512 X 8 SPI BUS SERIAL EEPROM, PDSO8
512 × 8 总线串行电可擦除只读存储器, PDSO8
器件类别:存储
厂商名称:Microchip(微芯科技)
厂商官网:https://www.microchip.com
下载文档型号 | 25LC040A | 25LC040AT-H/SN | 25LC040A-H/SN | 25LC020A-H/SN | 25LC010A_09 | 25LC020A | 25LC010A |
---|---|---|---|---|---|---|---|
描述 | 512 X 8 SPI BUS SERIAL EEPROM, PDSO8 | 512 X 8 SPI BUS SERIAL EEPROM, PDSO8 | 512 X 8 SPI BUS SERIAL EEPROM, PDSO8 | 512 X 8 SPI BUS SERIAL EEPROM, PDSO8 | 512 X 8 SPI BUS SERIAL EEPROM, PDSO8 | 512 X 8 SPI BUS SERIAL EEPROM, PDSO8 | 512 X 8 SPI BUS SERIAL EEPROM, PDSO8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
表面贴装 | Yes | YES | YES | YES | Yes | Yes | Yes |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
组织 | 512 X 8 | 512X8 | 512X8 | 256X8 | 512 X 8 | 512 X 8 | 512 X 8 |
最大工作温度 | 150 Cel | - | - | - | 150 Cel | 150 Cel | 150 Cel |
最小工作温度 | -40 Cel | - | - | - | -40 Cel | -40 Cel | -40 Cel |
最大供电/工作电压 | 5.5 V | - | - | - | 5.5 V | 5.5 V | 5.5 V |
最小供电/工作电压 | 2.5 V | - | - | - | 2.5 V | 2.5 V | 2.5 V |
额定供电电压 | 5 V | - | - | - | 5 V | 5 V | 5 V |
最大时钟频率 | 5 MHz | - | - | - | 5 MHz | 5 MHz | 5 MHz |
加工封装描述 | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | - | - | - | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
无铅 | Yes | - | - | - | Yes | Yes | Yes |
欧盟RoHS规范 | Yes | - | - | - | Yes | Yes | Yes |
中国RoHS规范 | Yes | - | - | - | Yes | Yes | Yes |
状态 | ACTIVE | - | - | - | ACTIVE | ACTIVE | ACTIVE |
工艺 | CMOS | - | - | - | CMOS | CMOS | CMOS |
包装形状 | RECTANGULAR | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
包装尺寸 | SMALL OUTLINE | - | - | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
端子间距 | 1.27 mm | - | - | - | 1.27 mm | 1.27 mm | 1.27 mm |
端子涂层 | MATTE TIN | - | - | - | MATTE TIN | MATTE TIN | MATTE TIN |
包装材料 | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
存储密度 | 4096 deg | - | - | - | 4096 deg | 4096 deg | 4096 deg |
操作模式 | SYNCHRONOUS | - | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
位数 | 512 | - | - | - | 512 | 512 | 512 |
内存IC类型 | SPI BUS SERIAL EEPROM | - | - | - | SPI BUS SERIAL EEPROM | SPI BUS SERIAL EEPROM | SPI BUS SERIAL EEPROM |
串行并行 | SERIAL | - | - | - | SERIAL | SERIAL | SERIAL |
写周期最大TWC | 6 ms | - | - | - | 6 ms | 6 ms | 6 ms |