TiWi-uB1 Module
DATASHEET
TiWi-uB1
Bluetooth Smart
(BLE) Module
FEATURES
Built in CC2541 single-chip
Bluetooth Smart
(BLE 4.0) System-On-Chip (SOC).
Memory: 256kB FLASH, 8kB RAM
RF Output Power: 0 dBm (Class 3)
RF Receive Sensitivity: -94 dBm
Size: 11.6mm x 17.9 mm x 2.3 mm
Operating Voltage: 2.0V to 3.6V
Operating Temperature: -40 to +85
o
C
Worldwide Acceptance: FCC (USA), IC
(Canada), ETSI (Europe), Giteki (Japan)
REACH and RoHS compliant
Complete power-optimized stack, including
Controller and Host
o
GAP – Central, Peripheral, Observer, or
Broadcaster (Including Combination
Roles)
o
ATT/GATT – Client and Server
o
SMP – AES-128 Encryption and
Decryption
o
L2CAP
Multiple Configuration Options
o
Single-Chip Configuration, Allowing
Applications to Run on CC2541
o
Network Processor Interface for
Applications Running on an External
Microcontroller
DESCRIPTION
LSR would like to announce a low-cost and low-
power consumption module which has all of the
BluetoothSmart
functionalities.
The TiWi-uB1 module fully supports the single
mode
Bluetooth
Low Energy operation, and the
output power can support class 3. The module
provides the ability to either put your entire
application into the integrated 8051 microcontroller,
or use the module in Network Processor mode in
conjunction with the microcontroller of your choice.
Need to get to market quickly? Not an expert in
Bluetooth
Low Energy? Need a custom antenna?
Do you need help with your host board? LSR Design
Services will be happy to develop custom hardware
or software, or help integrate the design. Contact
us at sales@lsr.com or call us at 262-375-4400.
APPLICATIONS
2.4 GHz
Bluetooth
Low Energy Systems
Human-Interface
Devices
(Keyboard,
Mouse, Remote Control)
Sports and Leisure Equipment
Mobile Phone Accessories
Consumer Electronics
The information in this document is subject to change without notice.
330-0132-R1.7
Copyright © 2013-2015 LSR
Page 1 of 43
TiWi-uB1 Module
DATASHEET
ORDERING INFORMATION
Order Number
450-0103C
450-0103R
450-0106C
450-0106R
450-0120
Description
TiWi-uB1 Module, PCB Trace Antenna (Cut Tape)
TiWi-uB1 Module, PCB Trace Antenna (Tape & Reel)
TiWi-uB1 Module, External Antenna Port (Cut Tape)
TiWi-uB1 Module, External Antenna Port (Tape & Reel)
TiWi-uB1 EM Board, PCB Trace Antenna
Table 1 Orderable Model Numbers
MODULE ACCESSORIES
Order Number
Description
001-0001
2.4 GHz Dipole Antenna with Reverse Polarity
SMA Connector
080-0001
U.FL to Reverse Polarity SMA Bulkhead Cable
105mm
Table 2 Module Accessories
The information in this document is subject to change without notice.
330-0132-R1.7
Copyright © 2013-2015 LSR
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TiWi-uB1 Module
DATASHEET
BLOCK DIAGRAM
Off Module Antenna
(optional)
VCC
/Reset
PCB
Trace
Antenna
(optional)
2
19
CC2541
Bluetooth Low Energy (BLE)
System-on-Chip (SOC)
32 MHz
Crystal
2
Debug/IO
I/O
32 kHz
Crystal
(optional)
or
I/O
TiWi-uB1 Module
Figure 1 TiWi-uB1 Module Block Diagram
The information in this document is subject to change without notice.
330-0132-R1.7
Copyright © 2013-2015 LSR
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TiWi-uB1 Module
DATASHEET
TABLE OF CONTENTS
FEATURES ................................................................................................................................... 1
APPLICATIONS ............................................................................................................................ 1
DESCRIPTION .............................................................................................................................. 1
ORDERING INFORMATION .......................................................................................................... 2
MODULE ACCESSORIES................................................................................................................ 2
BLOCK DIAGRAM ........................................................................................................................ 3
FOOTPRINT AND PIN DEFINITIONS .............................................................................................. 6
PIN DESCRIPTIONS ...................................................................................................................... 7
ELECTRICAL SPECIFICATIONS ....................................................................................................... 8
Absolute Maximum Ratings ................................................................................................................................... 8
Recommended Operating Conditions .................................................................................................................... 8
General Characteristics .......................................................................................................................................... 8
General Specifications ........................................................................................................................................... 9
DC Characteristics ................................................................................................................................................ 10
Current Consumption .......................................................................................................................................... 11
CURRENT CONSUMPTION WITH DC to DC Converter ........................................................................................... 12
RF Characteristics ................................................................................................................................................ 13
SLOW CLOCK (32 KHZ) SOURCE REQUIREMENTS ........................................................................ 15
32.768-kHz EXTERNAL CRYSTAL OSCILLATOR ....................................................................................................... 15
32-kHz INTERNAL RC OSCILLATOR ........................................................................................................................ 16
SPI INTERFACE CHARACTERISTICS .............................................................................................. 17
DEBUG INTERFACE CHARACTERISTICS ....................................................................................... 19
SOLDERING RECOMMENDATIONS ............................................................................................. 21
Recommended Reflow Profile for Lead Free Solder ............................................................................................. 21
CLEANING ................................................................................................................................. 22
OPTICAL INSPECTION ................................................................................................................ 22
REWORK ................................................................................................................................... 22
The information in this document is subject to change without notice.
330-0132-R1.7
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TiWi-uB1 Module
DATASHEET
SHIPPING, HANDLING, AND STORAGE ....................................................................................... 22
Shipping ............................................................................................................................................................... 22
Handling .............................................................................................................................................................. 22
Moisture Sensitivity Level (MSL) .......................................................................................................................... 22
Storage ................................................................................................................................................................ 22
Repeating Reflow Soldering ................................................................................................................................. 23
AGENCY CERTIFICATIONS .......................................................................................................... 24
AGENCY STATEMENTS ............................................................................................................... 24
Federal Communication Commission Interference Statement ............................................................................. 24
Industry Canada Statements ................................................................................................................................ 25
OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS............. 26
OEM LABELING REQUIREMENTS FOR END-PRODUCT ................................................................. 27
OEM END PRODUCT USER MANUAL STATEMENTS ..................................................................... 28
EUROPE .................................................................................................................................... 29
CE Notice ............................................................................................................................................................. 29
Declaration of Conformity (DOC) ......................................................................................................................... 29
BLUETOOTH CERTIFICATION ...................................................................................................... 29
ANTENNA INFORMATION .......................................................................................................... 30
Dipole Antenna 001-0001 .................................................................................................................................... 30
PCB Trace Antenna .............................................................................................................................................. 30
MECHANICAL DATA................................................................................................................... 39
PCB FOOTPRINT ........................................................................................................................ 40
Tape & Reel Dimensions ...................................................................................................................................... 41
DEVICE MARKINGS .................................................................................................................... 42
Rev 1 Devices ....................................................................................................................................................... 42
Rev 2 Devices ....................................................................................................................................................... 42
CONTACTING LSR ...................................................................................................................... 43
The information in this document is subject to change without notice.
330-0132-R1.7
Copyright © 2013-2015 LSR
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