型号
- 型号
- 关键词
IC,DECODER/DEMUX,3-TO-8-LINE,ECL,FP,16PIN,CERAMIC
厂商名称：NXP(恩智浦)
厂商官网：https://www.nxp.com
下载文档| 型号 | 10H561/BFAJC | 10H561/BEAJC | 10H561M/B2AJC |
|---|---|---|---|
| 描述 | IC,DECODER/DEMUX,3-TO-8-LINE,ECL,FP,16PIN,CERAMIC | IC,DECODER/DEMUX,3-TO-8-LINE,ECL,DIP,16PIN,CERAMIC | IC,DECODER/DEMUX,3-TO-8-LINE,ECL,LLCC,20PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DFP, FL16,.3 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown | unknown | unknown |
| Is Samacsys | N | N | N |
| JESD-30 代码 | R-XDFP-F16 | R-XDIP-T16 | S-XQCC-N20 |
| JESD-609代码 | e0 | e0 | e0 |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DFP | DIP | QCCN |
| 封装等效代码 | FL16,.3 | DIP16,.3 | LCC20,.35SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | IN-LINE | CHIP CARRIER |
| 最大电源电流（ICC） | 84 mA | 84 mA | 84 mA |
| Prop。Delay @ Nom-Sup | 2.3 ns | 2.3 ns | 2.3 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 表面贴装 | YES | NO | YES |
| 技术 | ECL | ECL | ECL |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 |
| 厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) |
