Peripheral Driver, 4 Driver, ECL100K, CQFP24
厂商名称:Philips Semiconductors (NXP Semiconductors N.V.)
厂商官网:https://www.nxp.com/
下载文档型号 | 100113Y | 100113A | 100113YB | 100113F-B |
---|---|---|---|---|
描述 | Peripheral Driver, 4 Driver, ECL100K, CQFP24 | Peripheral Driver, 4 Driver, ECL100K, PQCC28 | Peripheral Driver, 4 Driver, ECL100K, CQFP24 | Peripheral Driver, 4 Driver, ECL100K, CDIP24 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | QFF, QFL24,.4SQ | QCCJ, LDCC28,.5SQ | QFF, QFL24,.4SQ | DIP, DIP24,.4 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
驱动器位数 | 4 | 4 | 4 | 4 |
JESD-30 代码 | S-XQFP-F24 | S-PQCC-J28 | S-XQFP-F24 | R-XDIP-T24 |
JESD-609代码 | e0 | e0 | e0 | e0 |
标称负供电电压 | -4.5 V | -4.5 V | -4.5 V | -4.5 V |
端子数量 | 24 | 28 | 24 | 24 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC |
封装代码 | QFF | QCCJ | QFF | DIP |
封装等效代码 | QFL24,.4SQ | LDCC28,.5SQ | QFL24,.4SQ | DIP24,.4 |
封装形状 | SQUARE | SQUARE | SQUARE | RECTANGULAR |
封装形式 | FLATPACK | CHIP CARRIER | FLATPACK | IN-LINE |
电源 | -4.5 V | -4.5 V | -4.5 V | -4.5 V |
表面贴装 | YES | YES | YES | NO |
技术 | ECL100K | ECL100K | ECL100K | ECL100K |
温度等级 | OTHER | OTHER | OTHER | OTHER |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | FLAT | J BEND | FLAT | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | QUAD | QUAD | QUAD | DUAL |
Is Samacsys | N | N | N | - |
Base Number Matches | 1 | 1 | 1 | - |