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21281-AB

RISC Microprocessor, 32-Bit, 160MHz, CMOS, PQFP144, TQFP-144

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Intel(英特尔)

厂商官网:http://www.intel.com/

下载文档
器件参数
参数名称
属性值
零件包装代码
QFP
包装说明
LFQFP, QFP144,.87SQ,20
针数
144
Reach Compliance Code
unknow
ECCN代码
3A001.A.2.C
地址总线宽度
32
位大小
32
边界扫描
YES
最大时钟频率
3.68 MHz
外部数据总线宽度
32
格式
FIXED POINT
集成缓存
YES
JESD-30 代码
S-PQFP-G144
长度
20 mm
低功率模式
YES
端子数量
144
最高工作温度
70 °C
最低工作温度
封装主体材料
PLASTIC/EPOXY
封装代码
LFQFP
封装等效代码
QFP144,.87SQ,20
封装形状
SQUARE
封装形式
FLATPACK, LOW PROFILE, FINE PITCH
电源
1.65,3.3 V
认证状态
Not Qualified
座面最大高度
1.6 mm
速度
160 MHz
最大供电电压
1.8 V
最小供电电压
1.5 V
标称供电电压
1.65 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子形式
GULL WING
端子节距
0.5 mm
端子位置
QUAD
宽度
20 mm
uPs/uCs/外围集成电路类型
MICROPROCESSOR, RISC
Base Number Matches
1
文档预览
SA-110 Microprocessor
Technical Reference Manual
December 2000
Order Number: 278058-002
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The SA-110 may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current
characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling
1-800-548-4725 or by visiting Intel's website at http://www.intel.com.
Copyright © Intel Corporation, 2000
*Other brands and names are the property of their respective owners.
SA-110 Microprocessor Technical Reference Manual
Contents
1
Introduction.....................................................................................................................1–1
1.1
1.2
1.3
1.4
Features ............................................................................................................1–1
Applications .......................................................................................................1–2
Document Conventions .....................................................................................1–3
ARM Architecture ..............................................................................................1–3
1.4.1 26-Bit Mode ..........................................................................................1–3
1.4.2 Coprocessors .......................................................................................1–3
1.4.3 Memory Management ..........................................................................1–3
1.4.4 Instruction Cache .................................................................................1–4
1.4.5 Data Cache ..........................................................................................1–4
1.4.6 Write Buffer ..........................................................................................1–4
Block Diagram ...................................................................................................1–4
Functional Diagram ...........................................................................................1–6
1.5
1.6
2
3
Signal Description ..........................................................................................................2–1
ARM Implementation Options ........................................................................................3–1
3.1
3.2
Big and Little Endian .........................................................................................3–1
Exceptions.........................................................................................................3–1
3.2.1 Reset ....................................................................................................3–2
3.2.2 Abort.....................................................................................................3–2
3.2.3 Vector Summary...................................................................................3–3
3.2.4 Exception Priorities...............................................................................3–3
3.2.5 Interrupt Latencies................................................................................3–4
Coprocessors ....................................................................................................3–4
Instruction Timings ............................................................................................4–1
Internal Coprocessor Instructions......................................................................5–1
Registers ...........................................................................................................5–2
5.2.1 Register 0 – ID .....................................................................................5–2
5.2.2 Register 1 – Control .............................................................................5–3
5.2.3 Register 2 – Translation Table Base ....................................................5–4
5.2.4 Register 3 – Domain Access Control ...................................................5–4
5.2.5 Register 4 – RESERVED .....................................................................5–4
5.2.6 Register 5 – Fault Status......................................................................5–4
5.2.7 Register 6 – Fault Address...................................................................5–4
5.2.8 Register 7 – Cache Control Operations ...............................................5–5
5.2.9 Register 8 – TLB Operations................................................................5–5
5.2.10 Registers 9..14 – RESERVED .............................................................5–5
5.2.11 Register 15 – Test, Clock, and Idle Control..........................................5–6
5.2.11.1
Icache LFSR Controls ........................................................5–6
5.2.11.2
Clock Controls....................................................................5–6
3.3
4
5
4.1
5.1
5.2
Instruction Set ................................................................................................................4–1
Configuration ..................................................................................................................5–1
SA-110 Microprocessor Technical Reference Manual
iii
6
Caches and Write Buffer ................................................................................................ 6–1
