Sn100e No Clean Solder Wire
4933–4935 Technical Data Sheet
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4933–4935
Description
The 4933–4935
Sn100e No Clean Solder Wire
is an electronic grade solder wire. It uses a high-purity,
eutectic tin/copper/cobalt alloy that is complemented with a no clean, synthetically refined, splatter-proof,
resin flux core. The 4933–4935 solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C
specifications.
This solder is a great lead-free alternative to leaded solders. It generally provides better wetting, contact
angle, flow, and visual appearance than typical Sn63/Pb37 no clean solders, while still delivering excellent
performance characteristics. It offers superior solder penetration into plated through holes and surface
mount interconnects. Further, it is a suitable replacement for SAC305 solder since the 493x forms
brighter, shinier, and less grainy joints. Furthermore, it is less expensive than SAC305.
The 4933–4935 solders achieve a consistent solder and flux percentage through a state-of-the-art,
extrusion, wire-drawing machine. This machine continually monitors the wire to prevent voids and ensure
consistency, providing a top-grade solder wire.
Benefits & Features
•
•
•
•
•
•
•
•
Eutectic alloy
(liquidus = solidus temperature)
Alloy exceeds J-STD-006C and meets ASTM B 32
purity requirements
Flux meets J-STD-004B
Spreads like rosin-activated flux
Virtually non-splattering
Non-corrosive
Non-conductive residue
Halide free
C
OMPLIANCE
✓
Dobb Frank (DRC
conflict free)
✓
REACH (compliant)
✓
RoHS (compliant)
Wire Sizes Availability
Cat No.
4935
4933
Std. Wire
Gauge
21
25
Diameter
0.81 mm
0.51 mm
0.032 in
0.020 in
Packaging
Spool
Spool
Sizes
¼ or 1 lb
¼ or 1 lb
General Flux Parameters
Properties
Residue Removal
Flux Percentage
Flux feature
Shelf life
Value
Not required
2.2%
Wets and spreads like a RA type flux and virtually non-splattering.
5y
Page
1
of
5
Date: 31 August 2017 / Ver. 2.00
Sn100e No Clean Solder Wire
4933–4935 Technical Data Sheet
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4933–4935
Flux Core Properties
The synthetically refined resin wets and spreads like a RA flux. This no clean flux is virtually non-
splattering. It gives rise to a hard, non-conductive, and non-corrosive residue.
Physical Properties
Flux Classification
Flux Type
Flux Activity
Halides %(wt)
Solid Flux Color
Softening Point of Flux Extract
Acid Value (mgKOH/g sample)
Copper Mirror
Silver Chromate—Chlorides + Bromides
Solder Spread
Flux Residue Dryness
Spitting of Flux-Cored Wire Solder
Corrosion Test
Surface Insulation Resistance (SIR)
Bellcore (Telecordia)
Electromigration
Post Reflow Residue
Cleaning Requirements
Method
J-STD-004B
EN29454-1
Value
REL0
Type 1.1.3
Resin
Low
<0.05%
Lightly opaque
24 °C [75 °F]
190–210
No removal
Pass
130 mm
2
Pass
0.30%
Non-corrosive
2.3 × 10
11
Ω
6.1 × 10
11
Ω
Pass
55%
Optional
Visual
IPC-TM-650 2.3.13
IPC-TM-650 2.3.32
IPC-TM-650 2.3.33
IPC-TM-650 2.4.46
IPC-TM-650 2.4.47
IPC-TM-650 2.4.48
IPC-TM-650 2.6.15
IPC-TM-650 2.6.3.3
Bellcore GR-78-CORE 13.1.3
Bellcore GR-78-CORE 13.1.4
TGA Analysis
—
Sn100e Alloy Typical Literature Properties
Physical Properties
Color
Density @26 °C [78 °F]
Tensile Strength
Elongation
Shear Strength
Electrical Properties
Volume Resistivity
Electrical Conductivity
b)
Value
a)
Silvery-white metal
7.4 g/cm
3
28 N/mm
2
[4 100 lb/in
2
]
27%
~20 N/mm
2
[~2 900 lb/in
2
]
Value
12.3
Ωcm
15% IACS
a) N/mm
2
= mPa; lb/in
2
= psi;
b) International Annealed Copper Standard: 100% give 5.8 × 10
7
S/m.
