Product Information Data Sheet
Liquid Tin
(MG Cat. No. 421)
PRODUCT DESCRIPTION
Liquid Tin is a clear immersion tin designed and formulated to coat a copper substrate or
solder deposit with a dense tin deposit. This deposit is readily solderable with a long shelf
life. The tin deposit owes its outstanding corrosion protection to its dense coating and
absence of co-deposited organics. Liquid Tin will clean solder deposits and render the
surface active and bright, ensuring good solderabilty. It has the benefit of:
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High metal concentration (4 oz./gallon)
Clear solution even at room temperature
Dense tin deposit, long shelf life
Residues are free rinsing
Very stable solution
SOLUTION MAKE-UP
Liquid Tin is used at full strength and therefore requires no mixing or dilution.
OPERATING CONDITIONS
Activity
Temperature
Time
Deposition rate
Agitation
Nominal
100%
27°C (80°F)
5 min.
10 µin/min.
constant mechanical
Range
10 –120%
21– 60°C (70 –140°F)
1 –10 min.
3-22 µin/min.
RECOMMENDED PROCESS CYCLE
Copper:
1. Clean board
2. Rinse
3. Liquid Tin
4. Warm water rinse
5. Deionized water rinse
6. Dry
The treatment of solder plated parts requires no pre-cleaner, except in cases of severe
contamination of the surface. In these cases, an alkaline soak cleaner, acid soak cleaner,
or a proprietary solder cleaner may be used.
Product Information Data Sheet
Liquid Tin
(MG Cat. No. 421)
BATH OPERATION AND MAINTENANCE
Liquid Tin may be used until the activity drops to about 1 0%. Volume lost due to evapora-
tion should be replaced with D. I. water. Chemical replenishment of Liquid Tin solutions is
not recommended.
EQUIPMENT
Liquid Tin solutions should be used with equipment constructed of polypropylene, polyeth-
ylene, Teflon® similar materials. Do not use stainless steel. Heaters should be Teflon ® or
quartz.
WASTE TREATMENT
A spent solution should be diluted by at least 50 percent with tap water. Add 10 grams
per liter ferrous sulfate and mix until totally dissolved. Then adjust pH to 8.5 with dilute
sodium hydroxide. Allow the resulting precipitate to settle, and dispose of the supernatant
liquid and precipitate in accordance with all applicable federal, state and local regula-
tions.
SAFETY
Liquid Tin solutions are strongly acidic. Normal caution such as the use of safety goggles,
rubber gloves, etc., should be exercised during handling. Avoid breathing vapors. In the
event of eye contact, flush with copious amounts of water and CONTACT A PHYSICIAN.
Consult the Material Safety Data Sheet for safety, health and environmental information.
Liquid Tin can be operated until the percent activity reaches 10%.
Product Information Data Sheet
Liquid Tin
(MG Cat. No. 421)
Deposition Rate
90
80
70
Thickness (microinches)
60
50
40
30
20
10
0
0 min
1 min
2 min
3 min
4 min
5 min
Product Information Data Sheet
Liquid Tin
(MG Cat. No. 421)
Deposition Rate
2.5
2
Thickness (microns)
1.5
1
0.5
0
0 min
1 min
2 min
3 min
4 min
5 min
Product Information Data Sheet
Liquid Tin
(MG Cat. No. 421)
ANALYTICAL
Procedure Number: AP.0532.d
I. Procedure Description: Titrimetric method measuring the percent activity of Liquid Tin.
II. EQUIPMENT & SETTINGS
A. 5.0 mL class “A” pipette
B. 50.0 mL burette
C. 250 mL Erlenmeyer flask
D. 25 mL graduated cylinder
Ill. REAGENTS
A. pH 5 acetate buffer - To 245 grams of sodium acetate trihydrate, add 58 mL of
Glacial Acetic Acid. Dilute to 1 liter with Dl water.
B. Methylthymol blue indicator - Dissolve 0.1 gram of mdhylthymol blue indicator
powder in 50 mls of D.l. water.
C. 0.1 0 M EDTA - Weigh 36.324 g of disodium EDTA dihydrate. Dissolve in, 1 liter
volumetric fiask with Dl water.
IV. PROCEDURE
A. Pipette a 5 mL of sample of working bath into a 250 mL Erlenmeyer flask, and add
about 75 mL of D.I. water.
B. Add 25 mL of pH 5 acetate buffer.
C. Add I 0 drops of methylthymol blue indicator
D. Titrate with 0.1 0 M EDTA to a faint yellow endpoint
E. Record the result
V. CALCULATIONS
A. Percent Activity Liquid Tin = (mL 0.10 M EDTA used) x (M EDTA) x (85.9)
Microchip MCU