6.1
Instruction Cache (Icache) ................................................................................ 6–1
6.1.1 Icache Operation .................................................................................. 6–1
6.1.2 Icache Validity ...................................................................................... 6–1
6.1.2.1
Software Icache Flush ....................................................... 6–1
6.1.3 Icache Enable/Disable and Reset ........................................................ 6–1
6.1.3.1
Enabling the Icache ........................................................... 6–2
6.1.3.2
Disabling the Icache........................................................... 6–2
Data Cache (Dcache)....................................................................................... 6–2
6.2.1 Cacheable Bit – C ................................................................................ 6–2
6.2.2 Bufferable Bit – B ................................................................................. 6–2
6.2.3 Dcache Operation ................................................................................ 6–2
6.2.3.1
Cacheable Reads – C=1.................................................... 6–2
6.2.3.2
Noncacheable Reads – C=0.............................................. 6–3
6.2.4 Dcache Validity .................................................................................... 6–3
6.2.4.1
Software Data Cache Flush ............................................... 6–3
6.2.4.2
Doubly-Mapped Space ...................................................... 6–3
6.2.5 Dcache Enable/Disable and Reset ...................................................... 6–3
6.2.5.1
Enabling the Dcache.......................................................... 6–4
6.2.5.2
Disabling the Dcache ......................................................... 6–4
Write Buffer (WB) .............................................................................................. 6–4
6.3.1 Bufferable Bit........................................................................................ 6–4
6.3.2 Write Buffer Operation ......................................................................... 6–4
6.3.2.1
Writes to a Bufferable and Cacheable Location
(B=1, C=1)............................................................................... 6–4
6.3.2.2
Writes to Bufferable and Noncacheable Location
(B=1, C=0)............................................................................... 6–5
6.3.2.3
Unbufferable Writes (B=0) ................................................. 6–5
6.3.3 Enabling the Write Buffer ..................................................................... 6–5
6.3.4 Disabling the Write Buffer .................................................................... 6–5
MMU Registers ................................................................................................. 7–1
MMU Faults and CPU Aborts............................................................................ 7–1
External Aborts.................................................................................................. 7–2
7.3.1 Cacheable Reads (Cache Line Fills).................................................... 7–2
7.3.2 Buffered Writes .................................................................................... 7–2
Interaction of the MMU, Icache, Dcache and Write Buffer ................................ 7–3
SA-110 Operating Modes.................................................................................. 8–1
SA-110 Clocking ............................................................................................... 8–1
8.2.1 Switching to Idle Mode ......................................................................... 8–2
8.2.2 Switching to Sleep Mode...................................................................... 8–2
8.2.3 Core Clock Configuration (CCCFG) ..................................................... 8–2
8.2.4 Memory Clock Configuration (MCCFG) ............................................... 8–2
8.2.5 Tester and Debug Clocks..................................................................... 8–3
Bus Modes ........................................................................................................ 9–1
9.1.1 Standard and Enhanced Mode ............................................................ 9–1
6.2
6.3
7
Memory-Management Unit (MMU)................................................................................. 7–1
7.1
7.2
7.3
7.4
8
8.1
8.2
Clocks ............................................................................................................................ 8–1
9
Bus Interface .................................................................................................................. 9–1
9.1
iv
SA-110 Microprocessor Technical Reference Manual
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
9.10
9.11
9.12
9.13
SA-110 Bus Stalls .............................................................................................9–2
Cycle Types.......................................................................................................9–2
Memory Access.................................................................................................9–3
Read/Write ........................................................................................................9–3
Address Pipeline Enable (APE).........................................................................9–3
Memory Access Types ......................................................................................9–3
External Accesses.............................................................................................9–5
9.8.1 Unbuffered Writes/Noncacheable Reads .............................................9–5
Buffered Write ...................................................................................................9–5
Cache Line Fill...................................................................................................9–5
