J-K Flip-Flop, LS Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, CQCC20, CERAMIC, LCC-20
厂商名称:Fairchild
厂商官网:http://www.fairchildsemi.com/
下载文档型号 | 54LS112LMQB | 54LS112DMQB | DM54LS112AJ | DM54LS112AW | 54LS112FMQB | DM74LS112AM |
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描述 | J-K Flip-Flop, LS Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, CQCC20, CERAMIC, LCC-20 | J-K Flip-Flop, LS Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, CDIP16, CERAMIC, DIP-16 | J-K Flip-Flop, LS Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, CDIP16, CERAMIC, DIP-16 | J-K Flip-Flop, LS Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, CDFP16, CERAMIC, FP-16 | J-K Flip-Flop, LS Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, CDFP16, CERAMIC, FP-16 | J-K Flip-Flop, LS Series, 2-Func, Negative Edge Triggered, 2-Bit, Complementary Output, TTL, PDSO16, PLASTIC, SOP-16 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | QLCC | DIP | DIP | DFP | DFP | SOIC |
包装说明 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 | CERAMIC, DIP-16 | CERAMIC, FP-16 | DFP, FL16,.3 | PLASTIC, SOP-16 |
针数 | 20 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknow | unknow | unknown | unknown | unknown | unknown |
系列 | LS | LS | LS | LS | LS | LS |
JESD-30 代码 | S-CQCC-N20 | R-GDIP-T16 | R-GDIP-T16 | R-GDFP-F16 | R-GDFP-F16 | R-PDSO-G16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 8.89 mm | 19.304 mm | 19.304 mm | 9.6645 mm | 9.6645 mm | 9.9 mm |
逻辑集成电路类型 | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP |
最大I(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.008 A |
位数 | 2 | 2 | 2 | 2 | 2 | 2 |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装代码 | QCCN | DIP | DIP | DFP | DFP | SOP |
封装等效代码 | LCC20,.35SQ | DIP16,.3 | DIP16,.3 | FL16,.3 | FL16,.3 | SOP16,.25 |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | FLATPACK | FLATPACK | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
最大电源电流(ICC) | 6 mA | 6 mA | 6 mA | 6 mA | 6 mA | 6 mA |
传播延迟(tpd) | 28 ns | 28 ns | 28 ns | 28 ns | 28 ns | 28 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.905 mm | 5.08 mm | 5.08 mm | 2.032 mm | 2.032 mm | 1.75 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | YES | YES | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | GULL WING |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
触发器类型 | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE |
宽度 | 8.89 mm | 7.62 mm | 7.62 mm | 6.604 mm | 6.604 mm | 3.9 mm |
最小 fmax | 30 MHz | 30 MHz | 30 MHz | 30 MHz | 30 MHz | 30 MHz |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
最大频率@ Nom-Sup | - | - | 25000000 Hz | 25000000 Hz | 25000000 Hz | 25000000 Hz |