Technical Data
4082
Effective
August
2017
Supersedes
November
2012
0603ESDA-TR1
ESD suppressor
Applications
•
•
•
•
•
Computers and peripherals
Blu-Ray/DVD players
Satellite and HD radio
Set top Boxes
High speed data ports
o
USB 2.0/3.0
o
High speed
Ethernet
o
Infiniband®
o
IEEE 1394
o
DVI
o
HDMI
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Surface Mount Device
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•
•
•
•
•
•
•
•
•
•
Laptop/notebook/netbook
Digital camcorders
DSL Modems
HDTV Equipment
A/V Equipment
Cell phones
Digital still cameras
MP3 / Multimedia players
External storage
GPS
Product features
Catalog Number Description
0603ESDA-TR1
•
0603/1608 footprint surface mount device
•
Ideal ESD protection for high frequency, low
voltage applications.
•
Provides ESD protection with fast response
time (<1ns) allowing equipment to pass IEC
61000-4-2 testing
•
Very low leakage current
•
Ultra low capacitance (0.15 pF maximum)
•
Bi-directional
5,000 pieces in paper tape on 7 inch
diameter (178 mm) reel.
Device
marking
0603ESDA-TR1
ESD Suppressors are marked on the tape and reel
packages, not individually. Since the product is bi-directional and
symmetrical, no orientation marking is required.
Design considerations
Performance Characteristics
2
Units
Vdc
V
V
Min
-
-
Typ
-
35
8
-
Max
24
-
60
Continuous operating voltage
Clamping voltage
Trigger
voltage
3
-
350
ESD Threat voltage capability
Leakage current (@ 12 Vdc)
Peak
current
2
4
kV
-
15
-
The location in the circuit for the 0603ESDA-TR1 family has to
be carefully determined. For better performance, the device
should be placed as close to the signal input as possible and
ahead of any other component. Due to the high current
associated with an ESD event, it is recommended to use a “0-
stub” pad design (pad directly on the signal/data line and
second pad directly on common ground).
Processing
recommendations
The 0603ESDA-TR1 family currently has a convex profile on the
top surface of the part. This profile is a result of the construction
of the device. They can be processed using standard pick-and-
place equipment. The placement and processing techniques for
these devices are similar to those used for chip resistors and chip
capacitors.
Capacitance (@ 1
kHz
~ 1.8 GHz)
pF
A
-
0.15
45
-
nA
°C
0.01
-
-56
20
<0.1
30
+25
Operating temperature
ESD pulse withstand
2
+105
# pulses
>500
1
1.
Some shifting in characteristics may occur when tested over several hundred ESD
pulses at very rapid rate of 1 pulse per second or faster.
2.
Per IEC 61000-4-2, 30A @ 8 kV, level 4, clamp measurement made 30 ns after
initiation of pulse, all tests in contact discharge mode.
3.
Trigger measurement made using Transmission Line Pulse (TLP) method.
4.
PolySURG™ devices are capable of withstanding up to a 15 kV, 45 A ESD pulse.
Device ratings are given at 8 kV per Note 1, unless otherwise specified.
Technical Data
4082
Effective
August
2017
0603ESDA-TR1
ESD suppressor
Dimensions - mm (in)
Recommended Pad Layout - in (mm)
(per IPC-SM-782 )
R
T
H
L
W
EIA Size
0603ESDA
Packaging- mm (in)
A
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L
W
H
T
R
1.60±0.10
0.80±0.10
0.50±0.10
0.30±0.20
0.70±0.10
(0.063±0.004) (0.031±0.004) (0.020±0.004) (0.012±0.008) (0.028±0.004)
4.0±0.1
(.157±.004)
B
2.0±0.05
(.079±.002)
3.5±0.05
(.138±.002)
2.0±0.75
(.079±.030)
8.0±0.30
(.315±.012)
4.0±0.1
(.157±.004)
1.5±0.10
(.059±.004)
1.75±0.1
(.069±.004)
2.0±0.5
(.080±.020)
60.0±1.5
(2.362±.059)
r
to
n
1.0 max
(0.039 max)
0.60min
(0.023 min)
is
y
1.1 ref
(0.043 ref)
Dimension
A
B
0603
21±0.8
(.827±.032)
178.0±2.0
(7.008±.080)
1.90±0.20
(.075±0.008)
1.10±0.20
(.043±0.008)
13.0±0.5
(.512±.020)
9.0±1.5
(.354±.059)
2
www.eaton.com/electronics
0603ESDA-TR1
ESD suppressor
Environmental Specifications:
Technical Data
4082
Effective
August
2017
• Moisture Resistance per EIA/IS-722 Paragraph 4.4.2. This standard is based upon MIL-STD-202G Method 103B but with temperature and relative
humidity at +85 °C and 85% RH respectively. Test condition ‘A’ (240
Hours
) per MIL-STD-202G.
• Thermal shock: MIL-STD-202, Method 107G, -55 °C to
+125
°C, 30 min. cycle, 10 cycles.
• Vibration: MIL-STD-202F, Method 201A,(10 to 55 to 10 Hz, 1 min. cycle, 2
hours
each in X-Y-Z).
• Chemical resistance: ASTM D-543, 4 hrs @
+40
°C, 3 solutions (H2O, detergent solution, defluxer).
• Operating temperature characteristics, measurement at +25 °C, +105 °C and -56 °C.
• Full load voltage: 14.4 Vdc, 18 Vdc & 24 Vdc for 1000 hours,
+25
°C.
• Solder leach resistance and terminal adhesion: Per EIA-576.
• Solderability: MIL-STD-202, Method 208 (95% coverage).
Soldering Recommendations
• Compatible with lead and lead-free solder reflow processes
• Peak reflow temperatures and durations:
- IR Reflow =
+260
°C max for 10 sec. max.
- Wave Solder =
+260
°C max. for 10 sec. max.
• Recommended IR Reflow Profile:
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Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No.
4082
BU-SB12920
August
2017
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to
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is
y
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
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All other trademarks are property
of their respective owners.