Read-Lock-Write ...............................................................................................9–6
Stalling the Bus .................................................................................................9–7
Summary of Transactions .................................................................................9–7
9.13.1 Read Bursts..........................................................................................9–7
9.13.2 Write Bursts.........................................................................................9–7
9.13.3 Transaction Summary .........................................................................9–8
Overview ......................................................................................................... 10–1
Reset ...............................................................................................................10–2
Pull-Up Resistors............................................................................................. 10–2
nPWRSLP ....................................................................................................... 10–2
Instruction Register ......................................................................................... 10–2
Public Instructions ...........................................................................................10–3
10.6.1 EXTEST (00000) ................................................................................ 10–3
10.6.2 SAMPLE/PRELOAD (00001) ............................................................. 10–3
10.6.3 CLAMP (00100).................................................................................. 10–4
10.6.4 HIGHZ (00101)................................................................................... 10–4
10.6.5 IDCODE (00110) ................................................................................ 10–4
10.6.6 BYPASS (11111)................................................................................ 10–4
Test Data Registers......................................................................................... 10–5
10.7.1 Bypass Register ................................................................................. 10–6
10.7.2 Device Identification (ID) Code Register ............................................ 10–6
10.7.3 Boundary-Scan (BS) Register ............................................................ 10–7
Boundary-Scan Interface Signals.................................................................... 10–8
Absolute Maximum Ratings............................................................................. 11–1
DC Operating Conditions ................................................................................ 11–1
DC Characteristics .......................................................................................... 11–2
Power Supply Voltages and Currents ............................................................. 11–2
Test Conditions ............................................................................................... 12–1
Module Considerations.................................................................................... 12–1
Main Bus Signals............................................................................................. 12–2
SA-110 AC Parameters................................................................................... 12–4
TQFP Pinout.................................................................................................... 13–2
10
Boundary-Scan Test Interface...................................................................................... 10–1
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
11
11.1
11.2
11.3
11.4
12
12.1
12.2
12.3
12.4
13
13.1
DC Parameters............................................................................................................. 11–1
AC Parameters............................................................................................................. 12–1
Package and Pinout ..................................................................................................... 13–1
SA-110 Microprocessor Technical Reference Manual
v
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参数对比
与21281-AB相近的元器件有:21281-BB、21281-DB、FA21281FB、21281-CB、21281-EB。描述及对比如下:
型号 21281-AB 21281-BB 21281-DB FA21281FB 21281-CB 21281-EB
描述 RISC Microprocessor, 32-Bit, 160MHz, CMOS, PQFP144, TQFP-144 RISC Microprocessor, 32-Bit, 100MHz, CMOS, PQFP144, TQFP-144 RISC Microprocessor, 32-Bit, 166MHz, CMOS, PQFP144, TQFP-144 RISC Microprocessor, 32-Bit, 233MHz, CMOS, PQFP144, TQFP-144 RISC Microprocessor, 32-Bit, 200MHz, CMOS, PQFP144, TQFP-144 RISC Microprocessor, 32-Bit, 233MHz, CMOS, PQFP144, TQFP-144
零件包装代码 QFP QFP QFP QFP QFP QFP
包装说明 LFQFP, QFP144,.87SQ,20 LFQFP, QFP144,.87SQ,20 LFQFP, QFP144,.87SQ,20 LFQFP, LFQFP, QFP144,.87SQ,20 LFQFP, QFP144,.87SQ,20
针数 144 144 144 144 144 144
Reach Compliance Code unknow unknow unknow unknow unknow unknow
地址总线宽度 32 32 32 32 32 32
位大小 32 32 32 32 32 32
边界扫描 YES YES YES YES YES YES
最大时钟频率 3.68 MHz 3.68 MHz 3.68 MHz 3.68 MHz 3.68 MHz 3.68 MHz
外部数据总线宽度 32 32 32 32 32 32
格式 FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
集成缓存 YES YES YES YES YES YES
JESD-30 代码 S-PQFP-G144 S-PQFP-G144 S-PQFP-G144 S-PQFP-G144 S-PQFP-G144 S-PQFP-G144
长度 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
低功率模式 YES YES YES YES YES YES
端子数量 144 144 144 144 144 144
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
速度 160 MHz 100 MHz 166 MHz 233 MHz 200 MHz 233 MHz
最大供电电压 1.8 V 1.8 V 2.2 V 2.1 V 2.2 V 2.1 V
最小供电电压 1.5 V 1.5 V 1.8 V 1.9 V 1.8 V 1.9 V
标称供电电压 1.65 V 1.65 V 2 V 2 V 2.1 V 2 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD
宽度 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
uPs/uCs/外围集成电路类型 MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1 1 1 1 1
封装等效代码 QFP144,.87SQ,20 QFP144,.87SQ,20 QFP144,.87SQ,20 - QFP144,.87SQ,20 QFP144,.87SQ,20
电源 1.65,3.3 V 1.65,3.3 V 2,3.3 V - 2,3.3 V 2,3.3 V
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