5962-01-019-6176,5962-01-019-6176 pdf中文资料,5962-01-019-6176引脚图,5962-01-019-6176电路-Datasheet-电子工程世界

器件参数

参数名称

属性值

是否Rohs认证

不符合

厂商名称

AMD(超微)

包装说明

DIP, DIP16,.3

Reach Compliance Code

compliant

ECCN代码

EAR99

差分输出

YES

驱动器位数

高电平输入电流最大值

0.00004 A

JESD-30 代码

R-XDIP-T16

端子数量

最高工作温度

125 °C

最低工作温度

-55 °C

最小输出摆幅

2 V

输出特性

3-STATE

封装主体材料

CERAMIC

封装代码

DIP

封装等效代码

DIP16,.3

封装形状

RECTANGULAR

封装形式

IN-LINE

电源

5 V

认证状态

Not Qualified

最大接收延迟

筛选级别

MIL-STD-883 Class B (Modified)

标称供电电压

5 V

表面贴装

技术

BIPOLAR

温度等级

MILITARY

端子形式

THROUGH-HOLE

端子节距

2.54 mm

端子位置

DUAL

最大传输延迟

25 ns

参数对比

与5962-01-019-6176相近的元器件有：DM8832NT、DM8832NB、DM8832NTB、DM8832JTB、DM8832JB、DM7832JB、DM7832WB。描述及对比如下：

型号	5962-01-019-6176	DM8832NT	DM8832NB	DM8832NTB	DM8832JTB	DM8832JB	DM7832JB	DM7832WB
描述	Line Driver/Receiver, 2 Driver, BIPolar, CDIP16	Line Driver/Receiver, 2 Driver, BIPolar, PDIP16	Line Driver/Receiver, 2 Driver, BIPolar, PDIP16	Line Driver/Receiver, 2 Driver, BIPolar, PDIP16	Line Driver/Receiver, 2 Driver, BIPolar, CDIP16	Line Driver/Receiver, 2 Driver, BIPolar, CDIP16	Line Driver/Receiver, 2 Driver, BIPolar, CDIP16	Line Driver/Receiver, 2 Driver, BIPolar, CDFP16
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)
包装说明	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL16,.3
Reach Compliance Code	compliant	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
差分输出	YES	YES	YES	YES	YES	YES	YES	YES
驱动器位数	2	2	2	2	2	2	2	2
高电平输入电流最大值	0.00004 A	0.00004 A	0.00004 A	0.00004 A	0.00004 A	0.00004 A	0.00004 A	0.00004 A
JESD-30 代码	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-XDFP-F16
端子数量	16	16	16	16	16	16	16	16
最高工作温度	125 °C	70 °C	70 °C	70 °C	70 °C	70 °C	125 °C	125 °C
最小输出摆幅	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC
封装代码	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DFP
封装等效代码	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	FL16,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK
电源	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
标称供电电压	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	NO	NO	NO	NO	NO	NO	YES
技术	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
温度等级	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY
端子形式	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT
端子节距	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
最大传输延迟	25 ns	25 ns	25 ns	25 ns	25 ns	25 ns	25 ns	25 ns
JESD-609代码	-	e0	e0	e0	e0	e0	e0	e0
端子面层	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)