Continued on the next page
Page
2
of
5
Date: 31 August 2017 / Ver. 2.00
Sn100e No Clean Solder Wire
4933–4935 Technical Data Sheet
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4933–4935
Continued…
Thermal Properties
Melting Point, Solidus
Melting Point, Liquidus
Tip Temperature Upper Limit
Coefficient of Thermal Expansion (CTE)
Thermal Conductivity
Specific Heat Capacity
Value
228 °C [442 °F]
228 °C [442 °F]
Do not exceed 425 °C [800 °F]
23.5 ppm/°C
82 W/(m·K)
294 J/(kg·K)
c)
NOTE:
This table present typical literature values for Sn99.5/Cu0.5/Co alloys.
c) CTE for pure tin; unit conversions: ppm/°C =
m/(mK)
= in/in/°C × 10
-6
= unit/unit/°C × 10
-6
Solder Alloy Composition
Properties
MAIN INGREDIENTS
Sn
Cu
Co
Value
COMPOSITION
99.3 to 99.7%
0.49 to 0.51%
<0.1%
Properties
IMPURITIES
a)
Sb
Ag
Bi
In
Pb
Au
As
Fe
Ni
Al
Zn
Cd
J-STD-006C
REQUIREMENTS
≤0.20% Max
≤0.10% Max
≤0.10% Max
≤0.10% Max
≤0.07%
Max
≤0.05% Max
≤0.05%
Max
≤0.02% Max
≤0.01% Max
≤0.005% Max
≤0.003% Max
≤0.002% Max
4933–4935
SPECIFICATIONS
≤0.025%
Max
≤0.001% Max
≤0.01%
Max
≤0.01%
Max
≤0.05% Max
≤0.0002% Max
≤0.0035% Max
≤0.005% Max
≤0.006% Max
≤0.001% Max
≤0.001% Max
≤0.001% Max
a) Exceeds the requirements of J-STD-006C and meets ASTM B 32.
Storage
Protect from direct heat or sunlight. Keep at around between 18 to 27 °C [65 to 80 °F].
Cleaning
The flux residue does not need to be removed for typical applications. If removal is desired, a solvent
system like the
MG 4140
can be used. For best results, warm the cleaning solution to about 40 °C
[104 °F].
Page
3
of
5
Date: 31 August 2017 / Ver. 2.00
Sn100e No Clean Solder Wire
4933–4935 Technical Data Sheet
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4933–4935
Health and Safety
Please see the 4933-4935
Safety Data Sheet
(SDS) for more details on transportation, storage, handling
and other security guidelines.
Health and Safety:
Avoid breathing fumes. Wash hands thoroughly after use. Do not ingest.
HMIS® RATING
HEALTH:
FLAMMABILITY:
PHYSICAL HAZARD:
PERSONAL PROTECTION:
NFPA® 704 CODES
*
1
0
0
0
1
1
0
Approximate HMIS and NFPA Risk Ratings Legend:
0 (Low or none); 1 (Slight); 2 (Moderate); 3 (Serious); 4 (Severe)
Soldering Instructions
To achieve best hand-soldering results
1. Set the tip temperature between 370–425 °C [700–800 °F].
2. Place the solder tip in contact with the joint connection (lead/pad surface) at an angle of around
50° to heat the parts to be soldered.
3. While the soldering tip is applied, touch the solder wire to the opposite side of the soldering joint,
not to the soldering tip.
4. Immediately after the solder has flowed around the whole heated connection, remove the solder
wire and remove soldering tip from connection.
T
IP
!
Do not move the connection while the solder is cooling.
W
ARNING
!
Avoid putting too much or too little solder.
A
TTENTION
!
To avoid damage, do not overheat electrical component.
Packaging and Supporting Products
Cat. No.
4933-112G
4933-454G
4935-112G
4935-454G
Form
Solid wire
Solid wire
Solid wire
Solid wire
Packaging
Spool
Spool
Spool
Spool
Net
112
454
112
454
Weight
g
g
g
g
0.25 lb
1.0 lb
0.25 lb
1.0 lb
Page
4
of
5
Date: 31 August 2017 / Ver. 2.00
Sn100e No Clean Solder Wire
4933–4935 Technical Data Sheet
ISO 9001:2008 Registered Quality System. Burlington, Ontario, CANADA
SAI Global File: 004008
4933–4935
Technical Support
Contact us regarding any questions, improvement suggestions, or problems with this product. Application
notes, instructions, and FAQs are located at
www.mgchemicals.com.
Email:
support@mgchemicals.com
Phone: +(1) 800-340-0772
+(1) 905-331-1396
+(44) 1663 362888
Fax: +(1) 905-331-2862
Mailing address:
(Canada, Mexico & USA)
(International)
(UK & Europe)
or +(1) 800-340-0773
Head Office
9347–193rd Street
Surrey, British Columbia, Canada
V4N 4E7
Manufacturing & Support
1210 Corporate Drive
Burlington, Ontario, Canada
L7L 5R6
Warranty
M.G. Chemicals Ltd.
warranties this product for 12 months from the date of purchase by the end user.
M.G. Chemicals Ltd.
makes no claims as to shelf life of this product for the warranty. The liability of
M.G.
Chemicals Ltd.
whether based on its warranty, contracts, or otherwise shall in no case include incidental or
consequential damage.
Disclaimer
This information is believed to be accurate. It is intended for professional end users having the skills to
evaluate and use the data properly.
M.G. Chemicals Ltd.
does not guarantee the accuracy of the data and
assumes no liability in connection with damages incurred while using it.
Page
5
of
5
Date: 31 August 2017 / Ver. 2.00
工控电子
