PGA / BGA / PLCC SOCKETS
SERIES
518
518-77-NNNMXX-XXX105
PGA
1.27 mm grid socket, Solder tail
Micro pin grid array sockets (µPGA), with contacts placed
on 1.27 mm grid, solder tail.
TECHNICAL SPECS.:
Insulator
Flammability
Sleeve
Contact
Accepted pin Ø
Insertion force
Withdrawal force
Mechanical life
Rated current
Contact resistance
Dielectric strength
Glass-epoxy laminate FR4
UL 94V-O
Brass CuZn36Pb3 (C36000)
Beryllium copper (C17200)
0.30 to 0.35 mm
0.2 N typ.
0.15 N typ. (polished steel gauge Ø 0.3 mm)
Min. 100 cycles
1A
Max. 10 m
Min. 500 V RMS
ORDERING INFORMATION:
PP Plating code
77
Sleeve
Gold flash
Clip
Gold flash
Replace NNN with the number of poles and XX-XXX with body size and layout numbers as indicated here. For
example a 26x26 pin configuration with window and 478 contacts as shown here becomes 518-77-478M26-131105.
PHONE
PRECI-DIP SA
Rue Saint-Henri 11 P.P.Box 834 CH-2800 Delémont / Switzerland
+41 (0)32 421 04 00
FAX
+41 (0)32 421 04 01
E-MAIL
sales@precidip.com www.precidip.com
TECHNICAL ASSISTANCE
GENERAL SPECIFICATIONS:
The values listed below are general specs applying for PRECI-DIP PGA, BGA and PLCC sockets. Please see individual catalog
page for additional and product specific technical data.
Operating temperature range
Climatic category (IEC)
Operating humidity range
Max working voltage
-55 ... +125 °C
55/125/21
annual mean 75 %
100 VRMS/150 VDC (2.54 mm grid)
PRECI-DIP sockets are recognized by Underwriters Laboratories Inc. and listed under "Connectors for Use in Data, Signal,
Control and Power Applications", File Nr. E174442
MECHANICAL CHARACTERISTICS:
Clip retention
Contact (sleeve / clip) retention
Min. 40 N (no displacement under axial force applied)
Min. 3.3 N acc. to MIL-DTL-83734, pt 4.6.4.2
ELECTRICAL CHARACTERISTICS:
Insulation resistance between any two adjacent contacts
Capacitance between any two adjacent contacts
Self inductance per contact
Min. 10'000 M at 500 V AC
Max. 1 pF (PLCC max. 2 pF)
Max. 2 nH
ENVIRONMENTAL CHARACTERISTICS:
The sockets withstand the following environmental tests without mechanical and electrical defects:
- Dry heat steady state IEC 60512-11-9.11i / 60068-2-2.Bb: 125 °C, 16h
- Damp heat cyclic IEC 60512-11-12.11m / 60068-2-30.Db: 25/55 °C, 90 – 100 %rH, 1 cycle of 24 h
- Cold steady state IEC 60512-11-10.11j / 60068-2-1.A: -55 °C, 2 h
- Thermal shock IEC 60512-11-4.11d / 60068-2-14.Na: -55/125 °C, 5 cycles 30 min
- Sinusoidal vibrations IEC 60512-6-4.6d / 60068-2-6.Fc: 10 to 500 Hz, 10 g, 1 octave/min, 10 cycles for each axis
- Shock IEC 60512-6-3.6c / 60068-2-27.Ea: 50 g, 11 ms, 3 shocks in three axis
During the above two tests no contact interruption >50 ns does appear.
- Solderability J-STD-002A, Test A, 245°C, 5 s solder alloy SnAg3.8Cu0.7
- Resistance to soldering heat J-STD-0020C, 260°C, 20 s
- Moisture sensitivity J-STD-020C level 1
- Resistance to corrosion :
1) Salt spray test IEC 60068-2-11.Ka: 48 h
2) Sulfur dioxide (SO2) test IEC 60068-2-42 Kc: 96 h at 25 ppm SO2, 25 °C, 75 %rH
3) Hydrogen sulfide (H2S) test IEC 60068-2-43 Kd: 96 h at 12 ppm H2S, 25 °C, 75 %rH
SOLDERLESS COMPLIANT PRESS-FIT CHARACTERISTICS:
PRESS-FIT CHARACTERISTICS MEASURED ACC. TO IEC 60352-5
- Press-in force: 90 N max. (at min. hole dia.) / 65 N typ.
- Push-out force: 30 N min. (at max. hole dia.) / 50 N typ.
- Push-out 3rd cycle: 20 N min. (at max. hole dia.)
PCB HOLE DIMENSIONS
- 2.54 mm grid: Finished hole Ø: 1 + 0.09/-0.06 mm | Drilled hole Ø: 1.15 ± 0.02 mm
PHONE
PRECI-DIP SA
Rue Saint-Henri 11 P.P.Box 834 CH-2800 Delémont / Switzerland
+41 (0)32 421 04 00
FAX
+41 (0)32 421 04 01
E-MAIL
sales@precidip.com www.precidip.com
- Interstitial grid: Finished hole Ø: 0.7 + 0.09/-0.06 mm | Drilled hole Ø: 0.8 ± 0.02 mm
PCB HOLE PLATING
- PCB surface finish: Hole plating
- Tin: 5-15 µm tin over min. 25 µm copper
- Copper: min. 25 µm copper
- Gold over nickel: 0.05-0.2 µm gold over 2.5-5 µm nickel over min. 25 µm copper
PHONE
PRECI-DIP SA
Rue Saint-Henri 11 P.P.Box 834 CH-2800 Delémont / Switzerland
+41 (0)32 421 04 00
FAX
+41 (0)32 421 04 01
E-MAIL
sales@precidip.com www.precidip.com
嵌入式系统
