は、0.1MAXIMUMとする。
SOLDER TAIL COPLANARITY IS 0.1 MAXIMUM.
8.ELV 及び RoHS 適合品
ELV AND RoHS COMPLIANT
F
C
K
5
B
FITTING NAIL
金具
21.6
21.1
20.6
20.1
19.6
19.1
18.6
18.1
17.6
17.1
19.6
19.1
18.6
18.1
17.6
17.1
16.6
16.1
15.6
15.1
15.65
15.15
14.65
14.15
13.65
13.15
12.65
12.15
11.65
11.15
B
14.5
14.0
13.5
13.0
12.5
12.0
11.5
11.0
10.5
10.0
(A)
52437-3071
52437-2971
52437-2871
52437-2771
52437-2671
52437-2571
52437-2471
52437-2371
52437-2271
52437-2171
EMBOSSED PACKAGE
ORDER No. オーダー番号
D
C
極数
CKT.
30
29
28
27
26
25
24
23
22
21
C
B
1.65
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
CONNECTOR SERIES NO. : 52437-**29
SCALE
0.65
0.9
0.7
VIEW K
A
0.63
2.605
(金具部投½図)
(DETAIL OF FITTING NAIL)
DOCUMENT STATUS
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
10
P1
RELEASE DATE
9
2018/03/14
07:58:47
8
7
6
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER
± 0.2
10 OVER 30 UNDER
± 0.25
± 0.3
30 OVER
ANGULAR ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
mm
ANGULAR TOL
±
±
±
±
±
±
10:1
3.0 °
CURRENT REV DESC:
GENERAL TOLERANCES
(UNLESS SPECIFIED)
4 PLACES
3 PLACES
2 PLACES
1 PLACE
0 PLACES
0.2
0.25
0.3
DRWN:
YCHEN128
CHK'D: KTAKAHASHI
APPR: NUKITA
INITIAL REVISION:
DRWN: MUMEDA
APPR: NUKITA
THIRD ANGLE PROJECTION
DRAWING
EC NO:
600082
2018/03/02
2018/03/14
2018/03/14
2004/12/20
2004/12/24
SERIES
0.5 FPC CONN.ZIF FOR
SMT R/A (BOTTOM CONTACT) GOLD PLATING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
A
SD-52437-019
MATERIAL NUMBER
CUSTOMER
PSD
001
F
5
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
SHEET NUMBER
4
A3-SIZE
3
52437
SEE TABLE
GENERAL MARKET
1 OF 2
2
1
10
9
8
7
6
5
4
3
2
1
0.3
±
0.05
F
0.3
±
0.05
仕上がり厚さ
THICKNESS
0.5(N+1)
±
0.07
0.5
±
0.1
0.5
±
0.05
(PITCH)
仕上がり厚さ
THICKNESS
F
0.5(N-1)
±
0.05
0.5
±
0.1
0.5(N+1)
±
0.07
0.5
±
0.08
6
0.35
+0.04
-0.03
0.5(N-1)
±
0.05
0.5
±
0.08
0.3
±
0.03
めっき：金めっき(0.２μm)
下地ニッケル(1-5μm)
PLATING: GOLD(0.2μm)
NICKEL UNDER(1-5μm)
めっき：金めっき(0.２μm)
下地ニッケル(1-5μm)
PLATING: GOLD(0.2μm)
NICKEL UNDER(1-5μm)
補強板
(STIFFENER BOARD)
0.5
±
0.05
(PITCH)
R0.3
補強板
(STIFFENER BOARD)
4
±
0.5
6
±
0.5
適合金めっきFPC推奨寸法
APPLICABLE FPC OF GOLD
PLATING RECOMMENDED DIMENSION
適合金めっきFFC推奨寸法
APPLICABLE FFC OF GOLD
PLATING RECOMMENDED DIMENSION
D
THICKNESS: 0.3+0.05/-0.05
仕上がり厚さ：0.3
±
0.05
THICKNESS: 0.3+0.05/-0.05
仕上がり厚さ：0.3
±
0.05
6
±
0.5
E
4
±
0.5
E
D
補強板：ポリイミド
REINFORCE BOARD: POLYMIDE
熱硬化接着剤
THERMOSETTING ADHESIVE
ベースフィルム：ポリイミド(25μm)
BASE FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
導½部： 銅箔(35μm)
COPPER FOIL (35μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
補強板：ポリエステル系
REINFORCE BOARD: PET
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
絶縁テープ：ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
導½部： 銅箔(35μmか50μm)
COPPER FOIL (35μm or 50μm)
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
絶縁テープ：ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
カバーレイ : ポリイミド(25μm)
COVER FILM: POLYIMIDE(25μm)
0.45MAX.
0.55MAX.
1.85MIN.
パターンおよび
半田禁止エリア
KEEPING OUT AREA OF
PATTERN AND SOLDERING
3.65
0.5
±
0.05
(公差非累積)
(ピッチ)
(PITCH)
0.5(N-1)
±
0.05
3.65
(0.2)
(0.3)
2.2
0.8
(0.3)
(NON-ACCUMULATIVE)
(0.3)
(0.3)
3.05
C
金具パターンエリア
SOLDERING AREA
OF FITTING NAIL
C
M
DETAIL L
L
コネクタ½½
CONNECTOR
POSITION
1.25
1.1
1.25
FPC構成推奨仕様
STRUCTURE OF FPC
FFC構成推奨仕様
STRUCTURE OF FFC
FPCについて
打ち抜き方向は導½側から補強板を推奨いたします。
補強フィルム材質はポリイミドを推奨いたします。
接着剤は熱効果接着剤を推奨致します。
B
PATTERN
ABOUT FPC :
RECOMMENDED PUNCHER DIRECTION : FROM CONDUCTOR SIDE TO STIFFNER BOARD SIDE.
RECOMMENDED MATERIAL :
STIFFNER FILM : POLYIMIDE
BONDING AGENT : THERMOSETTING BONDING AGENT
B
BOARD
VIEW M
R0.3
(0.605)
(FROM PATTERN EDGE)
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS
SCALE
A
(DETAIL OF FITTING NAIL
ON PATTERN)
DOCUMENT STATUS
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
10
P1
RELEASE DATE
9
2018/03/14
07:58:47
8
7
6
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER
± 0.2
10 OVER 30 UNDER
± 0.25
± 0.3
30 OVER
ANGULAR ± 3 °
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
mm
ANGULAR TOL
±
±
±
±
±
±
5:1
3.0 °
CURRENT REV DESC:
GENERAL TOLERANCES
(UNLESS SPECIFIED)
4 PLACES
3 PLACES
2 PLACES
1 PLACE
0 PLACES
0.2
0.25
0.3
DRWN:
YCHEN128
CHK'D: KTAKAHASHI
APPR: NUKITA
INITIAL REVISION:
DRWN: MUMEDA
APPR: NUKITA
THIRD ANGLE PROJECTION
DRAWING
EC NO:
600082
2018/03/02
2018/03/14
2018/03/14
2004/12/20
2004/12/24
SERIES
0.5 FPC CONN.ZIF FOR
SMT R/A (BOTTOM CONTACT) GOLD PLATING
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
A
SD-52437-019
MATERIAL NUMBER
CUSTOMER
PSD
001
F
5
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
SHEET NUMBER
4
A3-SIZE
3
52437
SEE SHEET 1
GENERAL MARKET
2 OF 2
2
1
微控制器 MCU
